TW548413B - Substrate inspection apparatus and substrate inspection method - Google Patents

Abstract

The subject of the invention is to provide a substrate inspection apparatus capable of highly accurately inspecting wiring patterns on plural inspected substrates in a short time and the inspection method. Four holders 13, which are used to fix the inspected substrates 11 at reference positions, are provided at equal intervals on peripheral parts of a turntable 61. In the substrate inspection device 1, the turntable 61 is turned in 90 DEG increments to convey the holders 13 to a carry-in part 2, to a displacement detection part 3, to an inspection part 4, and to a carry-out part 5, which are disposed at equal intervals around the table. The carrying-in of the inspected substrates 11, the detection of displacement thereof from the reference positions, the inspection of the substrates, and the carrying-out of the substrates are continuously performed at the respective conveying positions. Since these handlings are simultaneously performed in parallel with each other at the carry-in part 2, at the detection part 3, at the inspection part 4, and at the carry-out part 5, plural inspected substrates 11 are rapidly inspected with a high accuracy.

Description

548413 V. Description of the invention (1) Technical field The present invention relates to a substrate inspection apparatus and a substrate inspection method for inspecting wiring combinations of a substrate to be inspected, such as a printed wiring board and an integrated circuit assembly. However, the present invention is not limited to the combination of printed wiring substrates and integrated circuits, but is also suitable for inspecting various substrates such as glass substrates used in multilayer wiring substrates, liquid crystal display devices, and plasma display devices (P1 asma D i sp 1 ay). Sexual wiring. Background technique

For a substrate inspection device, each substrate to be inspected must be processed separately. Each process includes moving the inspected substrate into the inspection position, inspecting the circuit wiring assembly of the inspected substrate, and removing the inspected substrate from the inspection position. On the upper board, the specimens of each test substrate are inspected. The inspection and inspection substrates are separated, and the high-density position is misaligned. This kind of position verification is corrected and the inspection substrates are corrected. The conventional inspection, inspection, and unloading of the inspection substrates are completed during the entire process. Inspection process, so even if the time is limited and the inspection time has passed, there is a problem due to the substrate being inspected, and the inspection is the cause. The function was previously proposed, and the inspection was carried out after the inspection. After the position verification time must be processed individually for each process, immediately the next process is shortened, but there is a problem for the inspector. The wiring combination is gradually inclined. The substrate is carried into the inspection position. The structure of the substrate to be inspected is placed at the inspection position of the substrate. However, there must be room here, which hinders the inspection base, and causes problems when the number of keys to be checked is shortened when the number of keys is shortened. In order to put the auxiliary office in the first position, it has prevented the reduction of business.

II

548413 V. Description of the invention (2) Overall inspection time. Purpose = ΐTo solve the problems existing in this type of prior art, the substrate board inspection device and the board inspection device for inspecting the wiring assembly of a plurality of inspected boards with high accuracy within a new time and Substrate inspection; Summary of the invention Set the moon check board inspection device, set the carry-in position, on-position inspection position, and carry-out position at a predetermined interval

I send, in a long time: ΐ 1 • The inspected substrate is moved to ifi at a predetermined interval along the circumference, and the above-mentioned inspection of the inspected substrate is carried out, and the deviation of the inspected substrate from the reference position is detected. The above-mentioned: soil line inspection, inspection of the inspected substrates, the substrate inspection device includes' arranged in the same concentric circle as the above circle, and at The rotating table of the substrate holding device and the above-mentioned rotating table are rotated according to predetermined rotation angles. The substrates of the rotating table are held and held, and the substrates to be inspected are transferred from the carrying-in position to the position deviation inspection / shell 1 position, i. Rotary table driving device at check position and carry-out position, carry-in position, carry-in device of carrying the predetermined number of substrates to be inspected into the substrate holding device of the rotary table, and arranged at the position deviation = position. The position deviation detection device that detects the amount of deviation of the substrate to be inspected from the reference position is disposed at the inspection position. Inspection device for inspecting the wiring of Huanyi substrate carried by the rotating table, according to the above position deviation 2014-4599-PFN.ptd $ 6 pages 548413 V. Description of the invention (3) The inspection substrate and the inspection set and the inspected base disposed at the completion of the inspection, and a plane parallel to the fixed table provided on the bit substrate drives the mark detection device momentum to the inspected deviation amount calculation device optical axis and the predetermined The size depends on the amount of the substrate to be inspected using the imaging device described above, and the deviation amount from the deviation amount of the optical axis of the imaging device. In addition, the deviation of this measuring device on the mechanical board is calculated above. Data of deviation amount Remove the position of the phase between the fixtures, and move the board out of the rotation. Set the mark of the deviation detection position mark. Move the above mark to detect the deviation of the substrate from the predetermined position. Specifically, the field photography device calculates the origin of the inspection origin of the inspection origin of the device inspection device and the mechanical origin based on the positioning in the film and television field of the above-mentioned positioning marks. The device for removing the table may include a detection and detection device, and the deviation of the standard position from the drive of the device under test to the detection of the mark. The deviation of the measured amount from the position determination to the image. The positioning device is the original position of the coordinate system, and the correction is checked. The above-mentioned inspection and the above-mentioned rotating device are measured, and the computer is equipped with a computing device based on the displacement up to s. The movement of the device deviates from the reference position of the photographic equipment. The above-mentioned mark describes the coordinates of the inspected base. According to the above-mentioned structure, the plurality of substrates installed on the rotating table are held through the predetermined rotation & To the carry-in position, a predetermined number of substrates to be inspected are sequentially transferred to the rotating table And fixed by the substrate holding device. Was * — set a predetermined number of inspected substrates for the moved plate holding device, reciting each of the bases to meet the rotation of the rotating table

548413, Description of the invention (4), moved to the position deviation detection position, inspection position, and carry-out position in sequence. 0 is transported to the position deviation detection position detection device to detect the deviation from the reference position. For example, the position deviation detection device can be installed on the substrate to be inspected. Calculate the movement from the positioning calibration position to the detected mark. Specifically, a photographic record is used to determine the difference between the position of the image and the photographic device according to the position of the photographic device, which is captured as a shift in the field of view according to the photographic device. Place the inspected substrate and set the deviation amount based on the position deviation. This position deviation amount is detected by the mark detection device of the detection position. According to the mark detection device, the deviation amount calculation device is used by the transported device to photograph the positioning mark of the inspected substrate from the positioning mark to the inspection substrate. The amount of deviation of the optical axis in the field of view of the device to calculate the position deviation

When being inspected, the upper part of the inspection substrate is controlled according to the amount of parallax, and then, from the inspection plate, by carrying therefrom, the wiring of the carry-in and position inspection is performed based on the deviation of the position deviation of the substrate from the position deviation detection inspection fixture. The relative position is moved to the output device after the inspection and treatment. The device is moved due to the deviation detection at various positions. The short-time difference detection device can be used to correct the drive detected by the deviation detection position. Rotating tables are all inspected and moved inside. The detected jig needle position is transported to the inspection position, and the deviation from the reference position is detected, and the inspection jig is set on the substrate to be inspected relative to the jig, and the wiring of the inspection substrate is inspected. The inspected inspected bases are processed in parallel to the inspected substrates ’so that multiple inspected substrates are used, and at the inspection position, the deviation of the inspected substrates from the reference can be set to the inspected substrates.

548413 V. Description of the invention (5) ~ ^ And the inspection jig is correctly set for the inspection substrate, so that the inspection can be performed with relatively low positioning accuracy and has high reliability. The above-mentioned substrate inspection device further includes a rotary table disposed on the rotary table, and when the rotary table is rotated at a predetermined angle, it can form a predetermined positional relationship with the optical axis of the photographing device positioned at the mechanical origin. The origin mark on the position is detected by the camera when the rotary table is rotated along the predetermined angle, and the deviation between the origin mark and the relative position of the camera due to mechanical errors is calculated. A correction deviation amount detection device and a correction device that corrects deviation amount data of a deviation from a reference position of a substrate to be inspected corresponding to the deviation amount. According to this structure, the relative position deviation between the photographing device and the rotating table caused by errors in machining and assembly can be calculated, and the deviation from the reference position of the substrate to be inspected can be corrected corresponding to the relative position deviation. Therefore, the relative positional deviation between the photographing device and the rotary table driven by the mutually independent drive systems is corrected, and the deviation of the inspected substrate is improved. M k also includes the above-mentioned substrate inspection device, a fixture positioning mark provided at a predetermined position of the inspection table and a rotating table, a setting device for setting the inspection fixture mechanical origin, and the device is installed at a predetermined angle ^丄 When the rotating table is described, the auxiliary photography equipment that can position with the inspection fixture located at the mechanical origin and position the mark to form a predetermined positional relationship = Turn the rotating table at a predetermined angle to assist the photography device. Setting: When the position with the positioning mark forms a predetermined positional relationship, the inspection and α ^ auxiliary imaging device is driven, and the inspection auxiliary device is moved from the predetermined reference position s ^^ 'according to the inspection auxiliary device.

J 词 ό 分 丄 J V. Description of the invention (6) The visual field% of the assisting photographic device: the amount of movement until it is captured, the position of the light sleeve of the phase-contrast device, and the deviation of the m-image relative to the auxiliary pair. A computing device for the amount. According to this structure, the inspection table and the rotating table are inspected. At one time, the rotating table is rotated to the predetermined ":,: u mechanical origin, point, and the same position." The table positioning mark forms a predetermined position relationship mark in the view. = Being driven by the device_ bit mark, the root must be two. The handcuffs in the field of view of the auxiliary camera are calculated by shooting the fixture with the auxiliary camera and the image of the soldier of the warrior: ， M IL〗 The position information of the optical axis of the camera device. Two strokes U camera device According to the movement amount of the inspection auxiliary device until the image of the fixture positioning mark is captured in the field of view, the light of the Xiaokou fixture positioning mark image relative to the auxiliary camera device The position information of the axis calculates the relative position deviation between the inspection jig and the rotary table. In the substrate inspection device, power is supplied to the power supply device of the auxiliary photographing device and the arithmetic device, which are provided separately from the rotary table. For the main body of the device, when the auxiliary photography device sets the jig positioning mark of the inspection jig at the corresponding position, the above-mentioned computing device and power supply device are the same as above The photographic assisting device is electrically connected together through contacts that are in contact with each other and are electrically connected together. In addition, the above-mentioned contacts are provided on the rotating table and include a concentric extension with the rotating table to cover the auxiliary device. The conductor that the camera moves to confirm the setting of the relative position of the inspection jig and the rotating table is installed on the side of the main body of the device.

2014-4599-PFN.ptd Page 10 548413 548413

V. Description of the invention (7) The moving position of the contact position of the contact, the non-contact separated from the conductor, and the brush position moving between the auxiliary photography device for photography. Move the brush to contact According to the above structure, the auxiliary photographic device sets and λ at the corresponding positions, and is set by connecting the points on the rotating table. Therefore, the deviation of the inspection fixture can be checked. When the auxiliary photography device fixes the inspection fixture to 2 t body, the brush set on the side of the device body is placed from the corresponding position Φ and contacts the conductor set on the rotating table. The auxiliary inflammation touches the device and the power supply device. Connected to the installation and transportation tool to remove the fixture positioning tool from the corresponding position;, == from == to = contact position, forming a non-contact state with the conductor, the electrical connection of the auxiliary computing device and the power supply device is released. ', /, Zhuo Pan Γ: The power supply of the auxiliary photography device must be performed: during operation and control, the rotation ^ is connected with the electrical material of the master, and π is touched at 2 at the same time, and the table is rotated through the conductor and brush. -Make the auxiliary camera work while rotating according to the predetermined angle range. In the substrate inspection device, the planar shape of the substrate to be inspected is approximately rectangular, and the substrate holding device may include a third contact portion that abuts on the-side of the two sides adjacent to each other between the United States and China, and : Wide side = the second abutting portion that is in contact with the other side, acts on the side opposite to one of the two sides of the substrate to be inspected, and pushes the substrate to be inspected to the first portion of the first abutting portion. Pressing part, 2 against the substrate to be inspected

2014-4599-PFN.ptd 548413

Department Ϊ 目 2 works on the pushing surface and pushes the substrate to be inspected to the second abutment 杳 & and to the above-mentioned first and second pressing sections, pushing the inspected i two fai who one J The switching device is used to set and release the release position β Μ knife of the push M state of the inspected substrate. In addition, the switching device can generally be used as a cam device that acts on the first and second pushing parts to make the second and second pushing positions in the pushing position and when the substrate is held in the loading position and the loading position. , A releasing device which acts on the cam device to make the first and second pressing portions in a releasing position.

