KR100876626B1 - 박형 웨이퍼 인서트 - Google Patents

박형 웨이퍼 인서트 Download PDF

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Publication number
KR100876626B1
KR100876626B1 KR1020037012907A KR20037012907A KR100876626B1 KR 100876626 B1 KR100876626 B1 KR 100876626B1 KR 1020037012907 A KR1020037012907 A KR 1020037012907A KR 20037012907 A KR20037012907 A KR 20037012907A KR 100876626 B1 KR100876626 B1 KR 100876626B1
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KR
South Korea
Prior art keywords
wafer
insert
recesses
pair
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020037012907A
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English (en)
Korean (ko)
Other versions
KR20030090703A (ko
Inventor
위스만브라이언
페터슨마이클
심슨토니
Original Assignee
인티그리스, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 인티그리스, 인코포레이티드 filed Critical 인티그리스, 인코포레이티드
Publication of KR20030090703A publication Critical patent/KR20030090703A/ko
Application granted granted Critical
Publication of KR100876626B1 publication Critical patent/KR100876626B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67383—Closed carriers characterised by substrate supports
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S206/00—Special receptacle or package
    • Y10S206/832—Semiconductor wafer boat

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020037012907A 2001-04-01 2002-03-28 박형 웨이퍼 인서트 Expired - Fee Related KR100876626B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US28077401P 2001-04-01 2001-04-01
US60/280,774 2001-04-01
PCT/US2002/009423 WO2002079053A1 (en) 2001-04-01 2002-03-28 Thin wafer insert

Publications (2)

Publication Number Publication Date
KR20030090703A KR20030090703A (ko) 2003-11-28
KR100876626B1 true KR100876626B1 (ko) 2008-12-31

Family

ID=23074580

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020037012907A Expired - Fee Related KR100876626B1 (ko) 2001-04-01 2002-03-28 박형 웨이퍼 인서트

Country Status (7)

Country Link
US (2) US7219802B2 (enExample)
EP (1) EP1373099A4 (enExample)
JP (1) JP4296296B2 (enExample)
KR (1) KR100876626B1 (enExample)
CN (1) CN1313329C (enExample)
TW (1) TW583718B (enExample)
WO (1) WO2002079053A1 (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1373099A4 (en) * 2001-04-01 2008-05-28 Entegris Inc FINE PLATE INSERT
CN101253614B (zh) * 2005-07-08 2011-02-02 埃塞斯特科技有限公司 工件支撑结构及其使用设备
WO2008111973A1 (en) * 2007-03-12 2008-09-18 New Objective, Inc. Packaging, shipping and storage device for capillary tubes
US20080237157A1 (en) * 2007-03-30 2008-10-02 Chee Keong Chin Wafer transport system
WO2009038244A2 (en) * 2007-09-21 2009-03-26 Visionsemicon.Co.Ltd Magazine for depositing substrates
ITMO20100195A1 (it) * 2010-06-29 2011-12-30 Emil Liviu Stefan Supporto diviso per oggetti sottili.
JP5541726B2 (ja) * 2010-11-08 2014-07-09 信越ポリマー株式会社 基板収納容器
JP5601647B2 (ja) * 2011-03-17 2014-10-08 信越ポリマー株式会社 基板収納容器及びサポート治具
JP5767096B2 (ja) * 2011-12-08 2015-08-19 信越ポリマー株式会社 薄板収納容器
US9099514B2 (en) * 2012-03-21 2015-08-04 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer holder with tapered region
TWI610864B (zh) * 2012-11-20 2018-01-11 恩特葛瑞斯股份有限公司 具有清洗埠的基板收納盒
US9117863B1 (en) * 2013-05-16 2015-08-25 Seagate Technology Llc Cassette configurations to support platters having different diameters
DE102016113924B4 (de) 2016-07-28 2024-06-13 Infineon Technologies Ag Waferbox und Verfahren zum Anordnen von Wafern in einer Waferbox
JP6877317B2 (ja) * 2017-11-10 2021-05-26 三菱電機株式会社 ウエハ容器
JP7357453B2 (ja) * 2019-03-07 2023-10-06 東京エレクトロン株式会社 基板処理システムおよび基板の搬送方法
TWI735115B (zh) * 2019-12-24 2021-08-01 力成科技股份有限公司 晶圓儲存裝置及晶圓承載盤
US12027397B2 (en) * 2020-03-23 2024-07-02 Applied Materials, Inc Enclosure system shelf including alignment features
TWI746014B (zh) * 2020-06-16 2021-11-11 大立鈺科技有限公司 晶圓存取總成及其晶圓存取裝置與晶圓載具
KR102498995B1 (ko) * 2020-11-30 2023-02-13 주식회사 삼에스코리아 패널 수납용기의 트레이 결합구조

