Claims (6)
一種晶片承架，主要為：本體，具有一體成型而相互交叉之複數第一框條及複數第二框條，各該第一框條及各該第二框條間係圍設形成一中空部，該本體具有一第一面及一第二面，該本體之各第一框條及各第二框條於第一面及第二面均成型有複數用以供晶片置放之支撐架，使該晶片跨置放於二第一框條及二第二框條間。A wafer carrier is mainly a body having a plurality of first frame strips and a plurality of second frame strips integrally formed and intersecting each other, and each of the first frame strips and each of the second frame strips is surrounded by a hollow portion. The first frame and the second frame of the body are formed with a plurality of support frames for the wafer to be placed on the first surface and the second surface. The wafer is placed across the first frame and the second frame.
如申請專利範圍第1項所述之晶片承架，其中，該本體之各第一框條及各第二框條於第一面及第二面均成型有複數擋牆，該擋牆係用以供晶片限位。The wafer carrier of claim 1, wherein each of the first frame and the second frame of the body is formed with a plurality of retaining walls on the first side and the second side, and the retaining wall is used For chip limit.
一種晶片承架，主要為：本體，具有一體成型而相互交叉之複數第一框條及複數第二框條，各該第一框條及各該第二框條間係圍設形成一中空部，該本體具有一第一面及一第二面，且該本體之各第一框條及各第二框條於第一面成型有複數支撐架及複數擋牆，該支撐架利用以供晶片置放，使該晶片跨置放於二第一框條及二第二框條間，該擋牆係用以供晶片限位。A wafer carrier is mainly a body having a plurality of first frame strips and a plurality of second frame strips integrally formed and intersecting each other, and each of the first frame strips and each of the second frame strips is surrounded by a hollow portion. The first frame and the second surface of the body have a plurality of support frames and a plurality of retaining walls formed on the first surface of the first frame and the second frame. The support frame is used for the wafer. The wafer is placed across the first frame and the second frame, and the barrier is used to limit the wafer.
如申請專利範圍第2項至第3項中任一項所述之晶片承架，其中，該支撐架係自該第一框條及該第二框條往中空部之方向凸伸出，該擋牆係自該第一框條及該第二框條往遠離該第一面及第二面之方向延伸成型。The wafer carrier of any one of the preceding claims, wherein the support frame protrudes from the first frame strip and the second frame strip toward the hollow portion, The retaining wall is formed by extending from the first frame strip and the second frame strip away from the first surface and the second surface.
如申請專利範圍第1項至第3項中任一項所述之晶片承架，其中，該本體之第一框條及第二框條於第一面上係形成一斜切面。The wafer carrier according to any one of the preceding claims, wherein the first frame strip and the second frame strip of the body form a chamfered surface on the first surface.
如申請專利範圍第5項所述之晶片承架，其中，該斜切面於第一框條及第二框條之中心軸為最高點，而往兩側則斜下傾斜。The wafer carrier of claim 5, wherein the chamfered surface is at a highest point on a central axis of the first frame and the second frame, and obliquely downwardly on both sides.