TWD175115S - Wafer support claws for wafer boat (2) - Google Patents

Wafer support claws for wafer boat (2)

Info

Publication number
TWD175115S
TWD175115S TW104302640F TW104302640F TWD175115S TW D175115 S TWD175115 S TW D175115S TW 104302640 F TW104302640 F TW 104302640F TW 104302640 F TW104302640 F TW 104302640F TW D175115 S TWD175115 S TW D175115S
Authority
TW
Taiwan
Prior art keywords
view
design
parts
wafer
enlarged
Prior art date
Application number
TW104302640F
Other languages
Chinese (zh)
Inventor
Yoshinori Kusakabe
Masami Oikawa
Original Assignee
東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東京威力科創股份有限公司 filed Critical 東京威力科創股份有限公司
Publication of TWD175115S publication Critical patent/TWD175115S/en

Links

Abstract

【物品用途】;如表示使用狀態之參考立體圖所示般，本物品係在半導體製造之成膜過程中，用以層積複數片晶圓，並設置於成膜裝置內者。另外，表示使用狀態之參考立體圖為了說明的便利，係僅記載2片晶圓。又，作為部分設計所欲主張之部分係用以支撐晶圓端部之爪，會如表示使用狀態之參考放大圖所示般來支撐晶圓。;【設計說明】;以實線所表示之部分係部分設計所欲主張之部分，以虛線所表示之部分係部分設計所不欲主張之部分。;包含有「從右斜上方來觀看實線部分之放大立體圖」及「從左斜下方來觀看實線部分之放大立體圖」以及「A-B部分放大圖」、「C-C線剖面圖」及「D-D線剖面圖」係特定出部分設計所欲主張之部分。;一點鏈線係僅表示部分設計所欲主張之部分與其他部分之邊界的線。;由於「仰視圖」係與「俯視圖」對稱，故省略。;由於「右側視圖」以及「後視圖」並未顯示部分設計所欲主張之部分，故省略。[Use of the article]: As shown in the reference perspective view showing the usage state, this article is used to stack a plurality of wafers during the film forming process of semiconductor manufacturing and is installed in a film forming device. In addition, the reference perspective view showing the usage state shows only two wafers for the convenience of explanation. In addition, as a part of the design, the claws for supporting the end of the wafer support the wafer as shown in the reference enlarged view showing the use state. ;[Design Description];The parts represented by the solid lines are the parts that the partial design intends to claim, and the parts represented by the dotted lines are the parts that the partial design does not intend to claim. ;Includes "an enlarged three-dimensional view of the solid line portion viewed diagonally from the upper right side" and "an enlarged three-dimensional view of the solid line portion viewed diagonally from the lower left side", as well as "enlarged view of the A-B portion", "C-C line sectional view" and "D-D line "Cross-section drawing" is a part that specifies the desired part of the design. ;A one-point chain line is a line that only represents the boundary between the part that is intended to be part of the design and other parts. ; Since the "bottom view" is symmetrical with the "top view", it is omitted. ; Since the "right side view" and "rear view" do not show some of the intended parts of the design, they are omitted.

TW104302640F 2014-11-20 2015-05-18 Wafer support claws for wafer boat (2) TWD175115S (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2014-25968F JP1537313S (en) 2014-11-20 2014-11-20

Publications (1)

Publication Number Publication Date
TWD175115S true TWD175115S (en) 2016-04-21

Family

ID=54398946

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104302640F TWD175115S (en) 2014-11-20 2015-05-18 Wafer support claws for wafer boat (2)

Country Status (3)

Country Link
US (1) USD772183S1 (en)
JP (1) JP1537313S (en)
TW (1) TWD175115S (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1638282S (en) * 2018-09-20 2019-08-05
KR102552458B1 (en) * 2019-07-31 2023-07-06 가부시키가이샤 코쿠사이 엘렉트릭 Substrate processing apparatus, substrate support, and method of manufacturing semiconductor device
JP1665228S (en) * 2019-11-28 2020-08-03
JP1678278S (en) * 2020-03-19 2021-02-01 Boat for substrate processing equipment

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TWD163542S (en) * 2013-03-22 2014-10-11 日立國際電氣股份有限公司 Wafer boat for substrate processing equipment
TWD166332S (en) * 2013-03-22 2015-03-01 日立國際電氣股份有限公司 Part of the wafer boat for substrate processing equipment
TWD168827S (en) * 2013-07-29 2015-07-01 日立國際電氣股份有限公司 Wafer boats for semiconductor manufacturing equipment
TWD167988S (en) * 2013-07-29 2015-05-21 日立國際電氣股份有限公司 Wafer boats for semiconductor manufacturing equipment
TWD165429S (en) * 2013-07-29 2015-01-11 日立國際電氣股份有限公司 Wafer boats for semiconductor manufacturing equipment

Also Published As

Publication number Publication date
JP1537313S (en) 2015-11-09
USD772183S1 (en) 2016-11-22

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