TW583718B - Thin wafer insert - Google Patents
Thin wafer insert Download PDFInfo
- Publication number
- TW583718B TW583718B TW091106491A TW91106491A TW583718B TW 583718 B TW583718 B TW 583718B TW 091106491 A TW091106491 A TW 091106491A TW 91106491 A TW91106491 A TW 91106491A TW 583718 B TW583718 B TW 583718B
- Authority
- TW
- Taiwan
- Prior art keywords
- wafer
- rack
- pair
- carrier
- slots
- Prior art date
Links
- 238000003780 insertion Methods 0.000 claims abstract description 48
- 230000037431 insertion Effects 0.000 claims abstract description 48
- 238000000034 method Methods 0.000 claims abstract description 8
- 230000003014 reinforcing effect Effects 0.000 claims description 7
- 239000013078 crystal Substances 0.000 claims description 3
- 238000000605 extraction Methods 0.000 claims description 3
- 239000002023 wood Substances 0.000 claims description 3
- PCTMTFRHKVHKIS-BMFZQQSSSA-N (1s,3r,4e,6e,8e,10e,12e,14e,16e,18s,19r,20r,21s,25r,27r,30r,31r,33s,35r,37s,38r)-3-[(2r,3s,4s,5s,6r)-4-amino-3,5-dihydroxy-6-methyloxan-2-yl]oxy-19,25,27,30,31,33,35,37-octahydroxy-18,20,21-trimethyl-23-oxo-22,39-dioxabicyclo[33.3.1]nonatriaconta-4,6,8,10 Chemical compound C1C=C2C[C@@H](OS(O)(=O)=O)CC[C@]2(C)[C@@H]2[C@@H]1[C@@H]1CC[C@H]([C@H](C)CCCC(C)C)[C@@]1(C)CC2.O[C@H]1[C@@H](N)[C@H](O)[C@@H](C)O[C@H]1O[C@H]1/C=C/C=C/C=C/C=C/C=C/C=C/C=C/[C@H](C)[C@@H](O)[C@@H](C)[C@H](C)OC(=O)C[C@H](O)C[C@H](O)CC[C@@H](O)[C@H](O)C[C@H](O)C[C@](O)(C[C@H](O)[C@H]2C(O)=O)O[C@H]2C1 PCTMTFRHKVHKIS-BMFZQQSSSA-N 0.000 claims 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims 1
- 206010011469 Crying Diseases 0.000 claims 1
- 229910052804 chromium Inorganic materials 0.000 claims 1
- 239000011651 chromium Substances 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 abstract description 135
- 239000000969 carrier Substances 0.000 abstract description 6
- 239000004033 plastic Substances 0.000 abstract description 6
- 230000002093 peripheral effect Effects 0.000 abstract description 2
- 238000005728 strengthening Methods 0.000 abstract 1
- 238000012545 processing Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 241000219112 Cucumis Species 0.000 description 1
- 235000015510 Cucumis melo subsp melo Nutrition 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67383—Closed carriers characterised by substrate supports
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S206/00—Special receptacle or package
- Y10S206/832—Semiconductor wafer boat
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Packaging Frangible Articles (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US28077401P | 2001-04-01 | 2001-04-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW583718B true TW583718B (en) | 2004-04-11 |
Family
ID=23074580
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW091106491A TW583718B (en) | 2001-04-01 | 2002-04-01 | Thin wafer insert |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US7219802B2 (enExample) |
| EP (1) | EP1373099A4 (enExample) |
| JP (1) | JP4296296B2 (enExample) |
| KR (1) | KR100876626B1 (enExample) |
| CN (1) | CN1313329C (enExample) |
| TW (1) | TW583718B (enExample) |
| WO (1) | WO2002079053A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI746014B (zh) * | 2020-06-16 | 2021-11-11 | 大立鈺科技有限公司 | 晶圓存取總成及其晶圓存取裝置與晶圓載具 |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1373099A4 (en) * | 2001-04-01 | 2008-05-28 | Entegris Inc | FINE PLATE INSERT |
| CN101253614B (zh) * | 2005-07-08 | 2011-02-02 | 埃塞斯特科技有限公司 | 工件支撑结构及其使用设备 |
| WO2008111973A1 (en) * | 2007-03-12 | 2008-09-18 | New Objective, Inc. | Packaging, shipping and storage device for capillary tubes |
| US20080237157A1 (en) * | 2007-03-30 | 2008-10-02 | Chee Keong Chin | Wafer transport system |
| WO2009038244A2 (en) * | 2007-09-21 | 2009-03-26 | Visionsemicon.Co.Ltd | Magazine for depositing substrates |
| ITMO20100195A1 (it) * | 2010-06-29 | 2011-12-30 | Emil Liviu Stefan | Supporto diviso per oggetti sottili. |
| JP5541726B2 (ja) * | 2010-11-08 | 2014-07-09 | 信越ポリマー株式会社 | 基板収納容器 |
| JP5601647B2 (ja) * | 2011-03-17 | 2014-10-08 | 信越ポリマー株式会社 | 基板収納容器及びサポート治具 |
| JP5767096B2 (ja) * | 2011-12-08 | 2015-08-19 | 信越ポリマー株式会社 | 薄板収納容器 |