According to this structure, when the substrate holding device of the rotary table is moved to the carry-in position, the inspected substrate whose plane shape is approximately rectangular is loaded into the substrate holding device, and the switching device of the substrate holding device is switched from the release position to the pushing position. Thereby, the first pressing portion is moved to the pressing position, and one side of the substrate to be inspected is in contact with the first abutting portion, and at the same time, the second pressing portion is moved to the pressing position. The second abutting portion abuts, and the substrate to be inspected is fixed by the substrate holding device. Specifically, the first and second pressing portions of the cam device are simultaneously moved to the pressing position, so that the two sides adjacent to each other in the substrate to be inspected abut the first and second abutting portions, respectively. The substrate to be inspected is fixed by a substrate holding device.

By operating the cam device, the two adjacent sides of the substrate to be inspected are brought into contact with and separated from the first and second abutting portions, so that the substrate to be inspected can be easily and accurately positioned and fixed to the reference of the rotating table. position. In addition, the substrate to be inspected is accurately held in the substrate holding device during the movement from the carry-in position to the carry-out position by the switching device. Moreover, in general, the switching device places the first and second pressing portions in the pressing position, and sets the & 1 position

The 548413 method includes a turntable to detect the position according to the measurement position and the substrate protection. The fixture is in the above device, and the predetermined position is checked for the substrate according to a plurality of bases, and the deviation of the inspection position is inspected. And check the substrate at the carry-out position, and can only be operated mechanically to maintain the detected position, except when operating in the carry-in position and carry-over switching device to switch to the fifth, invention description (9) and carry-out position as the release position. Outside to location. The substrate inspection side of the present invention has the steps of rotating a plurality of substrate holding devices, and sequentially moving the substrate holding device into a position and a position deviation detection sequence. The amount of deviation, at the above-mentioned inspection position, adjust the inspection and inspection of the wiring of the inspected substrate, keep the inspected substrate from the substrate, turn the table according to this substrate inspection method, place it on the rotating table, and move it through the substrate into the skirt. The table is moved to the position deviation detection position by a predetermined number of fixed times fixed by the substrate holding device. When the substrate is moved to the board by the rotating table, the deviation from the reference position is rotated. When the rotating table is moved to the inspection position, it will be at a predetermined angle. The interval setting is performed according to the above-mentioned predetermined angle interval. The setting, inspection position and carry-out position of each predetermined angle are performed in turn. In the above-mentioned carrying-in holding device and fixed, the deviation base of the inspected substrate corresponds to the deviation base of the inspected substrate And the relative position of the rotating table, The steps taken to check each track of the process. Each predetermined angle rotation drive rotary plate holding device is sequentially moved to the number of loaded substrates to be rotated and fixed. Each substrate holding device is rotated in accordance with the position of the rotary table, and the position is carried out. When the detected position is detected, it is detected by the inspection base. The inspected substrate passes the deviation of the inspected substrate from the reference position

548413 V. Description of the invention (ίο) Adjust the relative position of the inspection fixture and the rotating table, and then check the wiring of the substrate to be inspected. Then, by rotating the table, the inspected substrate that has been inspected is moved to the unloading position, and the inspected substrate is taken out of the substrate holding device. In this case, the number of position checks and the detection process are adjusted in the mechanical device when the marks of the field of view are incorporated into the camera. The adjustment is performed to check the coordinates of each mark, make use of the recorded coordinates, and the camera device at the predetermined position. The deviation detection and inspection of the substrate at the end of the recording include the step of setting the origin of the original point until the inspection step, and the steps of calculating the movement and the optical axis deviation amount of the fixture relative to the inspected substrate. Based on the above-mentioned mechanical position, the calculation 'can also be performed in parallel to the inspection and removal of the substrate to be inspected from the position moved by the machine based on the original basis formed, so the wiring can be inspected in a short time. The deviation of the position is based on the positioning of the camera. The image of the mark is moved into the field. The position of the deviation between the image of the mark and the reference position is calculated. In addition, two positioning systems can be captured to detect the positioning system. Table, capture the original point in the rotation table difference detection position ^ described above ^ image and photography

〇14-4599-PFN.ptd The deviation reference of the inspection substrate has an optical axis and a predetermined field of view setting step. From the mechanical inspection of the substrate, the positioning of the imaging device in the field of vision of the imaging device is determined. Bias. In the inspection process, a device is formed at a predetermined position relative to the substrate to be inspected, and the deviation from the reference position in the field of view in which the origin is the sequential origin is a predetermined amount of rotation. The above-mentioned rotation point mark is set to the substrate bias origin. Start from the point of view to the visual field momentum and the origin point mark in the field of view 548413 V. Description of the invention (11) The amount of deviation between the optical axes of the device, and then adjust the position. In addition, turn the rotary table, and rotate the device field of view at the inspection position The deviation between the movement amount of the inner envelope and the optical axis is then corrected based on this deviation. Quasi-inspection fixture, count. At the fixed position, the auxiliary camera is located on the inspection image. In the method of sequentially inspecting the substrate from the machine-assisted camera to the turntable, the relative offset is used to calculate the relative position of the rotating table and the photographing device to the inspection fixture and the substrate to be inspected. The amount of phase deviation is corrected based on this deviation. You can rotate the camera with a light car and drive it to a pair of fixtures. At this time, the fixture positioning scalar 'calculates the difference between the pair of inspections and performs an inspection on the table. The table is set on the existing and predetermined visual inspection fixtures'. According to the deviation of the inspection mark, according to the deviation of the inspection record, the auxiliary inspection jigs and rotation jigs, the substrate inspection tool and the rotating table to be tested are set according to the predetermined amount of rotation and the jig is set at the auxiliary photographic mechanical origin. For the deviation amount and relative position adjustment in the field of view of the invention, an embodiment of the invention of the basis difference amount can be used, and an embodiment of the substrate inspection device of the present invention will be specifically described with reference to the drawings. 1 to 3 show examples of the structure of a substrate inspection apparatus according to the present invention. Fig. 1 is a plan view of the main part, Fig. 2 is a perspective view of the main part, and Fig. 3 is a block diagram of the structure. This substrate inspection apparatus 1 includes a carrying-in section 2 for carrying the substrate n to be inspected into a predetermined carrying-in position P1 in the main body, and is provided at the carrying-in position ρι in a clockwise direction (direction R in FIG. 1) to turn 90. "Difference detection position" is used to detect the position deviation amount of the substrate 11 to be inspected from the reference position 548413 V. Description of the invention (12) 3: Placed at the inspection position P3 'The wiring formed on the substrate 11 to be inspected Inspection section 4 for inspection, substrates U to be inspected which have been transported by the substrate transfer section 6 to the carry-out location, external carry-out sections 5, and carry-in sections 2 to the carry-in position PW 2 substrates to be inspected u, u Rotate 9G in the clockwise direction to the position deviation pq. At the inspection position P3, rotate the inspected substrate u and P3 clockwise by 90. The substrate transfer section 6 at the inspection position p4. ”The placement position P1 is placed. It is located on the front side (lower side in the middle of the figure) of the substrate inspection device 丨. What is the position deviation detection position? 2 is arranged on the left side (left side in FIG. 1), inspection position_ ^ The back side of the substrate inspection device i (upper side in FIG. I), where to carry out? 4 is arranged on the right side in the front direction of the substrate inspection device 丨 (the right side in FIG. I). The substrate transfer unit 6 includes a rotary table 61 and a drive mechanism including a motor 62 such as a feed motor that rotates and drives the rotary table 61. The motor 62 is installed at the bottom of the table 61, and the center of the rotary table 61 is fixed to a square shaft of the motor 62 (see FIG. 2). Between the electric machine 62 and the rotating shaft 61, a ball bearing is provided to support the electric rotating shaft 62. On the edge portion of the surface of the rotating table 61, the * support brackets 丨 3 and $ 3 of the substrates to be inspected are arranged on the diameters perpendicular to each other. The center line in the width direction of each support frame 3 is the same as the diameter. The rotating table 61 is fixed on the rotating shaft of the motor 62 so that each of the brackets 13a, 13b, 13c, and 13d is correctly located at the substrate carrying-in position, the position deviation detection position p2, the inspection position p3, and the carrying-out position p4.

548413 Description of the invention (13) In the lower part of the electric motor 62, the code "Historical display of the motor 62 and the rotation angle of the rotary table H" is displayed. This display data is input to the control unit "for driving control of the rotary table. In the substrate inspection, the 'control section 4 4 controls the number of driving pulses to the motor 62 while displaying the output of the encoder. From the side of the rotating table, the rotating table is rotated in a clockwise direction at 90 °. In addition, each time the rotary table is rotated 90 degrees, the two inspected substrates 1 1, 1 丨 are carried in, loaded, and fixed on the support frame 13 from the carrying-in position? 1. In the carrying-in position, P1, are loaded, The two inspected substrates 11 and 11 fixed to the support frame 13 of the rotary table 61 are sequentially moved to the position deviation detection position P2, the inspection position P3, and the carry-out position p4 by the rotation of the rotary table 61, and will be described later at each position. Detection of the positional deviation of the substrate, inspection of the wiring assembly, and removal of the substrate. Therefore, in the inspection processing of a plurality of substrates 11 to be inspected, each rotation of the rotary table by 90 ° is sufficient. The carry-in position P1, the position deviation detection position P2, the inspection position P3, and the carry-out position P4 are performed simultaneously and in parallel. The process of carrying in the two inspected substrates 11 and 11 by the carrying-in unit 2 and the individual inspections by the position deviation detecting unit 3 The processing of the position deviation amount of the substrate 11, the processing of inspecting the substrate by the inspection unit 4, and the processing of unloading the inspected substrate 11 by the unloading unit 5. In this way, on the one hand, the edge portion of the rotating table is used as the moving path for the two Inspection of the substrate 11; π performs a rotational movement. On the other hand, at the predetermined position of this movement path, the processing of loading in the substrate, detecting the position deviation amount, inspecting, and unloading are performed simultaneously and in parallel. Therefore, a plurality of sheets can be quickly processed. The inspection substrate 11 performs an inspection process.

2014-4599-PFN.ptd Page 17 548413 V. Description of the invention (14) The control of the amount of rotation between the rotary table 61 and the rotary table 61 can be set at a position equivalent to the position of the support table 31 of the rotary table 61 A light shielding plate or a light reflecting plate. On the other hand, a light sensor is provided at the carry-in position P1, the position deviation detection position P2, the inspection position P3, and the carry-out position P4. The light sensor is used to detect the shielding plate or the reflection plate. It is possible to detect the rotation position of the rotating table 61, and use this detection result to stop the motor 62 at a desired position. On the carry-in side of the substrate inspection apparatus 1 (the left side of the main body in the figure), a supply machine 7 for supplying the substrate 11 to be inspected is installed. 1 way

The loader 7 is extended by a loading device such as a loader. On the other hand, on the unloading side of the substrate inspection apparatus 1 (the right side of the main body in the figure), a storage machine 8 for storing the inspected substrates 丨 丨 is provided. It consists of an unloading device such as an extended loader. The position deviation detecting section 3 includes a camera 31 having a solid-state imaging element such as a CCD and CMOS, and a camera driving device M that drives the camera 31. And = the camera-viewing device 32 also includes, in the position deviation detection position P2jl, the connection direction of the rotating table (upper and lower directions in FIG. I): the CX direction driving unit 32X of the low-blue camera 31 (please refer to the figure) 2), in place

For Lux 力 ′, move the Cy-direction driving part 32Y of the camera 31 at the position P2 in the Cy direction corresponding to the diameter of the rotating table (\ ^. Direction in FIG. 1) (see FIG. 2). The camera 31 is mounted on * Γm and the Lx direction driving unit 32X, and is mounted on the rotating shaft so that the lens is aligned Ί (can be photographed on the rotating table 61 矣 6 1 extended plate-shaped camera and shake surface). The end of the machine support member 3 3. As shown in Figure 1,

548413 V. Description of the invention (15) "The camera 31 is mounted on the optical axis of the camera 31 and can pass the origin mark set at a predetermined position of the turntable 61 described later (for example, dot dots) to pass through the rotary table 61. The circular moving road guard formed by turning: refer to the straight position shown by the dotted line in Figure 1) and the straight position of the rotary table 61. Therefore, when the substrate inspection device i is assembled, pt ^ 1 and 32X and Cy are driven. The origin of the drive control camera 31 of the unit 32Y in the software (that is, the origin of the CxCy coordinate) is set at the origin mark τ〇 and the diameter of the rotary table 61 < the intersection CQ (the mechanical origin during assembly) position).

