TWD171961S

TWD171961S - Part of the simulated wafer (2)

Info

Publication number: TWD171961S
Application number: TW104302465F
Authority: TW
Inventors: Yutaka Motoyama; Kohei Fukushima
Original assignee: 東京威力科創股份有限公司; Tokyo Electron Ltd
Priority date: 2014-11-13
Filing date: 2015-05-11
Publication date: 2015-11-21
Also published as: JP1534137S; USD786810S1

Abstract

【物品用途】;本物品係在半導體製造之成膜過程中，為了抑制成膜裝置內之製品晶圓的成膜量偏差，而用以適當吸附成膜裝置內之上下部分的氣體所使用者。具體而言，如表示使用狀態之參考圖所示，本物品係以夾置積層於成膜裝置內的複數製品晶圓之方式來上下部地積層而加以使用。作為部分設計所欲主張的部分係具有大於仿真晶圓的表面積，並使得仿真晶圓之氣體吸附量變多的用途及機能。;【設計說明】;以實線所表示之部分係部分設計所欲主張之部分，包含以「A-B部分放大俯視圖」、「C-C線剖面圖」以及「D-D線剖面圖」來特定出部分設計所欲主張之部分。;由於「右側視圖」係與「前視圖」相同，故省略。;由於「後視圖」、「左側視圖」以及「仰視圖」並未顯示部分設計所欲主張之部分，故省略。;本案中「使用狀態參考圖」之色彩部分為不主張之部分。[Use of article]; This article is used to properly absorb the gas in the upper and lower parts of the film-forming device in order to suppress the deviation of the film-forming amount of the product wafer in the film-forming device during the film-forming process of semiconductor manufacturing. . Specifically, as shown in the reference figure showing the state of use, this product is used by laminating a plurality of product wafers stacked in a film forming apparatus so as to sandwich the upper and lower parts thereof. The part proposed as part design is to have a larger surface area than the dummy wafer and to increase the amount of gas adsorption of the dummy wafer. ;[Design Description];The part represented by the solid line is the part that the partial design intends to advocate, including the "A-B part enlarged top view", "C-C line sectional view" and "D-D line sectional view" to specify part of the design. The part you want to advocate. ; Since the "right side view" is the same as the "front view", it is omitted. ; Since the "rear view", "left view" and "bottom view" do not show some of the intended parts of the design, they are omitted. ; In this case, the color part of the "Used Condition Reference Picture" is not advocated.