TWD171960S - Part of the simulated wafer (1) - Google Patents

Part of the simulated wafer (1)

Info

Publication number
TWD171960S
TWD171960S TW104302464F TW104302464F TWD171960S TW D171960 S TWD171960 S TW D171960S TW 104302464 F TW104302464 F TW 104302464F TW 104302464 F TW104302464 F TW 104302464F TW D171960 S TWD171960 S TW D171960S
Authority
TW
Taiwan
Prior art keywords
design
view
film forming
parts
forming device
Prior art date
Application number
TW104302464F
Other languages
Chinese (zh)
Inventor
Yutaka Motoyama
Kohei Fukushima
Original Assignee
東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東京威力科創股份有限公司 filed Critical 東京威力科創股份有限公司
Publication of TWD171960S publication Critical patent/TWD171960S/en

Links

Abstract

【物品用途】;本設計之物品係一種在半導體製造之成膜過程中，為了壓低成膜裝置內之製品晶圓的成膜量差異而適合吸附成膜裝置內之上下部分氣體所使用者。具體而言，如顯示使用狀態之參考圖所示，本設計之物品係以將積層於成膜裝置內之複數製品晶圓加以夾持的方式積層於上下部來使用。欲取得部分設計專利的部分具有放大仿真晶圓表面積、增加仿真晶圓氣體吸附量的用途與機能。;【設計說明】;本設計係主張以實線所表示之部分作為部分設計，包含A-B部分放大俯視圖以及C-C剖面圖係對於欲取得部分設計專利之部分加以特定。一點鏈線僅為顯示欲取得部分設計專利之部分與其他部分之交界的線。右側視圖因與前視圖相同故予以省略。後視圖、左側視圖以及仰視圖由於未顯示欲取得部分設計專利之部分故予以省略。此外，圖式中以虛線表示之部分，為本設計所不主張之部分。又，本設計不主張色彩。[Use of the article] The article designed in this design is suitable for adsorbing the gas in the upper and lower parts of the film forming device in order to reduce the difference in film formation amount of the product wafer in the film forming device during the film forming process of semiconductor manufacturing. Specifically, as shown in the reference diagram showing the usage state, the article of this design is used by stacking a plurality of product wafers stacked in the film forming device on the upper and lower parts so as to be clamped. The part to be patented has the purpose and function of enlarging the surface area of the simulated wafer and increasing the gas adsorption capacity of the simulated wafer. ;[Design Description];This design advocates using the part indicated by the solid line as the partial design, including the enlarged top view of the A-B part and the C-C cross-sectional view to specify the part for which the partial design patent is to be obtained. The one-point chain line is only a line showing the boundary between the part where a partial design patent is to be obtained and other parts. The right side view is omitted because it is the same as the front view. The rear view, left side view and bottom view are omitted because they do not show the parts for which partial design patents are to be obtained. In addition, the parts indicated by dotted lines in the drawings are not recommended by this design. Also, this design does not advocate color.

TW104302464F 2014-11-13 2015-05-11 Part of the simulated wafer (1) TWD171960S (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2014-25306F JP1534136S (en) 2014-11-13 2014-11-13

Publications (1)

Publication Number Publication Date
TWD171960S true TWD171960S (en) 2015-11-21

Family

ID=54206978

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104302464F TWD171960S (en) 2014-11-13 2015-05-11 Part of the simulated wafer (1)

Country Status (3)

Country Link
US (1) USD784937S1 (en)
JP (1) JP1534136S (en)
TW (1) TWD171960S (en)

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USD897974S1 (en) 2018-03-29 2020-10-06 Hamamatsu Photonics K.K. Semiconductor wafer

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD897974S1 (en) 2018-03-29 2020-10-06 Hamamatsu Photonics K.K. Semiconductor wafer

Also Published As

Publication number Publication date
JP1534136S (en) 2015-09-28
USD784937S1 (en) 2017-04-25

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