(I Also, in this embodiment, when the support frames 13a, 13b, 13c, and 13d are located at the positions shown in FIG. 1, the origin mark T0 may be set at an angle reference using the Cy axis (0 = 0.). It is located at a proper position of the radius of 135. The angular position. The setting position of the origin mark το is not limited to _135. The radius of the angular position can also be set in a way that does not conflict with the components such as the support frame 13 installed on the rotating table 61. Radius at any angular position. Also, the four support frames Ua, 13b, 13c, and 13d are located at the angles of 0 °, 90 °, 18 °, and 2 70 ° of the rotating table 61, and each support frame 13 &, The centers h0 of 13b, 13c, and 13d are set at positions intersecting with the movement path 3 of the origin mark τ〇. Each of the support frames 13a, 13b, 13c, and 13d is provided to fix the two substrates 11 and 11 to be inspected. The substrate holding device at the left and right symmetrical position centered on hQ. This substrate holding device will be described in detail later: The position deviation detection unit 3 uses the camera 31 to capture two pieces moved from the position deviation detection position P 2 Each of the inspected substrates 11, 11 The formed 2 'total four positioning marks 12a, 12β, 12c, 12D (e.g.

548413 V. Description of the invention (16) Marks such as origin, etc.) By calculating these positioning marks 12A ~ 12D, they are defined at the position d, p 2 of the position deviation detection position 6 of the red turntable 61, and the coordinate system (please refer to Figure 2) can calculate the deviation direction and amount of deviation of the two inspected substrates 丨, ii from the reference position. Regarding the substrate inspection device 1 of this embodiment, as described later, the position deviation detection position P2 of the rotating table controls the CxCy coordinates of the camera driving and the rotating table 61 determines the position of the substrate to be inspected. It is in the same position through the correction. The reference position of the positioning marks 12A to 12D is only a. At the inspection position P3, the inspection jig 41 and the inspection substrate 41 located at the adjustment reference position and the inspection substrate η, 〖丨At the time of positioning, the coordinates of the positioning marks 12A ~ 1 2D in the Cx 'Cy' coordinate system. Therefore, in a state where the two inspected substrates Π and 11 are accurately fixed at a predetermined position of the support frame 13, the support frame 1 3 When transported to the position deviation detection position p2, if this support = 13 center h0 and Cx, Cy, coordinate origin 0c. Consistent, it is calculated according to the camera tt positioning mark 丨 2A ~ 1 2D photographic image Cx, Cy, the position of the positioning marks 12A ~ 12D in the coordinate system is consistent with the reference position. The camera 31 has a field of view of the diameter of the positioning marks 12A ~ 12D. 2 When the 2 substrates to be inspected 1 1, 1 1 When moved to position deviation P2, 'moving through the camera driving device == m ~ 12D to enter the field of view of the camera 31 in sequence. Specific and two: driving device 32, follow the moving path indicated by the arrow in Figure 2 i; 12D: Camera set 31. According to the value of the set Lan Dan t the position of the standard mark sil2A ~ 12D deviates from the reference position ', 1 is not small, so in most cases, move the camera 31 to

2014-4599-PFN.ptd Page 20 548413 V. Description of the invention (17) The reference position of the positioning marks 12A ~ 121), you can make the positioning marks 12A ~ 12D enter the field of view of the camera 3 1 ', and then set the camera 3 1 at Position each of the positioning marks 12A to 12D completely into the position of its field of view. Then, at each set position of the camera 31, the deviation amount of the day-plane center of the photographed image and the image center of the positioning marks 12A to 12D is calculated as position deviation data and stored. If the position of the mounting support 13 of the rotary table 61 deviates from the predetermined position, or the inspected substrate u, u is fixed at a position deviated from the predetermined position, when the inspected substrate 丨 丨, 丨 丨 is transported to the position deviation detection position P2 The position of Cx and Cy of the positioning marks 12a to 12D is the deviation from the reference position. Therefore, the position deviation data is data indicating a state where each of the substrates 11 to be inspected deviates from the reference position. Furthermore, regarding the substrate inspection apparatus 1 of this embodiment, a camera 31 independently of the position deviation inspection section 3 of the rotary table 61 is used to capture a pair of positioning marks 12 persons, i2B ( Or | 2C, 12D) 'Calculate the positioning mark ⑵a based on this photographic image 乂 2 「The position coordinates in the two positions defined by the position deviation detection position of the rotary table 61, so it is necessary to make cx , Cy, and coordinates are consistent with each other, as shown in FIG. 4, so that the rotating table 61 is smooth.

It is located at the position deviation detection position P2, and the coordinates of the origin of the s, the TO oc, and the radial direction of the rotary table 61 are taken as the coordinates; the coordinates of the point f as the point f are Cx, Cy, and coordinates. If rotating, the assembly defined by the above 3 is ideal, Cx, Cy, sitting; ^ 1 /, 61 and the position deviation inspection section are mainly consistent with the Cxcy coordinates,

548413 V. Description of the invention (18) As long as the rotary table 61 is turned 135 clockwise. The origin point is marked with the center of the picture of the camera 3 1 which will be at the origin position, that is, on the optical axis of the camera 3 丨. However, in general, it is very unlikely that the rotating table 61 and the position deviation inspection unit 3 can achieve the desired degree of jealous matching. The coordinates of Cx, Cy, [& cannot be consistent, so turn the rotating table 61 clockwise. . At this time, the origin mark TO is mostly deviated from the optical axis of the camera 31 or from the field of view. y Therefore, in the substrate inspection apparatus 1 related to this embodiment, the camera 31 is moved so that the origin mark T0 enters the shooting field of view and an image of the origin is captured. Based on this photographic image, the distance from the origin mark το from the center of the screen is calculated. The deviation amount is calculated based on the deviation amount and the movement amount of the camera 31, and the deviation amount of ^ Cx, the coordinate origin 0c, and the CxCy coordinate origin 0c. In addition, as shown in FIG. 5, if the Cy 'axis and the Cy axis are not parallel, and c and c, that is, c: the point 0c coincides with the origin 0c. Need to be in the positive direction and the negative side: point 为 f (in this embodiment). Rotate the rotating table 61 so that f ;: move 0 while 'moving the camera 31 at the same time, and take pictures of the original position at each of the moving positions.' The difference between the 'axis and the & axis' difference ^ For the photographic image of το 钱 * U, calculate the Cx, Cy, and 31 in the coordinates with the deviation from the center of the screen of 1 U and the movement of 31 Camera coordinates and use this coordinates to calculate it. The m-spinning table 61 in the moving position is rotated from the above. Position +10 A-10, move the camera 31 to make each position rotated after rotation. Page 22 2014-4599-PFN.ptd 548413 V. Description of the invention (19) The origin mark το can be captured in the field of view, according to the camera The amount of movement of 31 = and the deviation of the origin mark in the field of view of the camera 31 from the center of the screen is 1. The origin mark To is calculated as +10 on the rotating table 61. Sitting on the pole. : Origin mark +10. The coordinates of the position are set to cxl, cyl, and the coordinates of the origin position ^ 10 are set to cx2, cy2. The deviation angle 0C can be calculated according to the following relationship. (9c lair1 [(Cyi _cy2) / (cxl _cx ”] ^), and then 'correct the position of the square rotation of the rotating table 61 according to the deviation angle between the axis and the Cy axis' (the origin of the Cx Cy coordinate 0c) (ie The position setting of the Cx'Cy 'coordinate of the position deviation detection position P2 was also adjusted). At the same time, the deviation between the Cx Cy coordinate origin 0c' and the cxCy coordinate origin 0c was used as the driving of the camera 31 The correction value of the control, the Cxcy coordinates and Cx, Cy, coordinates in the software (ie, in the drive control) are consistent. Therefore, when the substrate is checked, 'used to control the drive camera 3 iCxCy coordinates are actually replaced with Cx 'Cy' coordinates. Therefore, 'on the rotating table 61, use the camera 31 to capture the positioning marks 1 2A to 1 2D of the two inspected substrates 11 and 11 transported to the position deviation detection position P2.' Use this photographic image to calculate the CxCy coordinates. When the position information of the positioning mark 12 A ~ 1 2D in the middle, this position information is the position information of the Cx 'Cy' coordinate defined at the rotating table 6 J. In addition, regarding the coordinates and Cx, Cy, the coordinates of the coordinates in the software Adjustment function (hereinafter, referred to as self Correction D will be described later in detail. Further, the substrate examination, because it is automatically corrected through a correction for the initial, so in the following description,

Cx 'Cy' coordinates are replaced with CxCy coordinates for explanation.

2014-4599-PFN.ptd Page 23 548413

Here, the substrate holding device of the support frame 13 will be described with reference to FIG. 6. The substrate holding mechanism 70 synchronizes the first holding portion 73 and the second holding portion 76 to position the substrate to be inspected 11 at a predetermined position on the rotary table 61, and align the substrate between the clamped state and the released state. Check the substrate and switch.

The first clamping portion 73 includes a first abutting portion 71 and a first pressing portion 72 that sandwiches the substrate to be inspected n and faces the first abutting portion 71. The substrate to be inspected 11 is arranged between the first abutting portion 7 丨 and the first pressing portion 72, and the first pressing portion 72 is brought into contact with or separated from one side 11c of the substrate 11 to be inspected by the cam mechanism 80. Thus, the edge 11a and the edge lc of the substrate 11 to be inspected are held / released. Similarly, the second clamping portion 76 includes a second abutting portion 74 and a second pressing portion 75 that sandwiches the substrate 11 to be inspected and faces the second abutting portion 76. The substrate to be inspected 11 is disposed between the second abutting portion 74 and the second pressing portion 75, and the second pressing portion 75 is brought into contact with or separated from one side Hd of the substrate 11 to be inspected by the cam mechanism 80, so that The edge lib and the edge lid of the substrate 11 to be inspected are in a clamped / released state. Then, the first holding portion 73 and the second holding portion 76 are operated in synchronization, so that the substrate 11 to be inspected can be positioned on the rotary table 61 with high accuracy and held. '

In more detail, the "first pressing portion 72" is fixed to the moving plate 87, and two guide shafts 85 are fixed to the moving plate 88 at the side. A compression coil spring 84 is provided between the push plate 83 and the moving plate 87 guided by the guide shaft 85 and fitted outside the guide shaft 85. The push plate 83 is provided with a roller 82, and the roller 82 is brought into contact with the cam 81 by a tension coil spring 86 attached to the moving plate 87. In FIG. 6, the right end of the tension coil spring 86 is fixed to the moving plate 87, the left end is fixed to the table plate 77, and the tension coil spring 86 is fixed.

