TW588566B - Method for preparing display panel - Google Patents
Method for preparing display panel Download PDFInfo
- Publication number
- TW588566B TW588566B TW091112759A TW91112759A TW588566B TW 588566 B TW588566 B TW 588566B TW 091112759 A TW091112759 A TW 091112759A TW 91112759 A TW91112759 A TW 91112759A TW 588566 B TW588566 B TW 588566B
- Authority
- TW
- Taiwan
- Prior art keywords
- pressure
- adhesive
- display
- display panel
- manufacturing
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 46
- 239000000758 substrate Substances 0.000 claims abstract description 131
- 239000000853 adhesive Substances 0.000 claims abstract description 118
- 230000001070 adhesive effect Effects 0.000 claims abstract description 109
- 238000007789 sealing Methods 0.000 claims abstract description 73
- 238000004519 manufacturing process Methods 0.000 claims description 59
- 230000008859 change Effects 0.000 claims description 50
- 229920005989 resin Polymers 0.000 claims description 17
- 239000011347 resin Substances 0.000 claims description 17
- 238000010438 heat treatment Methods 0.000 claims description 6
- 230000008569 process Effects 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 2
- 230000014759 maintenance of location Effects 0.000 claims description 2
- 239000011521 glass Substances 0.000 abstract description 53
- 239000005394 sealing glass Substances 0.000 abstract description 40
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 abstract description 16
- 229910001873 dinitrogen Inorganic materials 0.000 abstract description 8
- 238000010030 laminating Methods 0.000 abstract description 2
- 238000005401 electroluminescence Methods 0.000 abstract 3
- 239000010410 layer Substances 0.000 description 53
- 239000010408 film Substances 0.000 description 26
- 239000007789 gas Substances 0.000 description 14
- 230000009471 action Effects 0.000 description 12
- 239000003990 capacitor Substances 0.000 description 10
- 238000010586 diagram Methods 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 239000003822 epoxy resin Substances 0.000 description 7
- 229920000647 polyepoxide Polymers 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 125000002091 cationic group Chemical group 0.000 description 5
- 238000001723 curing Methods 0.000 description 5
- 125000006850 spacer group Chemical group 0.000 description 5
- 239000011651 chromium Substances 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 230000005525 hole transport Effects 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 3
- -1 naphthalene-l-yl Chemical group 0.000 description 3
- 230000035699 permeability Effects 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- TVIVIEFSHFOWTE-UHFFFAOYSA-K tri(quinolin-8-yloxy)alumane Chemical compound [Al+3].C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1 TVIVIEFSHFOWTE-UHFFFAOYSA-K 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 238000003848 UV Light-Curing Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- ZYGHJZDHTFUPRJ-UHFFFAOYSA-N coumarin Chemical compound C1=CC=C2OC(=O)C=CC2=C1 ZYGHJZDHTFUPRJ-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000002542 deteriorative effect Effects 0.000 description 2
- 239000003230 hygroscopic agent Substances 0.000 description 2
