TW574234B - Thermally cured underlayer for lithographic application - Google Patents
Thermally cured underlayer for lithographic application Download PDFInfo
- Publication number
- TW574234B TW574234B TW91104609A TW91104609A TW574234B TW 574234 B TW574234 B TW 574234B TW 91104609 A TW91104609 A TW 91104609A TW 91104609 A TW91104609 A TW 91104609A TW 574234 B TW574234 B TW 574234B
- Authority
- TW
- Taiwan
- Prior art keywords
- group
- subscript
- unit
- acrylate
- polymer
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
- C08F212/02—Monomers containing only one unsaturated aliphatic radical
- C08F212/32—Monomers containing only one unsaturated aliphatic radical containing two or more rings
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/094—Multilayer resist systems, e.g. planarising layers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/091—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by antireflection means or light filtering or absorbing means, e.g. anti-halation, contrast enhancement
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- General Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Materials For Photolithography (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US27552801P | 2001-03-13 | 2001-03-13 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW574234B true TW574234B (en) | 2004-02-01 |
Family
ID=23052692
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW91104609A TW574234B (en) | 2001-03-13 | 2002-03-12 | Thermally cured underlayer for lithographic application |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP1373331A4 (de) |
JP (1) | JP2004534107A (de) |
KR (1) | KR100709330B1 (de) |
TW (1) | TW574234B (de) |
WO (1) | WO2002073307A2 (de) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4798938B2 (ja) * | 2003-04-11 | 2011-10-19 | ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. | フォトレジストシステム |
US7416821B2 (en) * | 2004-03-12 | 2008-08-26 | Fujifilm Electronic Materials, U.S.A., Inc. | Thermally cured undercoat for lithographic application |
EP2196851A1 (de) | 2008-12-12 | 2010-06-16 | Eastman Kodak Company | Negativkopier-Lithographiedruckplattenvorläufer, die ein reaktives Bindemittel umfassen, das aliphatische bi- oder polycyclische Teile enthält |
KR101922280B1 (ko) * | 2011-10-12 | 2018-11-26 | 제이에스알 가부시끼가이샤 | 패턴 형성 방법 및 레지스트 하층막 형성용 조성물 |
DE102015119939A1 (de) | 2015-11-18 | 2017-05-18 | ALTANA Aktiengesellschaft | Vernetzbare polymere Materialien für dielektrische Schichten in elektronischen Bauteilen |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3885151T3 (de) * | 1987-05-19 | 1998-01-15 | Hitachi Chemical Co Ltd | Methode zur Herstellung von Methacrylatestern. |
JP2520686B2 (ja) * | 1988-03-18 | 1996-07-31 | 富士写真フイルム株式会社 | 湿し水不要感光性平版印刷板 |
JPH0539399A (ja) * | 1991-08-02 | 1993-02-19 | Nok Corp | 透明性アクリルゴム組成物 |
JPH0593022A (ja) * | 1991-09-30 | 1993-04-16 | Nok Corp | 透明性アクリルゴム組成物 |
US5886102A (en) * | 1996-06-11 | 1999-03-23 | Shipley Company, L.L.C. | Antireflective coating compositions |
JP4053631B2 (ja) * | 1997-10-08 | 2008-02-27 | Azエレクトロニックマテリアルズ株式会社 | 反射防止膜又は光吸収膜用組成物及びこれに用いる重合体 |
US6410209B1 (en) * | 1998-09-15 | 2002-06-25 | Shipley Company, L.L.C. | Methods utilizing antireflective coating compositions with exposure under 200 nm |
US6323287B1 (en) * | 1999-03-12 | 2001-11-27 | Arch Specialty Chemicals, Inc. | Hydroxy-amino thermally cured undercoat for 193 NM lithography |
ATE313574T1 (de) * | 1999-09-03 | 2006-01-15 | Nippon Soda Co | Alkenylphenolcopolymer und verfahren zu dessen herstellung |
-
2002
- 2002-03-07 KR KR1020037011930A patent/KR100709330B1/ko not_active IP Right Cessation
- 2002-03-07 EP EP02733834A patent/EP1373331A4/de not_active Withdrawn
- 2002-03-07 WO PCT/US2002/007136 patent/WO2002073307A2/en active Search and Examination
- 2002-03-07 JP JP2002572501A patent/JP2004534107A/ja active Pending
- 2002-03-12 TW TW91104609A patent/TW574234B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR100709330B1 (ko) | 2007-04-20 |
EP1373331A2 (de) | 2004-01-02 |
JP2004534107A (ja) | 2004-11-11 |
EP1373331A4 (de) | 2007-01-17 |
KR20040024853A (ko) | 2004-03-22 |
WO2002073307A3 (en) | 2002-11-21 |
WO2002073307A2 (en) | 2002-09-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GD4A | Issue of patent certificate for granted invention patent | ||
MM4A | Annulment or lapse of patent due to non-payment of fees |