548413

In the state of misalignment shown by the convex line, the roller 82 of the push plate 83 abuts on the point of action 81a of the convex portion, ㈣ the compression coil spring ^ 'the moving plate 87 is pushed in the clamping direction, and the compression coil spring箸 之 2 can hold the inspected substrate 1i! The pressing portion 72 generates a predetermined f-force, so that the clamped operation can be performed on the inspection object in a stable state all the time. The spring force of T is set to be weaker than the spring force of the compression coil spring 84. On the lower surface side of the rotating table 61, a coaxial pinion 91 is provided on the cam 81, and a rack 92 meshing with this pinion 91 corresponds to a piston rod 93a of a cylinder. The rack 92 is provided on the rotating table 61 is the lower side surface. On the other hand, the cylinder 93 and the piston rod 93a and the rotary table 61 are respectively provided at positions corresponding to the carry-in position P1 and the carry-out position of the different device bodies. One end of the rack 92 is fixed to the rack 92. The extension coil spring 94 of the rotary table 61 keeps the cam 81 in a clamped state (the state of FIG. 6). The rack 92 is provided with a guide hole 92a composed of two long holes, which is convexly arranged on the rotary table 61. The guide pin is inserted into this guide hole 92a. In the state of Fig. 6, the guide pin 95 abuts the right end of the guide hole 9 2a, and thus the rack 92 stops at the position where the cam 8 丨 is held in a clamped state. In other words, the guide The needle 95 has a function of a stopper that stops the rack 92 in the clamped position and the released position. By extending the piston rod 93a of the cylinder 93, the piston rod 93a is pushed to the left end of the rack 92, and the rack 92 follows The long side of the guide hole 92a moves to the upper right of Fig. 6. In Fig. 6 By moving the rack 92, the pinion 91 is rotated approximately 90 ° in the clockwise direction, and the cam 81 is displaced to the released state (the state shown by the two-dot chain line in FIG. 6). By the displacement of the cam 81 Roller 82 of push plate 83

2014-4599-PFN.ptd 548413 V. Description of the invention (22) — a " ----- Abutment with point 81, the support frame 13 enters the released state. The second pressing portion is turned on, and the cam mechanism 80, which is the same as the first pressing portion 72, is synchronously driven. ψ. During the inspection process of the substrate, when the support frame 13 enters the carry-in position pi and P4 is placed, the end face of the piston rod 93a is opposite to the rack 92. By controlling " dumb-cylinder 93, the piston rod 93a resists the tensile coil The operation of the impeachment 94 presses the rack 92 to the upper right of FIG. 6, and drives the pinions 91 and 91 to rotate ^ so that the convex portion 81 of the cam 81 avoids the roller 82. Therefore, by pulling the coil spring more than 86, the moving plate 87 is retracted to the release position, so that it is possible to receive and carry out the inspected substrate.

After receiving and carrying out the substrate to be inspected, the piston rod 93a is retracted from the rack 92, and the rack 92 is moved to the lower left of FIG. 6 by the elastic force of the tension coil spring. As a result, the cam 81 of the pinion 91 is rotated in the reverse direction, and the protruding portion 81a acts on the push plate 83 via the roller 82, so that the moving plate 87 is moved to the clamping position. The rack 92 stops at the position where the projection 81 a of the cam 81 acts on the push plate 83 through the guide pin 95 and the guide hole 92a, and can maintain the cam mechanism after the rotary table 61 leaves the carry-in position or the carry-out position The clamping state of 80%. In addition, a rack 92 is provided for each support frame 13. In the illustrated embodiment, a pair of racks 92 is provided in a zigzag shape for each pair of support frames 13. In addition, a pair of cylinders 9 3 are provided at the carry-in position and the carry-out position, respectively. In this substrate holding mechanism 70, the substrate to be inspected 11 is mounted on the rotating table 61, and the two sides adjacent to the substrate 11 to be inspected are operated synchronously by the first clamping portion 73 and the second clamping portion 76. 11a, lib is supported by the first abutting portion 71 and the second abutting portion 74, the first pressing portion 7 2 and the second pressing portion 7 5

2014-4599-PFN.ptd Page 26 548413

The outer 2 sides 1 1 C and 1 1 d are contacted and separated, so that the substrate to be inspected can be accurately positioned at a predetermined inspection reference position on the rotary table 61 and held, and can be simply switched. To release the clamped release state. Furthermore, the first pressing portion 72 and the second pressing portion 75 are separated from the substrate to be inspected by their respective cam devices, so that the support frame 1 3 can be accurately switched between the holding state and the releasing state. And, when the inspected substrate worker i is moved from the carry-in position to the carry-out position, the clamped state is always maintained. Furthermore, the substrate n to be inspected in the clamped state is held by a predetermined pressing force by the pressing spring 84, so that the positioning accuracy of the substrate to be inspected can be improved. In order that the contact terminals 42 of the upper inspection jig 41 and the lower inspection jig 41, which will be respectively located on the upper and lower surfaces of the substrate 11 to be inspected, are in contact with each other at the same time, inspection is performed from both sides. Therefore, on the table 77 of the support frame 13, An opening is provided so that the lower surface can be exposed when the substrate to be inspected is held by the support frame.

As shown in FIG. 3, the inspection section 4 is composed of an upper inspection unit 411 and a lower inspection unit 4D. The upper inspection unit 4u is used to inspect the wiring combination formed on the upper surface of the substrate 11 to be inspected, and the lower inspection device 41) is It is used to inspect the wiring combination formed on the lower surface of the substrate 11 to be inspected. The upper inspection sheet ^ 4U is arranged above the inspection position p3 via the rotary table 61, and the lower inspection unit 4D is arranged below the inspection position P3 via the rotary table 61. The two inspection units 4U and 4D have the same structure, and are arranged symmetrically across the rotating table. Therefore, only the structure of the upper inspection unit 4U is described here, and the same applies to the lower inspection unit 4D. The upper inspection unit 4U includes' inspection jig 41, which are respectively located at χγζ0.

548413 V. Description of the invention (24) The inspection jig driving device 43 of the inspection jig 41 and the plurality of contact terminals 42 held on the inspection jig 41 are driven upward. As shown in FIG. 2, the χγζ 0 direction refers to the X-axis direction, the γ-axis direction, the Z-axis direction, and the direction of the rotation angle 0 centered on the Z-axis when the XYZ coordinates are set at the inspection position P3. The X direction is the tangent direction of the rotating table 61 located at the inspection position P3, and the rotating direction of the rotating table 61 is the + side. The Y direction is the diameter direction of the rotating table 61 located at the inspection position P3, and the direction pointing to the outside of the rotating table 61 is the + side. The z direction is a direction perpendicular to the XY axis, and the direction pointing to the upper side of the rotary table 6 丨 is the + side. And "Cx" Cy "coordinates not determined at the position deviation detection position p2 are on the rotating table

6 1 The coordinate generated after turning 90 ° clockwise is consistent with the above χγ coordinate. 0 As shown in FIG. 3, the inspection jig driving device 43 includes an X direction in which the inspection jig 41 is moved in the X direction for the subject. The jig driving unit 43 is connected to the X-direction jig driving unit 4 3 X and moves the inspection jig 41 in the γ direction. The γ-direction jig driving unit 43Υ is connected to the Υ-direction jig driving unit 43Υ and makes The Θ rotation jig driving unit 43 0 that rotates the inspection jig 41 about the Z axis, and the Z direction jig driving unit 43Z that is connected to the 0 rotation jig driving unit 43 0 and moves the inspection jig 41 in the ζ direction. The inspection jig driving device 43 is controlled and driven by the control unit 44.

The inspection jig 41 includes a holding plate 411 capable of holding a plurality of contact terminals 42, and a mounting plate 412 for mounting the inspection jig driving device a. The retaining plate 411 and the mounting plate 412 are rectangular plates of the same shape, and a predetermined interval is set by a spacer and connected into a box shape. The plurality of contact terminals 42 are arranged in a two-dimensional array, and are provided at the center of the holding plate 411 and correspond to the substrate to be inspected.

548413 V. Checkpoint of invention description (25) 11. Each contact terminal 42 is supported in the protruding direction by the end portion of the contact terminal 42 (on the side of the circuit combination of the substrate to be inspected) protruding outward from the outer side of the holding plate 411, and the base portion is protected from the connection = 41 The inside of 1 protrudes inward. At the base of each contact terminal 42 = there is a signal line 'This signal line is connected to a scanner 0 described later. : L μ Fix the mounting plate 4 1 2 on the mounting surface of the end of the inspection jig driving device 43 so that the inspection jig 41 can be installed on the inspection jig driving device. Therefore, the inspection jig driving device is driven by the control unit 44 Each 43 of 43 = 43 ×, 43Υ, 43Z, 43θ, so that the position of the inspection fixture 41 can be relatively determined, and the inspection fixture 41 can be relatively determined, and the inspection fixture 41 can be placed on the upper side; Each contact terminal 42 comes into contact with or separates from a predetermined waste of a wiring combination formed on the earth plate 11 to be inspected. The contact position (inspection position) of the existing phase: 2 substrate inspection device 1, 4 support racks set on the rotating table 61 are sent to the inspection station γ | m 11 | Move them from the loading position in sequence The inspected 11 is provided with a plurality of contact terminals 42 of the inspection jig 41. The wiring combination of the substrate 11 is in contact with each other to perform the inspection. Therefore, the two inspected substrates 11 and u are transferred to the inspection board 11 of the i. ?, 1 1 It is necessary to make each contact terminal 42 of the inspection fixture 41 accurately contact with a board inspection and / or wiring combination provided. Therefore, it is necessary to obtain the wiring for controlling the driving inspection because it is connected to the substrates η and ι of the inspected substrate. Page 29 548413 V. Description of the invention (26) " ~ * ----- Fixture 41, The correct position information of the substrate to be inspected is set in the XY coordinates of the desired positional relationship between the inspection jig 41 and the substrate to be inspected n. In other words, as shown in FIG. 7, at the inspection position p3, it is necessary to define the CxCy coordinates of the substrates u and η to be inspected on the support frame 13 of the rotary table 61 and to control the drive of the inspection unit 4 in the inspection unit. The XY coordinates of the set a (see FIG. 2) are consistent, and the position information of the inspected base ^ 11 in CxCy coordinates is used as the position information of the inspected substrate n in χγ coordinates. Furthermore, since the position information of the substrate n to be inspected is used as the deviation information from the reference position in the reference position, it is detected by the position deviation detection unit 3, so it is necessary to make the CxCy coordinates and The XY coordinates are consistent, and the deviation information can be reflected as the deviation information from the reference position in the χγ coordinates. Since the inspection unit 4 and the position deviation detection unit 3 also have the same driving control device independent of the square turn table 61, the inspection of the fascia board in this embodiment ^ $ 1 has the same use as the position deviation detection unit 3. Method to adjust the function of CxCy coordinates and XY coordinates (hereinafter this function is called automatic correction 2). The automatic correction 2 will be described in detail later.

The coordinate adjustment of the CxCy coordinate and the χγ coordinate (that is, the positioning of the inspection jig 41 of the inspection unit 4) is taken by the camera set at the predetermined position of the rotating table 61 on the surface of the holding plate 4 11 adjacent to the rotating table 61 A set of positioning marks 49A, 49B (such as dot marks, etc.) at the predetermined position of the ship is used to correct the XY coordinates of the inspection section 4 and the Cx, Cy, and coordinates of the rotary table 61 using the photographic image. Position deviation. As shown in Fig.1 and Fig.2, in the long hole set along a 45 ° radius position relative to the reference angle of the rotating table &

548413 V. Description of the invention (27) 5 5 Face up and side up, and you will pay. For example, as shown in Fig. 8, the optical axis and the moving path S of the fixed-frame 4 projector 55 are arranged in the direction of the horizontal axis M with respect to the horizontally rectangular Paula HWA, 49B. In addition, the symmetrical position of the "center 0" of the holding plate 4U is not limited to the example of Fig. 8. It is also 0, and the formation positions of 49A and 49B are noted, and a plurality of pairs of positioning marks are formed at the symmetrical positions to be recorded at the center 0 of the holding plate 411. The position of camera 5: ^ set on any table 61 is also used for positioning by rotating this photographic image, marking f bits 49A, 49β, and ^ = of the rotating table 61 = two pictures ^ picture As shown in Figure 2, in the long hole set by the phase, photography; the predetermined position of the 56 vertical radius 49A, =; 5 heads 5 乂 6 have the same structure, all have positioning marks, Si 2 times the field of view. And The camera and the + 5 Λ position are not limited to -45. The angular position and the radius of the +135 angle position. It can also be set at a half angle of any angular position that does not conflict with the supporting frame configuration member. One = shown as The connection structure when the control unit 44 and the like of the main body of the apparatus, which are different from the cameras 55⑼ and ϋΓϊ installed on the rotating table 61, are electrically connected together. Since the cameras 55 and 56 are installed on the rotating table 61 that performs rotation Up, mil heading and rotating table 61 set The circuits for supplying power to the cameras 55 and 56k of different device main bodies, the circuits for inputting data such as photographic images, and the cameras 55 and 56 are simply connected by wires. Therefore,

2014-4599-PFN.ptd 548413 V. Description of the invention (28) In the substrate inspection device 1 related to this embodiment, the contact device 100 provided at the lower part of the rotating table 61 is used to turn on and off the camera 55. , 56 and the main circuit of the device (not shown, for example, the power supply circuit of the cameras 55, 56 and the circuit for performing predetermined calculations, etc.). When the cameras 55 and 56 are operated, the contact device 100 is opened, and The circuit on the main body side of the device is connected to the cameras 55 and 56. With this structure, the related problems can be solved. The contact device 100 is composed of a first contact portion 1 10 provided at a lower portion of the rotary table 61 and a second contact portion 12 provided at a base side of the device body. The first contact portion 110 includes a plurality of conductive wires 112 which are arranged in a circular arc shape at a predetermined interval below the base member 111 along the arc-shaped base member η of the edge table 6]. One end of the lead wire 112 is connected to the corresponding position of each of the cameras 55 and 56, and the other end is open. In this embodiment, a pair of power cords and control lines and data output lines of each camera are provided. A total of 6 wires 112 are connected to the power cord and the power supply of the cameras 55 and 56. The control line is connected to the camera. The control connectors of 55 and 56 are connected, and the output line is connected with the output connectors of the cameras 55 and 56. The second contact portion 120 is composed of a plurality of brushes (6 in this embodiment) of the brush 122 and the displacement member 123. Among them, the plurality of brushes 122 are placed on the support member 121, and the displacement member 123 is a sub 122, which can be Air cylinders, etc. Brush Dan W at the starting point of the toilet thunder, one of the brushes corresponding to the source line, and a brush that is far from the power source (illustration omitted) installed on the main body side of the device 1 2 2 The child should be on the control line] Child 122 ... The control unit 44 on the main body side of the device (see Figure ⑴ 2014-4599-PFN.ptd page 32 548413)

Then, the brush 122 corresponding to the data output line is connected to the image processing unit 45 (see FIG. 3) provided in the apparatus main body.