- 239000007943 implant Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- PQXKHYXIUOZZFA-UHFFFAOYSA-M lithium fluoride Chemical compound [Li+].[F-] PQXKHYXIUOZZFA-UHFFFAOYSA-M 0.000 description 2
- 239000008267 milk Substances 0.000 description 2
- 210000004080 milk Anatomy 0.000 description 2
- 235000013336 milk Nutrition 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- HXWWMGJBPGRWRS-CMDGGOBGSA-N 4- -2-tert-butyl-6- -4h-pyran Chemical compound O1C(C(C)(C)C)=CC(=C(C#N)C#N)C=C1\C=C\C1=CC(C(CCN2CCC3(C)C)(C)C)=C2C3=C1 HXWWMGJBPGRWRS-CMDGGOBGSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 241001247414 Couma Species 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- 101100289061 Drosophila melanogaster lili gene Proteins 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 101100208473 Neurospora crassa (strain ATCC 24698 / 74-OR23-1A / CBS 708.71 / DSM 1257 / FGSC 987) lcm-2 gene Proteins 0.000 description 1
- 229910052778 Plutonium Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- YZCKVEUIGOORGS-NJFSPNSNSA-N Tritium Chemical compound [3H] YZCKVEUIGOORGS-NJFSPNSNSA-N 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- UFVXQDWNSAGPHN-UHFFFAOYSA-K bis[(2-methylquinolin-8-yl)oxy]-(4-phenylphenoxy)alumane Chemical compound [Al+3].C1=CC=C([O-])C2=NC(C)=CC=C21.C1=CC=C([O-])C2=NC(C)=CC=C21.C1=CC([O-])=CC=C1C1=CC=CC=C1 UFVXQDWNSAGPHN-UHFFFAOYSA-K 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 229960000956 coumarin Drugs 0.000 description 1
- 235000001671 coumarin Nutrition 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 150000002829 nitrogen Chemical class 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 125000000864 peroxy group Chemical group O(O*)* 0.000 description 1
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 description 1
- CSHWQDPOILHKBI-UHFFFAOYSA-N peryrene Natural products C1=CC(C2=CC=CC=3C2=C2C=CC=3)=C3C2=CC=CC3=C1 CSHWQDPOILHKBI-UHFFFAOYSA-N 0.000 description 1
- OYEHPCDNVJXUIW-UHFFFAOYSA-N plutonium atom Chemical compound [Pu] OYEHPCDNVJXUIW-UHFFFAOYSA-N 0.000 description 1
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920002098 polyfluorene Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229910052722 tritium Inorganic materials 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Optics & Photonics (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001198921A JP2003015552A (ja) | 2001-06-29 | 2001-06-29 | 表示用パネルの製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW588566B true TW588566B (en) | 2004-05-21 |
Family
ID=19036278
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW091112759A TW588566B (en) | 2001-06-29 | 2002-06-12 | Method for preparing display panel |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7106409B2 (2) |
| JP (1) | JP2003015552A (2) |
| KR (1) | KR100521285B1 (2) |
| CN (1) | CN1184521C (2) |
| TW (1) | TW588566B (2) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4614588B2 (ja) | 2001-06-29 | 2011-01-19 | 三洋電機株式会社 | エレクトロルミネッセンス表示装置の製造方法 |
| JP4894987B2 (ja) * | 2001-06-29 | 2012-03-14 | 三洋電機株式会社 | 表示用パネルの製造方法 |
| KR100477745B1 (ko) * | 2002-05-23 | 2005-03-18 | 삼성에스디아이 주식회사 | 유기 전계발광 소자의 봉지방법 및 이를 이용하는 유기전계발광 패널 |
