TW576774B - Pressurized membrane platen design for improving performance in CMP applications - Google Patents

Pressurized membrane platen design for improving performance in CMP applications Download PDF

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Publication number
TW576774B
TW576774B TW090131593A TW90131593A TW576774B TW 576774 B TW576774 B TW 576774B TW 090131593 A TW090131593 A TW 090131593A TW 90131593 A TW90131593 A TW 90131593A TW 576774 B TW576774 B TW 576774B
Authority
TW
Taiwan
Prior art keywords
wafer
item
scope
patent application
fixing table
Prior art date
Application number
TW090131593A
Other languages
English (en)
Chinese (zh)
Inventor
Rod Kistler
John Boyd
Alek Owczarz
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/747,845 external-priority patent/US6607425B1/en
Priority claimed from US09/747,844 external-priority patent/US20020081945A1/en
Application filed by Lam Res Corp filed Critical Lam Res Corp
Application granted granted Critical
Publication of TW576774B publication Critical patent/TW576774B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D9/00—Wheels or drums supporting in exchangeable arrangement a layer of flexible abrasive material, e.g. sandpaper
    • B24D9/08—Circular back-plates for carrying flexible material

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW090131593A 2000-12-21 2001-12-19 Pressurized membrane platen design for improving performance in CMP applications TW576774B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/747,845 US6607425B1 (en) 2000-12-21 2000-12-21 Pressurized membrane platen design for improving performance in CMP applications
US09/747,844 US20020081945A1 (en) 2000-12-21 2000-12-21 Piezoelectric platen design for improving performance in CMP applications

Publications (1)

Publication Number Publication Date
TW576774B true TW576774B (en) 2004-02-21

Family

ID=31949946

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090131593A TW576774B (en) 2000-12-21 2001-12-19 Pressurized membrane platen design for improving performance in CMP applications

Country Status (5)

Country Link
JP (1) JP4225465B2 (de)
KR (1) KR100855536B1 (de)
DE (1) DE60104903T2 (de)
TW (1) TW576774B (de)
WO (1) WO2002049805A1 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100685744B1 (ko) * 2006-02-06 2007-02-22 삼성전자주식회사 플래튼 어셈블리, 웨이퍼 연마 장치 및 웨이퍼 연마 방법
JP2014053355A (ja) * 2012-09-05 2014-03-20 Disco Abrasive Syst Ltd ウエーハの加工方法
US10131175B2 (en) * 2015-01-09 2018-11-20 Murata Manufacturing Co., Ltd. Printing plate, laminated ceramic electronic component producing method, and printer
KR102319571B1 (ko) * 2017-03-06 2021-11-02 주식회사 케이씨텍 에어 베어링 및 이를 구비하는 기판 연마 장치
KR102015647B1 (ko) * 2017-03-24 2019-08-28 주식회사 케이씨텍 기판 이송 유닛 및 이를 포함하는 기판 연마 시스템
KR102318972B1 (ko) * 2017-03-28 2021-11-02 주식회사 케이씨텍 기판 연마 장치
KR101998405B1 (ko) * 2017-06-07 2019-07-09 주식회사 케이씨텍 기판 이송 유닛 및 이를 포함하는 기판 연마 장치

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03259520A (ja) * 1990-03-08 1991-11-19 Nec Corp 回転研磨装置
JP3960635B2 (ja) * 1995-01-25 2007-08-15 株式会社荏原製作所 ポリッシング装置
US5980368A (en) * 1997-11-05 1999-11-09 Aplex Group Polishing tool having a sealed fluid chamber for support of polishing pad

Also Published As

Publication number Publication date
DE60104903T2 (de) 2005-09-08
WO2002049805A1 (en) 2002-06-27
WO2002049805A8 (en) 2004-03-04
KR100855536B1 (ko) 2008-09-01
JP2004521488A (ja) 2004-07-15
DE60104903D1 (de) 2004-09-16
KR20030063409A (ko) 2003-07-28
JP4225465B2 (ja) 2009-02-18

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