The supporting member 1 21 is fixed to the top of the piston rod 23 of the air cylinder 丨 23 & through the expansion and contraction of the piston rod 123a, the contact device 1〇 () can be located, and the lead 112 and the second contact portion 110 of the j The ON state where the brush 122 of the contact portion 12 is in contact (the state indicated by the two-dot chain line in FIG. 9), and the non-connected state where the lead wire 112 is separated from the brush 122 (as indicated by the solid line in FIG. 9). Status). Furthermore, in the above-mentioned automatic correction 2, when the cameras 55 and 56 are used, the contact device 100 is brought into the ON state by operating the displacement member 123. The cameras 55 and 56 fixed to the rotating table and the cameras 55 and 56 provided on the main body side of the device The circuits are electrically connected together, and the cameras 55 and 56 can shoot. In addition, since the cameras 55 and 56 are not used during normal inspection, the contact device 100 can be set to a non-on state.

In addition, "when the contact position of the second contact part 1 2 0 of the rotary table 6 1 does not change", that is, the situation where the cameras 5 5 and 5 6 stop at the inspection position, and the automatic correction 2 is performed only by the inspection jig. Next, a contact electrode corresponding to the lead wire 112 of the first contact portion 110 may be provided at a contact position when the cameras 55 and 56 are located at the inspection position. In the automatic correction 2 of this embodiment, in order to rotate the rotating table 61, the cameras 55 and 56 can be moved to the positions where the positioning marks 49A and 49B of the inspection section 3 can be captured. Therefore, the guide wire 112 is set in a track shape. Therefore, when the cameras 55 and 56 move a predetermined angle range (that is, the contact position of the second contact portion 120 of the rotary table 61 is changed), the cameras 55 and 56 can be accurately operated. Returning to FIG. 3, the control section 44 is controlled by CPIKCentral Processing

2014-4599-PFN.ptd Page 33 548413 V. Description of Invention (30)

Unit) > ROMCRead Only Memory), RAM (Random Access, Memory), etc. In r0M, a program for automatically correcting i and 2 and a program for inspecting the inspection process of the substrate 11 to be inspected are memorized. The CPU reads these programs from ROM, stores them in RAM, and executes these programs according to the instructions input from the operation panel 48 to realize the functions of automatic correction, 2 and board inspection. The image processing unit 45 performs a predetermined process on the photographed images input from the cameras 31, 55, and 56, and then inputs the processing result to the control unit 44. Specifically, e, the origin mark T0, the positioning marks 12A to 12D, and the fixture positioning are calculated.

At the same time as the marker image centers of the markers 49A and 49B, the position of the marker image center in XY coordinates with the center of the screen as the origin is calculated, and the calculation result is input to the control unit 44. As described above, this origin mark τ can be used when adjusting the origin of the rotary table 61, the position deviation detection unit 3, the inspection unit 4, and detecting the deviation of the substrate n to be checked from the standard position. The positioning information 12A to 12D, the positioning information of the positioning marks 49A and 49B of the jig 0, and the tester controller 46 control the inspection of the inspected substrate 11 performed by the substrate inspection device i. The tester controller 46 starts the operation of the control scanner 47 to inspect the substrate 11 to be inspected when an inspection start signal 'from the control unit 44 is input. After the contact between the contact terminal 42 of the inspection unit 4 and the wiring combination of the substrate n to be inspected is completed, the control unit outputs an inspection start signal to the tester controller 46. The scanner has a DC power supply, a switch group that switches between this power supply and signal lines connected to each contact terminal 42, and the wiring to determine the substrate to be inspected.

548413 V. Description of the invention (31) Bad judgment section. The switching control of the switch group of the scanner 47 is performed by measurement. The tester controller 46 is set in advance according to the switch combination of the switch group = the controller 46 and the wiring combination of the board 11. This switch group Kang: The inspection base is based on the plurality of wiring combinations of the substrate U being inspected in order to switch the connection U in order. The judgment unit determines whether each wiring combination is on or off. For example, when it is turned on, the judgment unit detects each Wiring group 状态 2 status. By comparing this detection value with a predetermined threshold value, the wiring combination is good or bad. Then, this judgment result is input J 46, and then through the tester controller 仏 input control section ". The inspection of the control line combination is completed, even if there is only one defective matching section 44, the inspected substrate 丨丨 As defective products, all of the two'f systems are good, so this substrate is inspected. 丨 丨 It is regarded as a good product. The operation panel 48 is a line inspection device for the operator. At this time, the information inputted by the pretending panel 48 for inputting necessary information is inputted to the control section 44. The operation procedure of the automatic correction 1 will be described from the following details. As described above, the automatic correction 丨 makes the position detection set on the rotary table 61 wide. ”The Cx'Cy 'coordinate of P2 is consistent with the J CxCy coordinate set in the position deviation detection unit. This coordinate adjustment is performed through steps si and, where the step position is to adjust Cx, Cy, the origin of the coordinates is set), and step S2 is to calculate the origin position is adjusted ": Cx Cy coordinate and position deviation of slave turn table 61 Detection section 3iCxCy coordinates 548413

f point deviation amount. This deviation amount is used as the correction value of drive 1 of the position deviation detection unit 3. The software adjusts Cx, Cy, coordinates, and CxCy coordinates to 0. As shown in FIG. 10, step S1 is, When assembling the substrate inspection apparatus 1,

On the rotating table 61, set the origin mark T0 as the origin position, the diameter direction as Cy, the axis and tangent directions as Cx, the axis Cx, cy, and coordinates. When rotating the rotating table, 61, rotate this Cx Cy 'coordinate. When you move to the position deviation detection position, you can calculate the rotation position of the rotating table 61 that makes the CxCy coordinate axis and Cx, Cy, and the sitting rod axis of the coordinates parallel to each other (origin oc in Figure 10, move to ^ point 〇c Rotation position). In other words, the origin position of the CxCy coordinate in which the coordinate axis of the ^ -coordinate and the coordinate axis of the Cx 'Cy' coordinate are parallel to each other is calculated. The specific operation steps of automatic correction 1 are as follows. First, the board inspection device 1 is turned on by turning on the power, and the rotary table 61 is rotated to cause the control unit 44 to display the output of the rotary encoder. According to the output of the rotary encoder, when the rotating table 6 丨 is detected to be close to the origin position, the control section 4 slows down the rotating speed of the rotating table 61 to improve the detection accuracy of the rotating position. When it is detected that the rotating table 61 has reached the ^ position When =, stop rotating table 61.

According to this, after the rotary table 61 is set at the origin position, the rotary table 6 is rotated by a predetermined angle (in this embodiment, θ 1 = 1 35.), and the origin mark T0 is moved to the position deviation detection position P2. At the same time, the Cx-direction driving section 32X and the Cy-direction driving section 32Y of the camera driving device 32 are operated to move the camera 31 to the origin of the CxCy coordinates. For the positioning of this origin, first operate the Cx ^ direction driving section 32X, and drive the camera 31 in a predetermined direction (for example, + direction) of the cx coordinate. The detection member moving with the camera 31 is connected to the limit switch.

548413 V. Description of the invention (33) Touch the 'Fine Limits ^ The detection position of the limit switch is reversed according to the driving direction of the camera 31, and then settled from the direction Cx of the boundary. Move the camera 31 to determine the camera 31 Camera 31 From the limit switch, check the Xinguan and Cy directions. In the same procedure, determine the position of the fixed t / ® D origin according to the position of the photographic camera 31 after moving at a predetermined distance. With this, the initial position where the camera 31 is mechanically opened is the mechanical origin% (0, 0). ^ ^ ^ ^ ^ ^ ^ ^ ^ The focus of camera 31 in Nonaka, (蚩, 0 疋 at the mechanical origin 0M (〇, 〇) ;; move to / set the deviation detection position ^ 彳In other words, since the MiL detection unit 3 ′ of the camera cannot be ideally assembled, the origin mark το will often deviate from the narrow field of view of the camera 31. Qiqiu, 'moves the camera 31 so that the origin mark τ0 enters the camera 31Ϊ: You have taken the camera 31 to capture the origin mark T0. Then, based on this ~~, calculate the deviation between the center of the image of the origin mark T0 and the center of the day (5 x 2, 5 y2) ^, Then calculate the deviation of the origin mark T0 from the mechanical origin by 0M (6x1 + 6x2, 5yl + 2) 'to calculate the origin mark τ from the deviation amount and the movement amount of the camera 31 (accounting for y 1). The mechanical 1 ± position of the camera 31 (the position of the origin shown by the Cx Cy position 〇c) when the image 〇 is captured in the field of view of the camera 3, 1 is the assumed origin Os of the cxCy coordinate. Here In the state, only the coordinates of the origin 0c and ^, Cy, the coordinates of the origin Oc, are consistent, because the coordinates of the two coordinates have not been confirmed. Degree axis parallel standard, so it is assumed that the origin 〇s Next, the rotary table 61 of the present position as a reference position of the rotation angle of the

2014-4599-PFN.ptd Page 37 548413 V. Description of the invention (34) Let the original hypothetical origin be shifted by 0s if the Cy axis and cy field of view, and the Cy axis to (X 0 1, Y < 9 camera 3 1 field of view camera 3 1), so that the original origin mark T 0 is captured to the above camera. The amount of deviation of the center is assumed to be a point T0 image if the origin 0s point mark TO moves to the position of the origin 'axis phase one and Cy' axis 1). Calculate the position of the original CxCy sitting point 0 s when moving images, and move from this position on the CxCy coordinate, the moving position (X 02, Y 0 hour hand from the reference point of the rotation angle mark T0 from the reference position rotation hypothetical origin The CXC y coordinate of 0 s is shifted by cy2), and the rotating table 61 is rotated clockwise only in the CxCy coordinate by the following formula (0 = 0), and the camera 31 is moved from the standard δ to TO. The moving position (X 01, γ 01). When the 'origin mark § 0 has entered camera 3 1 is inconsistent, even if the camera 3 1 is moved', the origin mark τ will not be entered, so it is necessary to further appropriately adjust the moving camera to enter the camera 3 1 The field of view is thus taken, so 'based on the amount of movement of the camera 31 in the field of view, the center of the field of view, and the center point mark TO of the origin mark are turned by +10. Coordinate position (cxl, Cyl) in the time origin mark τ〇. Secondly, 'turn the rotating table 6 1 back to the original position. Assuming that it is rotated 10 ° counterclockwise, the origin mark T0 and the camera 31 are moved to the original mark TO 2 at the same time. The method of 0 ^ calculates the coordinate position (CX2, cy2) of the origin mark T0 in the middle when the original revolution is moved by 10 °. Then, use the origin to mark the CxCy coordinates (cxl, cyl) at the rotation, (cx2, ^ c = tan_1 {(cyl — cy2) // (cxl — cx2)} · (1) δ The deviation angle 0c of the Cy axis and the Cy axis, the deviation angle 0c of the rotation angle of the rotation table 61 from the reference position, so that the CxCy coordinate and the Cx'Cy 'coordinate