| US9099514B2 (en) * | 2012-03-21 | 2015-08-04 | Taiwan Semiconductor Manufacturing Company, Ltd. | Wafer holder with tapered region |
| TWI610864B (zh) * | 2012-11-20 | 2018-01-11 | 恩特葛瑞斯股份有限公司 | 具有清洗埠的基板收納盒 |
| US9117863B1 (en) * | 2013-05-16 | 2015-08-25 | Seagate Technology Llc | Cassette configurations to support platters having different diameters |
| DE102016113924B4 (de) | 2016-07-28 | 2024-06-13 | Infineon Technologies Ag | Waferbox und Verfahren zum Anordnen von Wafern in einer Waferbox |
| JP6877317B2 (ja) * | 2017-11-10 | 2021-05-26 | 三菱電機株式会社 | ウエハ容器 |
| JP7357453B2 (ja) * | 2019-03-07 | 2023-10-06 | 東京エレクトロン株式会社 | 基板処理システムおよび基板の搬送方法 |
| TWI735115B (zh) * | 2019-12-24 | 2021-08-01 | 力成科技股份有限公司 | 晶圓儲存裝置及晶圓承載盤 |
| US12027397B2 (en) * | 2020-03-23 | 2024-07-02 | Applied Materials, Inc | Enclosure system shelf including alignment features |
| KR102498995B1 (ko) * | 2020-11-30 | 2023-02-13 | 주식회사 삼에스코리아 | 패널 수납용기의 트레이 결합구조 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5097946A (en) * | 1990-04-06 | 1992-03-24 | Emrich Richard A | Storage unit for compact discs and the like |
| US5310339A (en) * | 1990-09-26 | 1994-05-10 | Tokyo Electron Limited | Heat treatment apparatus having a wafer boat |
| ATE152286T1 (de) * | 1992-08-04 | 1997-05-15 | Ibm | Tragbare abdichtbare unter druck stehende behältern zum speichern von halbleiterwafern in einer schützenden gasartigen umgebung |
| JPH0662542U (ja) * | 1993-01-29 | 1994-09-02 | 信越半導体株式会社 | ウエーハカセット |
| US5346518A (en) * | 1993-03-23 | 1994-09-13 | International Business Machines Corporation | Vapor drain system |
| DE59510220D1 (de) * | 1994-03-11 | 2002-07-11 | Cherry Mikroschalter Gmbh | Tastatur |
| US5553711A (en) * | 1995-07-03 | 1996-09-10 | Taiwan Semiconductor Manufacturing Company | Storage container for integrated circuit semiconductor wafers |
| US5505299A (en) * | 1995-07-17 | 1996-04-09 | Opticord, Inc. | Storage case for compact discs |
| KR100428827B1 (ko) * | 1995-10-13 | 2005-04-20 | 엠팍 인코포레이티드 | 측면에도어를구비한300㎜미세환경포드 |
| US5634563A (en) * | 1995-11-28 | 1997-06-03 | Peng; Jung-Ching | CD storage rack |
| US5915562A (en) * | 1996-07-12 | 1999-06-29 | Fluoroware, Inc. | Transport module with latching door |
| TW298337U (en) * | 1996-08-19 | 1997-02-11 | guo-min Gao | Tilting-type stackable CD rack |
| JPH10203584A (ja) | 1997-01-22 | 1998-08-04 | Nec Corp | 基板用カセット |
| US5833062A (en) * | 1997-11-04 | 1998-11-10 | Yeh; Sheng-Fu | Disk organizer |
| KR20000002833A (ko) * | 1998-06-23 | 2000-01-15 | 윤종용 | 반도체 웨이퍼 보트 |
| JP2001281642A (ja) | 2000-03-29 | 2001-10-10 | Matsushita Electric Ind Co Ltd | 液晶表示素子 |
| US6287112B1 (en) * | 2000-03-30 | 2001-09-11 | Asm International, N.V. | Wafer boat |
| EP1373099A4 (en) * | 2001-04-01 | 2008-05-28 | Entegris Inc | FINE PLATE INSERT |
-
2002
- 2002-03-28 EP EP02726676A patent/EP1373099A4/en not_active Withdrawn
- 2002-03-28 KR KR1020037012907A patent/KR100876626B1/ko not_active Expired - Fee Related
- 2002-03-28 CN CNB028078233A patent/CN1313329C/zh not_active Expired - Fee Related
- 2002-03-28 JP JP2002577284A patent/JP4296296B2/ja not_active Expired - Lifetime
- 2002-03-28 US US10/478,587 patent/US7219802B2/en not_active Expired - Lifetime
- 2002-03-28 WO PCT/US2002/009423 patent/WO2002079053A1/en not_active Ceased
- 2002-04-01 TW TW091106491A patent/TW583718B/zh not_active IP Right Cessation
-
2007
- 2007-04-13 US US11/787,082 patent/US8141712B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI746014B (zh) * | 2020-06-16 | 2021-11-11 | 大立鈺科技有限公司 | 晶圓存取總成及其晶圓存取裝置與晶圓載具 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1373099A1 (en) | 2004-01-02 |
| JP4296296B2 (ja) | 2009-07-15 |
| CN1313329C (zh) | 2007-05-02 |
| KR20030090703A (ko) | 2003-11-28 |
| US8141712B2 (en) | 2012-03-27 |
| US20040188320A1 (en) | 2004-09-30 |
| US20070193921A1 (en) | 2007-08-23 |
| EP1373099A4 (en) | 2008-05-28 |
| KR100876626B1 (ko) | 2008-12-31 |
| CN1525930A (zh) | 2004-09-01 |
| JP2004529493A (ja) | 2004-09-24 |
| US7219802B2 (en) | 2007-05-22 |
| WO2002079053A1 (en) | 2002-10-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK4A | Expiration of patent term of an invention patent |