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5890598A (en) 1997-01-22 1999-04-06 Nec Corporation Substrate cassette
US6099302A (en) 1998-06-23 2000-08-08 Samsung Electronics Co., Ltd. Semiconductor wafer boat with reduced wafer contact area

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5097946A (en) * 1990-04-06 1992-03-24 Emrich Richard A Storage unit for compact discs and the like
US5310339A (en) * 1990-09-26 1994-05-10 Tokyo Electron Limited Heat treatment apparatus having a wafer boat
ATE152286T1 (de) * 1992-08-04 1997-05-15 Ibm Tragbare abdichtbare unter druck stehende behältern zum speichern von halbleiterwafern in einer schützenden gasartigen umgebung
JPH0662542U (ja) * 1993-01-29 1994-09-02 信越半導体株式会社 ウエーハカセット
US5346518A (en) * 1993-03-23 1994-09-13 International Business Machines Corporation Vapor drain system
DE59510220D1 (de) * 1994-03-11 2002-07-11 Cherry Mikroschalter Gmbh Tastatur
US5553711A (en) * 1995-07-03 1996-09-10 Taiwan Semiconductor Manufacturing Company Storage container for integrated circuit semiconductor wafers
US5505299A (en) * 1995-07-17 1996-04-09 Opticord, Inc. Storage case for compact discs
KR100428827B1 (ko) * 1995-10-13 2005-04-20 엠팍 인코포레이티드 측면에도어를구비한300㎜미세환경포드
US5634563A (en) * 1995-11-28 1997-06-03 Peng; Jung-Ching CD storage rack
US5915562A (en) * 1996-07-12 1999-06-29 Fluoroware, Inc. Transport module with latching door
TW298337U (en) * 1996-08-19 1997-02-11 guo-min Gao Tilting-type stackable CD rack
US5833062A (en) * 1997-11-04 1998-11-10 Yeh; Sheng-Fu Disk organizer
JP2001281642A (ja) 2000-03-29 2001-10-10 Matsushita Electric Ind Co Ltd 液晶表示素子
US6287112B1 (en) * 2000-03-30 2001-09-11 Asm International, N.V. Wafer boat
EP1373099A4 (en) * 2001-04-01 2008-05-28 Entegris Inc FINE PLATE INSERT

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5890598A (en) 1997-01-22 1999-04-06 Nec Corporation Substrate cassette
US6099302A (en) 1998-06-23 2000-08-08 Samsung Electronics Co., Ltd. Semiconductor wafer boat with reduced wafer contact area

Also Published As

Publication number Publication date
EP1373099A1 (en) 2004-01-02
JP4296296B2 (ja) 2009-07-15
CN1313329C (zh) 2007-05-02
KR20030090703A (ko) 2003-11-28
US8141712B2 (en) 2012-03-27
US20040188320A1 (en) 2004-09-30
US20070193921A1 (en) 2007-08-23
EP1373099A4 (en) 2008-05-28
TW583718B (en) 2004-04-11
CN1525930A (zh) 2004-09-01
JP2004529493A (ja) 2004-09-24
US7219802B2 (en) 2007-05-22
WO2002079053A1 (en) 2002-10-10

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