| JP2004119281A (ja) * | 2002-09-27 | 2004-04-15 | Nippon Sheet Glass Co Ltd | Ｅｌ素子用封止板多面取り用マザーガラス基板、及びｅｌ素子用ガラス基板多面取り用マザーガラス基板 |
| JP2004133035A (ja) * | 2002-10-08 | 2004-04-30 | Nippon Sheet Glass Co Ltd | ガラス板のアライメントマーク形成法、及び該形成法により形成されたアライメントマーク |
| KR20040070976A (ko) * | 2003-02-05 | 2004-08-11 | 주식회사 엘리아테크 | 스티커형 봉지필름을 사용한 유기 전계발광 표시 패널 및그 제조방법 |
| KR100934153B1 (ko) * | 2003-04-03 | 2009-12-29 | 주식회사 동진쎄미켐 | 유기 전기발광 소자의 캡 상의 접착제층 형성방법 및 이를적용한 유기 전기발광 소자의 제조방법 |
| KR100688830B1 (ko) * | 2005-09-20 | 2007-03-02 | 삼성에스디아이 주식회사 | 유기 발광 표시소자의 제조 방법 및 그 제조 장치 |
| KR100839964B1 (ko) * | 2006-11-01 | 2008-06-19 | (주)유니젯 | 평판 디스플레이 장치 |
| KR101362135B1 (ko) | 2006-12-29 | 2014-02-12 | 엘지디스플레이 주식회사 | 발광 표시장치의 제조장치 및 제조방법 |
| DE102007031428A1 (de) * | 2007-07-05 | 2008-12-24 | Schott Ag | Verfahren zur Herstellung von Kavitäten für integrierte elektronische Schaltungen und verfahrensgemäß herstellbare Erzeugnisse |
| JP2010107935A (ja) * | 2008-10-28 | 2010-05-13 | Samsung Mobile Display Co Ltd | 平板表示装置及びその製造方法 |
| JP5260395B2 (ja) * | 2009-04-14 | 2013-08-14 | 常陽工学株式会社 | 封止装置 |
| TW201114317A (en) * | 2009-10-07 | 2011-04-16 | Au Optronics Corp | Organic electro-luminescent device and packaging process thereof |
| CN102478727B (zh) * | 2010-11-28 | 2016-04-06 | 宸鸿科技(厦门)有限公司 | 触控显示装置的制造方法与显示装置、触控显示装置 |
| US20120201971A1 (en) * | 2011-02-07 | 2012-08-09 | Dmk Co., Ltd. | Method of coalescing transparent substrate and display device and dam pattern forming apparatus |
| KR101441452B1 (ko) * | 2013-05-21 | 2014-11-03 | 박웅기 | 전자부품용 패널의 접착 장치 |
| CN104020614B (zh) * | 2014-05-29 | 2017-03-08 | 合肥鑫晟光电科技有限公司 | 液晶填充装置及应用其的液晶面板制造设备 |
| CN104821377B (zh) | 2015-05-05 | 2017-07-21 | 合肥京东方光电科技有限公司 | 贴片封装装置及方法 |
| CN106293170A (zh) * | 2015-05-18 | 2017-01-04 | 中兴通讯股份有限公司 | 显示面板、电子设备及应用于电子设备的触控感应方法 |
| WO2020127138A1 (en) * | 2018-12-18 | 2020-06-25 | Merck Patent Gmbh | Glazing comprising a switchable device, laminated structure and method for manufacturing of a glazing |
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| JP2001155855A (ja) | 1999-11-24 | 2001-06-08 | Toyota Motor Corp | 有機ｅｌ素子の封止方法 |
| TW452952B (en) | 2000-03-30 | 2001-09-01 | Delta Optoelectronics Inc | Packaging method of electro-luminescent device |
| JP4112779B2 (ja) * | 2000-05-31 | 2008-07-02 | 三星エスディアイ株式会社 | 有機ｅｌ素子の製造方法 |
| KR100759973B1 (ko) * | 2001-02-06 | 2007-09-18 | 삼성전자주식회사 | 액정 표시 장치의 제조 방법 |
| KR100480819B1 (ko) * | 2002-03-20 | 2005-04-06 | 엘지.필립스 엘시디 주식회사 | 합착기 챔버의 크리닝 방법 |
-
2001
- 2001-06-29 JP JP2001198921A patent/JP2003015552A/ja not_active Withdrawn
-
2002
- 2002-06-12 TW TW091112759A patent/TW588566B/zh not_active IP Right Cessation
- 2002-06-27 US US10/183,252 patent/US7106409B2/en not_active Expired - Lifetime
- 2002-06-28 CN CNB021251649A patent/CN1184521C/zh not_active Expired - Fee Related
- 2002-06-28 KR KR10-2002-0036798A patent/KR100521285B1/ko not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| KR100521285B1 (ko) | 2005-10-17 |
| CN1184521C (zh) | 2005-01-12 |
| US7106409B2 (en) | 2006-09-12 |
| KR20030003073A (ko) | 2003-01-09 |
| US20030011737A1 (en) | 2003-01-16 |
| JP2003015552A (ja) | 2003-01-17 |
| CN1395134A (zh) | 2003-02-05 |
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| MM4A | Annulment or lapse of patent due to non-payment of fees |