2014-4599-PFN.ptd Page 38 548413

Parallel to each other. Thereby, the processing of step s 丨 ends. In addition, it can be clearly seen from the above-mentioned formula that if the Cy axis and the Cy and the axis are parallel to each other, the origin point TO is rotated by ± 10. The moving position at this time is symmetrical with respect to the Cy axis, at this time cyl = cy2, 0 c = 0 〇 Then, the process of step S2 is started. By turning the deviation angle of the rotary table 61, the position of the origin mark TO in CxCy coordinates changes. Therefore, the camera 31 needs to be moved to the origin mark again to move the deviation angle 0 c. ≫ Take an image of the origin mark τ〇, and calculate the movement position of the origin mark To based on the image of the photographic shirt (assuming the origin is in the position (Cxh, Cyh)). Correct the angle of the reference position of the rotation angle of the rotating table 61, and at the same time, correct the origin position used to control the driving camera 3 to (Cxh, Cyh), thereby enabling the driving control of the rotating table 61 And the CxCy coordinates and Cx, Cy, coordinates of the camera 31 are consistent. Thereby, the processing of step S2 ends. Therefore, the correction value calculated by the automatic correction 1 is reflected in the rotation control of the rotary table 61, and the correction value of (Cxh, Cyh) as the origin is reflected in the drive control of the camera 31, thereby, substantially, The CxCy coordinate and the Cx'Cy 'coordinate can be made consistent, and the placement position of the substrate to be inspected can be detected by the position deviation detection section 3 with a higher accuracy (specifically, the amount of deviation from the reference position). Next, the operation sequence of the automatic correction 2 will be described. Because the automatic correction 2 of the upper inspection unit 4U and the lower inspection unit 4D are basically the same: Therefore, in the following description, only the upper inspection unit 4U will be described.

548413, description of the invention (36) As mentioned above, the automatic correction 2 causes the Cx 'Cy of the rotating table 61 moved to the inspection position by the rotation of the rotating table 61 (the same coordinates as the corrected 2CxCy coordinates) and is set in the inspection section 4 The χγ coordinates are consistent. This coordinate adjustment is to accurately set the mechanical origin of the 4xγ coordinate of the inspection unit with the main jig, and to detect that the XY coordinate and the rotating table 6 are rotated away from the original when the CxCy coordinate is moved to the inspection position P3 by the coordinate rotation. The deviation amount of the points is used as a correction value of the drive control of the inspection unit 4 to control the χγ coordinate and the CxCy coordinate. $ Specifically, first, a main jig having a jig positioning mark and 49B accurately formed is installed instead of the inspection jig 41, and each jig driving section 43X, 43Y, 43Z, 43 of the inspection jig driving device 43 is operated. ≪ 9. Move the main jig to the origin of XYZ 0 coordinates. With this movement, the initial position of the XY coordinate of the mechanical setting master = ^ is taken as the mechanical origin ^ Moreover, the mechanical origin setting of the main production tool is the same as the original position setting port of the camera 31 described above, and is Drive the jig to the collision limit switch in the direction of the coordinate axis, and then drive a predetermined amount in the reverse direction. In addition, the formation surface of the jig positioning mark of the main jig is the same as that in FIG. 8 except for the contact terminal group. π i # 1 «3 Λ Α rotates the rotating table 61 1 clockwise from the mechanical origin (the state in FIG. 1) 135 to move the camera 55 to the inspection position p3. Through automatic correction, the driving control of the rotary table 61 is corrected with a correction value θο, thereby moving the photographic drag π to the inspection position ρ 3 + + ^ ^ ^, the first axis of the camera 55 and the rotary table At 61, the CxCy coordinate origin 0c of the inspection position P3 is consistent. The main fixture of the camera moves only ~ 25mm in the X axis direction, moves the fixture position W49A to the mechanical origin V, and at the same time, moves the camera 55

548413 V. Description of the invention (37) Move down to a position where the positioning mark 49A can be identified (camera 55). If the CxCy and XY coordinates are the same, the jig positioning mark ^ The image center should be at the center of the day and day of the camera 5 5. If θ ^ $ is calculated to calculate the deviation between the two centers, move the attending appropriately: = and the positioning mark The image center of 49Α enters camera 55 on the day and shoots σ :, the image with positioning mark 49Α. ‘From this photographic image ^ the deviation between the center of the image and the center of the frame of the positioning mark 49Α 1 /

Yla), and then the deviation (AXU, ΛΥΗ) and the attending and ^ Dan «

Fixture positioning mark 49 in CxCy coordinates (△ (Xa, Ya) = (AXia + △ xh, AYla + is called &). Set it: owe, move the main fixture back to the mechanical origin%, and then, at χ The axis moves the main jig +25 dragons, so that the jig positioning mark 49B is at the mechanical = original: 0M, and at the same time, the camera 55 is lowered in the direction of the Z axis to a position that can be recognized & 49B (the focus position of the camera 55). The image does not enter the screen of camera 55), just like the second result. The deviation between the center of the image of the 49B shirt and the center of the screen is the deviation (AXlb, and the attending and ’, and then

Yb) i (AXlb + Axl f ^ ^ ^ ^ 49B ^ ^ £ (Xb >) (Δχ1 & + Λχ2ΐ3, ΔYib + AYZb).

Ya) i γΐ ^ ^ # l & 49A ^ 49B ^ CxCy ^ J

CxCyn Pickup Correction Δχ, △ [

2014-4599-PFN.ptd Page 41 548413 V. Description of the invention (38) Positive values (ZXX, ΔΥ) are correction values that make the origin of XY coordinates 0 and the origin of CxCy coordinates 0c consistent. The correction value is eight. 0 (1 is the angle correction value that makes the coordinate axes consistent after the origin of the χγ coordinate axis and 0 axis are adjusted. △ + Xb) / 2… (2) △ Y = (Ya + Yb) / 2 (3) △ 0d = tan -l {(Yb -Ya) / (Xb -Xa)} (4) Secondly, according to the correction values △ X, △ Y, △ 0 d, confirm that the XY coordinates are on the drive control of the inspection unit 2 ( That is, in the software) whether it is consistent with cxCy coordinates. This confirmation is that after setting the main fixture at 0s of the software, use the camera 55 to capture the fixture positioning marks 49A, 4 9B of the main fixture, and calculate the CxCy coordinates of the fixture positioning marks 49A, 49B from the photographic image. Position based on this calculation. In other words, after the main jig is moved to the mechanical origin OM ′, each of the jig driving sections 43X, 43Y, 43Z, 43 0 of the jig driving device 43 is inspected with the correction values ΔX, ΔΥ, Δ 0d to make the main jig. Move to the origin 0S in the software. If the X γ coordinate and c χ C y coordinate are consistent in this state, the fixture positioning marks 49A and 49B of the main fixture should be at positions + 25 mm and 25 mm of the Cx axis of the CxCy coordinate, respectively. First, rotate the rotary table 61 in the + direction at a predetermined angle Θ, so that the camera 55 is exactly aligned with the +25 mm position. For example, if the optical axis position of the camera 5 5 of the rotating table 61 is about 350 mm from the center of rotation 0T, then 0 = tan-i (25/350) and 4.09. . Then, the fixture positioning mark 49A is captured, and the position (Cxa, Cya) in the CxCy coordinates of the fixture positioning mark 49A is calculated based on the captured image and the movement amount of the camera 55. Secondly, rotate the rotating table 61 in one direction at a predetermined angle 0 to make photography

2014-4599-PFN.ptd Page 42 548413 V. Description of the invention (39) C25 axis aligned with the CxCy coordinate -25 random position method to shoot the image of the fixture positioning mark 4 9 β, free & '55 of Jiang Xudan 呌 Zeng + ▲ 目 + like this image and camera fruit χγίί (: Γ ϊΐ, mark the position of 49B (Cxb, Cyb). Such as 0+ ^ zhi, the fixture positioning mark 49a of the main fixture ^ ya 〇 / αThe coordinates of the Cy coordinate Cyb of the tool positioning mark 49B are the same as & so 'comparing two Cy coordinates can determine the XY coordinate and CxCy consistency. If the XY coordinate and CxCy coordinate are within the allowed range, ST STί 部 4 The parallel combination with the position deviation detection unit 3 is adjusted, and the above automatic correction 2 and coordinate adjustment are reconfirmed. The inspection # 4 of the lower inspection device 4D by the inspection fixture drive & χ43 $ $: the inspection fixture 4RXY coordinates and Rotate the table 61. The camera 56 can be used in the same way as described above. Therefore, Λχ, Δγ, and Δ = calculated by the automatic correction 2 are reflected in the inspection jig driving device 43. In drive control, the confirmation step During the initial assembly and adjustment, the coordinates of 0 and 3 can be aligned, and the contact position of each contact terminal 检查 of the inspection jig 41 and the wiring combination of the substrate 11 to be inspected which is transported to Ϊ 3 准 is accurate. In addition, In the above description of the embodiment of the present invention, when the positioning marks 12A to 12D and the origin mark τ0 of the substrate 11 to be inspected are automatically captured by the camera 31, and the determination of the inspection rule 41 is automatically captured by the auxiliary cameras 55 and 56: markers At 49A and 49B, move the camera to a predetermined position where the marks can be taken into the camera's field of view, and then shoot. When manually shooting, while using the camera, check whether the mark has entered the camera on the day and time.

548413, invention description (40) When moving the camera or the field of vision at the same time, stop the camera. {嫱 七 本 士 — a ‘mouthpiece’ stop the camera or check the movement of the jig at the entry mark.疋 The following describes the substrate inspection connection of the substrate inspection apparatus # + u% aa FIG. Η is a schematic diagram illustrating the operation of the substrate inspection. Φ \ / ^ 1 \ 〇 Timing chart. In this figure, P! Supports the control plus 3 疋 = operation; the signal timing diagram of the carry-in position 2 of the carry-in unit 2 and the rotary table 61 θ wood substrate holding mechanism 70, (e), (n 疋 control 刼 for position deviation detection C of Part 3) (f) ::: = 上 (i) i '': 操 = ί

The segment is a signal for the rotation of the rotary table 61. Turn-on (high level) time Feng is the rotation time period of the square turntable 61 and the static time period of the J turntable 61. ΚLow level) The time period is 1CS ^ ^ ^ ^ f (^ ^ ^ ^ ^ ^ ^ ^ 1 The swelled dandan is transported and assembled on the arm of the chuck Γ holder 13 of the base plate 11) ， Hold the inspected ΐ ΐ) Λ · Still level time period (catch the 11 plate lock time period of the inspected substrate, and the low level time period (; # ϋ #: time period for inspecting the substrate u) is the card m The time period during which the change occurs is the chuck y 'and the level period. The time when your time interval f is being locked CS1 2 · Control operation moving unit 2 The lift interval is the second V of the lift arm in the lift position, : When the wide-high position is on time when the lower arm is in the lowered position n * and the & level period is the period of the lifting position. And the time when the level changes mm 2014-4599-PFN.ptd page 44 548413 five 4. Description of the invention (41) is the time period when the lifting arm is rising or falling. CS13 · Control operation is located in the carry-in position ": Γ The quasi-time period is when the substrate holding mechanism 7 is opened by the chuck of the substrate 11 The period of time (by the slave (the inspected substrate η is fixed to the support frame 13 = the time period of the change is the chuck positive Open or 2 o'clock < 1 Wei Yue ϋ 1. Signal to control the camera operation of the camera 31. The high-level time slave is in the time period during which the photography operation is being performed, and the low time is during the time during which the photography operation is in progress. The segment is Γ at 2 who controls :: the signal of the movement operation of the camera 31. The period of time when the high level operation is performed. The period of the low level is the period during which no mobile operation is ordered. ≪ Ancient position 2 J, check The signal of the movement operation of the jig 41 in the χγ direction. 时间 The time a of the movement operation is being performed, the low level time & 疋> There is a time period for the movement operation. W Control the movement operation of the inspection tool 41 in the two directions ( The high-level time period is the interval between the inspection jig 41 in the lowered position (the time period when the contact terminal 42 is in contact with the substrate 11 to be inspected), and the low m: t: the inspection jig 41 is in the ascent The time period of the position (the time period when the contact end is not in contact with the substrate 11 to be inspected). The time period when the level is 3 is the time when the inspection jig 41 is rising or falling 4 and 0.

Page 45 · 2014-4599-PFN.ptd 548413 V. Description of the invention (42) ------ Taxi CS33: Signal for controlling the inspection operation of the substrate 11 to be inspected. The high level time period is the time period during which the inspected substrate is being inspected, and the low level time period is the time period during which the inspected substrate is not being inspected. CS4 1 · A signal for controlling the substrate holding mechanism 70 of the support frame 1 3 being carried to the carrying-out position p4. The low level time period is the time period when the chuck that holds the substrate to be inspected is held by the substrate holding mechanism 70 (the time period during which the inspected substrate u is not fixed to the support frame 13), and the high level time period is the chuck lock. Time period (a time period when the substrate to be inspected U is fixed to the support frame 13). And the time period when the level changes is the time period when the chuck is being opened or locked. Where = 4 Stomach 2 ·· Controls the signal of the lift arm of the carry-out section 5. The high level time period is the time period when the lifting arm is in the rising position, and the low level time period is the time period when the lifting arm is in the lowering position. In addition, the period during which the level changes is the period during which the lift arm is rising or falling. CS43: Controls the lift arm of the carry-out section 5 (used to grasp the substrate 11 to be inspected and the arm to be conveyed to the storage machine 8), and signals to grasp the substrate 丨 丨. The low level time period is the time period when the chuck is opened (the period during which the substrate 11 being inspected is not grasped), and the high level time period is when the chuck is locked and the door 4 is again (the time period when the substrate 11 is inspected). In addition, the period during which the level changes is the period during which the chuck is being opened or locked. Fig. 11 is unintended that after assembling the two substrates to be inspected 丨 i, 丨 丨 to the supporting rack 丨 3 in the carrying position p 1 of the rotary table 6 1, the rotary table 6 1 is rotated + 9 0 at time μ and transferred. Until time 11 0, the deviation detection position P2, the inspection position p3, and the carry-out position p4 are simultaneously placed at the carry-in position ρ 丨 and the position p4.

2014-4599-PFN.ptd Page 46 548413 V. Description of the invention (43) Checking the moving of the substrate 11 Γ $ + n, t and moving out of the substrate = operation :; detection of the set deviation, inspection of the circuit type mo 'When the rotation operation of the rotating table 61 starts, once the rotation of the rotating table 61 is stopped, the operation of the carrying-in section 2 and the carrying-out section 5 is turned ^: i = B! The time from t0 to time t2 is to turn the rotating table 61 =. Time 'is θ according to the rotation speed of the rotary table 61. That is, at the carrying-in position P1, while the lifting arm of the carrying-in section 2 is set to the upper position (the control signal CS12 is maintained at a high level), the rising chuck is Locked (control signal CS11 is maintained at a high level) ❶ This is a type of moving the next two substrates to be inspected n, 11 from the carry-in position pi to the rotary table 61 in the time period during which the rotary table 61 rotates, and the carry-in unit A case where the two inspected substrates η, 11 supplied by the feeder 7 are transferred to the carry-in position ρ 丨. Further, by the rotation of the rotary table 61, the chuck of the substrate holding mechanism 70 of the support frame 13 moved from the carry-in position p to the position deviation detection position P2 is locked (the control signal CS13 is kept at a low level). This is a case where the two substrates 11, 1! To be inspected, which are transported to the position deviation detection position P2, are fixed to the supporting frame 13. In addition, at the carrying-out position P4, the lifting arm of the carrying-out section 5 is set to the upper position (control 彳 § ί 虎 CS 4 2 is maintained at the surface level), and the chuck of the lifting arm is locked (control signal CS 4 3 remain low). This is a kind of ^ one for carrying out the inspection of the two inspected substrates 11 and 11 from the carry-out position P4 to the storage machine 8 during the rotation period of the rotating table 61, and the two inspected by the carry-out section 5 Substrates 11, 11 and carry-out positions from the rotary table 61

2014-4599-PFN.ptd p. 47 548413

When the support frame P3 of P4 is conveyed to the storage machine 8. In addition, the chuck of the substrate holding mechanism 70 of the support frame 13 carried to the carry-out position P4 of the rotary table 61 is locked (control signal CS41 is maintained at a high level). This is a case where the two substrates u and n to be inspected which are sent to the carry-out position P4 are fixed to the support.

On the other hand, at the position deviation detection position P2, the driving of the camera 31 is stopped (the control signal CS22 is inverted to a low level) at the same time that the turning operation of the rotary table 6 ^ is started at time t0. At this time, when the next two substrates to be inspected j, 11 are transported to the position deviation detection position P2, the camera 31 is set to the reference position of the CxCy coordinate where the positioning mark 12A of the other substrate to be inspected 11 is located. In addition, since the position deviation detection processing of the substrate is not performed during the rotation of the rotary table 61, the photographing operation of the camera 31 is not performed (the control signal CS21 is kept at a low level). ’,

• At the inspection position P3, at the time t0 when the rotation operation of the rotary table 61 starts, the inspection jig 41 starts to move to the inspection position P3 relative to the next two substrates u and n to be inspected (the control signal CS31 is inverted to a high position) Before the next two inspected substrates 11 and 丨 are transported to the inspection position p3, the movement is ended (at time u before time t2, the control signal CS31 is inverted to a low level). During the movement of the inspection jig 41, the deviation amount of the two inspected substrates u, n from the reference position of the Cx (: y coordinate below) detected by the position deviation detection position P2 is used as a correction value. Ascending position ^, the inspection jig 41 moves from the position deviation detection position p2 to a predetermined position of the χγ coordinate, where the predetermined position of the χγ coordinate is a predetermined for each contact terminal 42 and circuit type of the 2 soil plates 11 11 being transported. Contact position

548413 V. Description of Invention (45) Stop, 5 2 ί61 rotate 90 clockwise. At the time t2, the rotation operation is stopped. Set the P1 'to set the next two substrates to be inspected, and set the CD ==,' The lift arm of the carry-in unit 2 starts to descend (the control signal is set; the drop = 罟 transition ). At time t3, the lifting arm of the carry-in unit 2 is lowered to the second lowering position, and in order to keep the lifting arm at its lowered position, the two control positions are controlled. On the other hand, in order to grasp the 70 held by the lifting arm, that is, 1 plate 1 11 to the substrate holding mechanism a ^ ^ of the substrate holding mechanism a ^ ^, the cooking chuck starts to be opened (the control signal CS11 passes over to a low level) ). At time U, when the chuck of the lift arm is fully opened, two 1: iiUiU are installed to the substrate holding mechanism 70 of the support frame 13 / # Γ " $ 、 之 盘 is kept open (control signal CS11 is held ί The timing of setting the time is to make the lifting arm in the control wide dream = 1? ^ Second, the lifting operation to move the lowering arm to the rising position (controlling the ϋ direction: level transition). At the time ⑶, the lifting arm is raised to the current level. The rU y · two lifting arms are held in this rising position (the control signal C S1 2 is held at the south level). For the purpose of the field writ A, the two fixed arms are fixed to the support frame 13 two: soil, 11, and Started the operation of the cam mechanism 80 of the substrate holding mechanism 70 (transition of the control signal CS13 to a low level), and at the moment of time, the state was maintained as soon as it was fixed (the control signal CS13 was maintained at a low level). As soon as the rotation of the rotating table 61 at the detection position "m2" is stopped, the camera 31 starts to take pictures of the positioning marks 12A to 12D.

548413 V. Description of the invention (46) Video, = this photographic operation-until the rotating table-a rotation operation. Positioning mark 12A ~ / The time of m2, t4, t6, and t8 at the beginning of the data is 12 = photographed; ^ work can be traced to the camera according to the photo of camera 3 1 * m when the interval between the two timings is "worked" The camera 31 is required to move with the camera 31. t Set the camera 31 to the reference position of the positioning mark 12A in the coordinates. Therefore, when the force is pulled, the two inspected objects are transported. Beautiful board n ^ Rotating operation of the rotating table 61 -...] Positioning mark 12 "11" in particular: "Danmen." For this reason, at time t2, the rotating operation of the rotating table 61 is performed at the same time by 'shooting the positioning mark 12A through the camera 31 until time t2a (control signal ⑽ & turned to high level). Photograph: It takes 2m2 to time ^ The segment is the time Ua of the photographing operation f of the camera 31. The camera 31 performs a photographing process on the positioning mark 12A by the agency it: the in-position mark 12B performs the photographing processing, and then stands up to the positioning mark). Then, at time ", photography_: shift; Ϊ 2 controls ΒΓ: ί, reverse to low level) 'is set by camera 31 1: til photography until time t4a (control signal reverses at 12, level) The time period from time t4 to time t4a is also the time required for the camera to perform the photographing operation, which is substantially the same as the time period from time to time m. R Ϊ I i In the same way, the camera 31 moves to the positioning mark 12C at — Movement processing and photographic processing of the reference position of χ Υ ΛΛ ^, camera 31

548413 V. Description of the invention (47) Movement processing and imaging processing of the reference position of the positioning mark 1 2D in CxCy coordinates. Then, at time t8a, as soon as the photographing process of the positioning mark 12D is completed, in order to immediately take pictures of the positioning marks 12A of the two substrates to be checked 丨 丨, 丨 丨, the camera 31 is moved to the positioning mark 12 Eighth, the reference position in the CxCy coordinate (from time t8a to time u0, the control signal CS2 2 is inverted to a high level). In addition, during the movement processing time period of the camera 31, the photographic images of the positioning marks 12A to 12D are used to calculate the deviation amount of the two inspected substrates 11, 11 from the reference position in the CxCy coordinates, and the calculation result is stored in RAM. At the inspection position P3, at time t2, once the rotation operation of the rotary table 61 is stopped, inspection of the two inspected substrates u, u is started. First, the inspection jig 41 starts to descend to the predetermined descending position (the control signal CS32 transitions to a high level), and the inspection jig 41 is maintained at this position at the end of the time u descends (the control signal CS32 is maintained at a high level ^ ^ $ , 'The contact terminal 42 is in contact with one of the tested base immortals: contact), and the inspection process of the circuit type of the other inspected substrate 11 is controlled by the tester and the scanner (control signal CS33 is reversed). To high level). As soon as the inspection process of the substrate 11 under inspection at the time t4 is completed at the time t4, the inspection jig 41 starts to rise to a predetermined ascending position (the CS32 transitions to a low level), and at the time "the end of ascending, In order to perform inspection processing on the inspected substrate U of ^, the predetermined rise of the inspected substrate n on the other side of the inspection jig is reversed to a high level).

548413

The end is the same as the inspection process of one of the inspected substrates, and the inspection, △, and 41 are lowered to a predetermined lowering position (the control signal CS32 transitions to a high level 1 from time t8 to time t9, and passes the tester controller 46 and the scanner performs the inspection process on the circuit type of the other inspected substrate 11 (the control signal CS33 is inverted to a high level), so that the inspection process for the two inspected substrates u and u ° ends.

