TW555892B - Method of electroplating a substrate - Google Patents

Method of electroplating a substrate Download PDF

Info

Publication number
TW555892B
TW555892B TW90102763A TW90102763A TW555892B TW 555892 B TW555892 B TW 555892B TW 90102763 A TW90102763 A TW 90102763A TW 90102763 A TW90102763 A TW 90102763A TW 555892 B TW555892 B TW 555892B
Authority
TW
Taiwan
Prior art keywords
acid
substrate
solution
amine
film
Prior art date
Application number
TW90102763A
Other languages
English (en)
Chinese (zh)
Inventor
James M Taylor
Original Assignee
Duratech Ind Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Duratech Ind Inc filed Critical Duratech Ind Inc
Application granted granted Critical
Publication of TW555892B publication Critical patent/TW555892B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
TW90102763A 2000-02-08 2001-02-08 Method of electroplating a substrate TW555892B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US18091700P 2000-02-08 2000-02-08

Publications (1)

Publication Number Publication Date
TW555892B true TW555892B (en) 2003-10-01

Family

ID=22662189

Family Applications (1)

Application Number Title Priority Date Filing Date
TW90102763A TW555892B (en) 2000-02-08 2001-02-08 Method of electroplating a substrate

Country Status (3)

Country Link
AU (1) AU2001234935A1 (fr)
TW (1) TW555892B (fr)
WO (1) WO2001059185A2 (fr)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5857520B2 (ja) * 1982-08-25 1983-12-20 正巳 小林 電子部品用ステンレス鋼帯の金メッキ方法
US4510018A (en) * 1984-02-21 1985-04-09 The Lea Manufacturing Company Solution and process for treating copper and copper alloys
ES2257987T3 (es) * 1993-03-18 2006-08-16 Atotech Deutschland Gmbh Composicion y procedimiento para tratar una superficie revestida con un revestimiento de inmersion autoacelerante y autorenovador, sin formaldehido.

Also Published As

Publication number Publication date
WO2001059185A8 (fr) 2001-11-22
AU2001234935A1 (en) 2001-08-20
WO2001059185A2 (fr) 2001-08-16
WO2001059185A3 (fr) 2002-03-07

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Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees