WO2002049805A8 - Polishing platen with pressurized membrane - Google Patents

Polishing platen with pressurized membrane

Info

Publication number
WO2002049805A8
WO2002049805A8 PCT/US2001/050625 US0150625W WO0249805A8 WO 2002049805 A8 WO2002049805 A8 WO 2002049805A8 US 0150625 W US0150625 W US 0150625W WO 0249805 A8 WO0249805 A8 WO 0249805A8
Authority
WO
WIPO (PCT)
Prior art keywords
platen
membrane
cmp process
during
performance
Prior art date
Application number
PCT/US2001/050625
Other languages
French (fr)
Other versions
WO2002049805A1 (en
Inventor
Rod Kistler
John Boyd
Alek Owczarz
Original Assignee
Lam Res Corp
Rod Kistler
John Boyd
Alek Owczarz
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/747,845 external-priority patent/US6607425B1/en
Priority claimed from US09/747,844 external-priority patent/US20020081945A1/en
Application filed by Lam Res Corp, Rod Kistler, John Boyd, Alek Owczarz filed Critical Lam Res Corp
Priority to EP01992420A priority Critical patent/EP1349704B1/en
Priority to JP2002551130A priority patent/JP4225465B2/en
Priority to DE60104903T priority patent/DE60104903T2/en
Priority to KR1020037007699A priority patent/KR100855536B1/en
Priority to AU2002232889A priority patent/AU2002232889A1/en
Publication of WO2002049805A1 publication Critical patent/WO2002049805A1/en
Publication of WO2002049805A8 publication Critical patent/WO2002049805A8/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D9/00—Wheels or drums supporting in exchangeable arrangement a layer of flexible abrasive material, e.g. sandpaper
    • B24D9/08—Circular back-plates for carrying flexible material

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

An invention is disclosed for impoved performance in a CMP process using a pressurized membrane (312) and piezoelectric elements (702) as replacements for a platen (308) air bearing. In one embodiment, a platen form impoving performance in CMP applications is disclosed. The platen includes a membrane disposed above the platen, and a plurality of annular bladders (314) disposed below the membrane, wherein the annular bladders are capable of exerting force on the membrane. In this manner, zonal control is provided during the CMP process. In a further embodiment, piezoeletric elements are disposeed above the platen, which exert force on the polishing belt (310) during a CMP process, resulting in improved zonal control during the CMP process.
PCT/US2001/050625 2000-12-21 2001-12-21 Polishing platen with pressurized membrane WO2002049805A1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
EP01992420A EP1349704B1 (en) 2000-12-21 2001-12-21 Polishing platen with pressurized membrane
JP2002551130A JP4225465B2 (en) 2000-12-21 2001-12-21 Polishing platen with pressure membrane
DE60104903T DE60104903T2 (en) 2000-12-21 2001-12-21 POLISHING DISC WITH PRESSURIZED MEMBRANE
KR1020037007699A KR100855536B1 (en) 2000-12-21 2001-12-21 Polishing platen with pressurized membrane
AU2002232889A AU2002232889A1 (en) 2000-12-21 2001-12-21 Polishing platen with pressurized membrane

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US09/747,845 2000-12-21
US09/747,845 US6607425B1 (en) 2000-12-21 2000-12-21 Pressurized membrane platen design for improving performance in CMP applications
US09/747,844 2000-12-21
US09/747,844 US20020081945A1 (en) 2000-12-21 2000-12-21 Piezoelectric platen design for improving performance in CMP applications

Publications (2)

Publication Number Publication Date
WO2002049805A1 WO2002049805A1 (en) 2002-06-27
WO2002049805A8 true WO2002049805A8 (en) 2004-03-04

Family

ID=31949946

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/050625 WO2002049805A1 (en) 2000-12-21 2001-12-21 Polishing platen with pressurized membrane

Country Status (5)

Country Link
JP (1) JP4225465B2 (en)
KR (1) KR100855536B1 (en)
DE (1) DE60104903T2 (en)
TW (1) TW576774B (en)
WO (1) WO2002049805A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100685744B1 (en) * 2006-02-06 2007-02-22 삼성전자주식회사 Platen assembly, wafer polishing apparatus having the same, and wafer polishing method
JP2014053355A (en) * 2012-09-05 2014-03-20 Disco Abrasive Syst Ltd Wafer processing method
US10131175B2 (en) * 2015-01-09 2018-11-20 Murata Manufacturing Co., Ltd. Printing plate, laminated ceramic electronic component producing method, and printer
KR102319571B1 (en) * 2017-03-06 2021-11-02 주식회사 케이씨텍 Air bearing and apparatus for polishing substrate having the air bearing
KR102015647B1 (en) * 2017-03-24 2019-08-28 주식회사 케이씨텍 Substrate transfer unit and substrate chemical mechinical polishing system comprising the same
KR102318972B1 (en) * 2017-03-28 2021-11-02 주식회사 케이씨텍 Apparatus for polishing substrate
KR101998405B1 (en) * 2017-06-07 2019-07-09 주식회사 케이씨텍 Substrate transfer unit and substrate chemical mechenical polishing device comprising the same

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03259520A (en) * 1990-03-08 1991-11-19 Nec Corp Rotary polishing equipment
JP3960635B2 (en) * 1995-01-25 2007-08-15 株式会社荏原製作所 Polishing device
US5980368A (en) * 1997-11-05 1999-11-09 Aplex Group Polishing tool having a sealed fluid chamber for support of polishing pad

Also Published As

Publication number Publication date
DE60104903D1 (en) 2004-09-16
TW576774B (en) 2004-02-21
KR20030063409A (en) 2003-07-28
KR100855536B1 (en) 2008-09-01
WO2002049805A1 (en) 2002-06-27
JP4225465B2 (en) 2009-02-18
JP2004521488A (en) 2004-07-15
DE60104903T2 (en) 2005-09-08

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