At time t9, as soon as the inspection processing of the two inspected substrates η and η is completed, the two inspected substrates π and 11 are immediately transported to the inspection position ρ 3, so that one of the inspected substrates can be performed immediately on the moonlight. Inspection processing, inspection inspection tool 41 is raised to a predetermined ascending position (control signal CS32 transitions to a low level), and at time t10, the rotation of rotating table 61 is started, and at the same time, inspection tool 41 A predetermined rising position of one of the inspected substrates 11 moves (the control signal CS31 is inverted to a high level). At the carry-out position P4, at time t2, the rotation operation of the rotary table 61 is stopped. 'The two inspected substrates u, 11 that have been carried out are carried out by the carry-out, and the lift arm of the carry-out section 5 is lowered to the lowered position (control signal CS42 transitions to low level). At time t3, the lowering of the lifting arm of the carry-out section 5 is completed, and then the chuck of the substrate holding mechanism 70 of the support frame 13 is opened (the control signal CS41 transitions to a low level). At time t4, once the chuck of the substrate holding mechanism 70 is opened, the locking of the lifting arm chuck (control signal CS43 transitions to the surface level) is started. At time t5, the locking of the lifting arm chuck (by the lifting arm After holding the two substrates to be inspected (丨 丨, 丨 丨), the lifting arm maintains the locked state of the chuck and starts to rise to the predetermined lifting position at time 16 (the control signal CS42 transitions to a high level). Then, at time ^,

548413 V. Description of the invention (49) After the lifting operation is completed, the lifting arm is guaranteed to maintain the CS42 to a high level). When the temple is in the lowered position (control signal thereafter, the chuck of the substrate holding mechanism 70 of the support frame 1 3 is transported to the carry-in position with an iT μ patch, and the chuck with c θ is opened,% The lower arm moved to the outlet 5 of the storage machine 8 is moved to the side of the movement 8 and read 8 at the lifting position to feed the two substrates to be inspected into the storage machine as described above. The control processing indicated by the interval of base = ~ time mu is advanced i == setting, position deviation detection position p2, inspection position p3, and carry-out position P4. For the substrate u to be checked in, the position deviation = 杳 at the time The parallel processing can inspect the circuit types of the plurality of substrates 11 to be inspected in a short time. Moreover, the substrate inspection apparatus of the present invention is not limited to the specific configuration of the above embodiment, and the configuration may be appropriately performed as required. Deformation, addition, replacement, or elimination. For example, the configuration of this embodiment is to arrange two inspection substrates at four positions (staUon) that intersect with each other perpendicular to the rotating table 61, and then inspect. Not limited to this The substrates to be inspected are arranged at 5 or more stations of the rotary table 61 for inspection. The number of substrates to be inspected arranged at each position may be 丨 or 3 or more. As described above, According to the present invention, the rotary table with at least four substrate holding devices at the edge portion is rotated to carry each substrate holding device to a carrying-in portion, a position deviation detecting portion, an inspecting portion, and a carrying-out portion arranged around the rotating table. Inspection board loading, deviation from inspection reference position2014-4599-PFN.ptd 548413

V. Description of the invention (50) " ~ The amount of inspection, substrate inspection, and inspection of the inspected substrates are carried out continuously. Therefore, the inspection of the inspected substrates, the detection of the position deviation, the inspections, and the inspections are carried out in parallel. Processing, you can check the wiring combination of the plurality of substrates to be inspected in a short time. Furthermore, at the inspection position, the relative position of the inspection jig and the substrate to be inspected is correctly corrected using the position deviation amount from the reference position of the substrate to be inspected detected by the position deviation detection device. Therefore, even if the substrate to be inspected is loaded When rotating the table, the inspection reference position is deviated, and high reliability inspection can be performed with high accuracy without being affected by the position deviation. «In addition, the positioning mark of the substrate to be inspected which is transported to the position deviation detection position is photographed using the imaging device disposed at the position deviation detection position, and the image of the imaging device is shifted from the positioning mark calculated based on the captured image: The deviation f of the optical axis of the device and the amount of movement of the imaging device from the previous position until the positioning mark is captured in the field of view are used to calculate the deviation from the inspection reference position of the substrate to be inspected. The amount of deviation of the inspected substrate from the inspection base is accurately detected. In addition, an origin mark is set at a predetermined position of the rotating table, and the rotating table is rotated at a predetermined angle to move the rotating table to a position deviation detection position. At the same time, the above-mentioned origin mark is photographed using a photographing device. The mechanical error is the relative position deviation between the origin mark and the photographing device, and then the deviation of the inspected substrate from the reference position can be corrected. Therefore, the correction of the pure position deviation can be performed under high precision. Therefore, the inspection accuracy of the substrate inspection can be improved.

2014-4599-PFN.ptd

548413 V. Description of the invention (51) In addition, using a jig positioning mark formed on the cymbal holder A ^ = calculated by the auxiliary photographing device when shooting and inspecting the photographed image. Relative to the visual aids in the field of view of the auxiliary photographic device, the information starts from a predetermined reference position and the amount of movement when the inspection is captured. The difference between the two images in the field of view is due to Λ, even when inspected; and:;: ς: The relative position of the rotating table is biased to the design value, and you will not be worried: 疋 The high reliability check is performed when the relative reference position of the rotating table is deviated. "Impact 'can be connected in a high-precision environment. The fixture positioning mark setting of the fixture at the κ position is connected, so the connection of ===== and the transporting device has very high efficiency. In addition, the substrate holding device contacts the first contact portion and the second contact portion of the two sides j facing the substrate to be inspected, and acts on the other two sides of the substrate to be inspected. The substrate is pressed to the first pressing portion and the second pressing portion of the first contact portion and the second contact portion. For the first and second pressing portions, j presses the pressing position and It is composed of a switching device for switching between the release position of the pressed substrate of the inspected substrate, so that the inspected substrate can be accurately positioned at the inspection reference position of the rotary table and lost. At the same time, it can be switched to Dismissed. In addition, the switching device is a cam device that normally acts on the first and second pressing portions, and acts on the cam device when the substrate holding device is in the carry-in position and the carry-out position.

2014-4599-PFN.ptd Page 55 548413 V. Description of the invention (52) A release device that places the first and second pressing sections in the release position. Therefore, the substrate to be inspected is moved from the carry-in position to the transfer position. When reaching the unloading position, the substrate to be inspected can be mechanically held.

2014-4599-PFN.ptd Page 56 548413

Brief Description of the Drawings Fig. 1 is a plan view of a main part showing a structural example of a substrate inspection apparatus according to the present invention. Fig. 2 is a perspective view of a main part showing a structural example of a substrate inspection apparatus according to the present invention. FIG. 3 is a block configuration diagram of a substrate inspection apparatus according to the present invention. Fig. 4 is a schematic diagram illustrating the coordinates of Cx'Cy defined in the rotating table. Fig. 5 is a schematic diagram showing the degree of inclination of the coordinate axis when the camera is driven and controlled with the axes not parallel to each other by the coordinates and Cx 'Cy defined in the rotating table, and the coordinates are adjusted to the origin.

Fig. 6 is a perspective view showing a main part of a substrate holding device of a support frame. Fig. 7 is a schematic diagram showing a relationship between CxCy coordinates and XY coordinates. Fig. 8 is a schematic view showing an example of a positioning mark formed on a holding plate. Fig. 9 is a schematic diagram showing a connection structure for electrically connecting a camera disposed on a rotating table and a control section provided on the main body side of the device. Fig. 10 is a schematic diagram illustrating the steps of adjusting the positions of the origins of Cx, Cy and coordinates of the automatic correction 1. Fig. 11 is a schematic diagram showing timings of various control signals related to the t substrate inspection device i of the present invention. DESCRIPTION OF SYMBOLS 1 Board inspection device 2 Carry-in section (carry-in device) 548413

1 Stand-up deviation detection unit (position deviation detection device) Camera (mark detection device, photographing device) Camera drive device (origin positioning device) 4 Inspection unit (inspection of cracks) 41 Inspection jig 4 2 Contact terminal 43 彳Driving device (setting device) for double-check fixtures 44 Control section (correction device, arithmetic device, power supply device) 45 Image processing section (deviation amount calculation device, deviation correction amount calculation device

46 Tester controller 47 Scanner 48 Operation panel 5 Unloading section (unloading device) 55, 56 Camera (auxiliary imaging device) 6 Substrate transfer section 61 Rotary table 62 Drive mechanism (rotary table driving device) 7 Supply machine

8 Storage machine 11 Inspected substrate 12A, 12B, 12C, 12D Positioning mark 49A, 49B Fixture positioning mark 7 0 Substrate holding mechanism (substrate holding device)

2014-4599-PFN.ptd Page 58 548413 Brief description of drawings 71 First abutment section 7 2 First pressing section 73 First clamping section (first clamping device) 74 Second abutting section 75 Second Pressing section 76 Second clamping section (second clamping device) 80 Cam mechanism (switching device) 84 Compression coil spring 9 2 Rack 93 Cylinder (release device) 94 Extension coil spring 100 Contact device 11 0 No. 1 Contact part 1 2 0 2nd contact part 123 Air cylinder (moving device) T0 Origin mark P1 Carry-in position P2 Position deviation detection position P3 Inspection position P4 Carry-out position

2014-4599-PFN.ptd Page 59

Claims (1)

1. A substrate inspection device, which sets a carry-in position, a position deviation detection position, an inspection position, and a carry-out position on a circle at predetermined intervals, and conveys a substrate to be inspected in a predetermined unit at predetermined intervals along the circumference and at various positions. In the above, the carrying in of the inspected substrate, the detection of the deviation from the reference position of the inspected substrate, the wiring inspection of the inspected substrate, and the carrying out process of the inspected substrate are performed in parallel. : The rotating table is arranged concentrically with the above circle, and at least four substrate holding devices for holding the substrates under test in the predetermined unit are provided at the predetermined intervals on the edge portion of the rotating table; the rotating table driving device is used to drive the rotation according to each predetermined rotation angle The rotary table transfers the inspected substrate held by each substrate holding device of the rotary table from the carrying-in position to the position deviation detection position, the inspection position, and the carrying-out position; the carrying-in device is disposed at the carrying-in position and is used to transfer the predetermined Number of inspected substrates moved in Substrate holding means of the rotary table; positional deviation detection means, arranged in the positional deviation detection position, for the amount of the check from the reference position of the substrate opposite deviations above the rotary table detected conveyed; The inspection device is arranged at the inspection position, and the inspection fixture is used to hang the wiring of the substrate to be inspected carried by the rotary table for inspection; the correction device is based on the data of the deviation 塁 detected by the position deviation detection device. Correct the relative position between the inspected substrate and the inspection jig at the inspection position; and 2014-4599-PFN.ptd Page 60 — 548413 — — — VI. The scope of the patent application has been moved out of the installation 2 2. As shown in the position deviation inspection test § self-inspection mark; the driver installed 5 has the detection device deviation Begin to detect from the reference position 3 • If applying the above-mentioned shadowing device; the above-mentioned position until the image is turned on from the predetermined position ^ shows § 4 of the own shadow inspection substrate • If claiming: The origin is fixed on the point; The carrying-out position is used to carry the inspected substrate that has been inspected by the rotary table out of the rotary table. Please refer to the substrate inspection device of the first scope of the patent, wherein the above-mentioned measuring device includes: a testing device that detects a fixed position set on the substrate to be inspected, and drives the above-mentioned target and the M computing device on a plane parallel to the rotating table, The amount of deviation of the deviation of the substrate to be inspected is calculated based on the amount of movement of the mark detection device until the mark is output from a predetermined position. Please check the substrate inspection device in the second item of the patent, where: The inspection device includes a camera device with an optical axis and a field of view of a predetermined size. The above-mentioned camera is used to position the substrate to be inspected in the field of view from the above $ to: The amount of movement of the shadow set, and the field of view of the camera; the deviation of the image from the optical axis of the camera: the amount of deviation from the reference position. Unexpected breakage Please use the substrate inspection device of item 2 of the patent scope, which also packs a device to position the above-mentioned mark detection device to the deviation of the mechanically inspected substrate, with the mechanical origin as the 2014-4599-PFN.ptd Page 61 548413 6. Scope of patent application The origin of the coordinate system is used for coordinate calculation. 5. If the scope of the patent application includes item 4: The blast board inspection device, which also includes the origin mark 'is set on the rotating car and rotating table, and can be positioned on the upper machine when the upper shaft is rotated at a predetermined angle to form a design. The light correction deviation detection device of the photographic device at the predetermined position of the closed point, said, the turntable is rotated along the above-mentioned predetermined angle; f is set to detect the relative position of the origin mark caused by the rotation if and the photographic device. The deviation is accurate; f Based on the above deviation, the deviation deviation data of the substrate to be inspected from the position of the drought is corrected. Wear the substrate inspection device of item 1, 2, 3, 4 or 5 in the 6.m profit range, which also includes: a fixture positioning mark, which is set at a predetermined position facing the rotation of the inspection fixture; It is used to set the inspection jig on the mechanical origin. The recording device 1 is set at #, when the rotating table is rotated at a predetermined angle, and the inspection jig can be positioned at the mechanical origin. The position where the positioning target swallows itself to form a predetermined position relationship; and the above-mentioned rotating table should be rotated at a predetermined angle through the wearing position, and the auxiliary photographing device is set by Λ 疋 to form a predetermined position with the positioning mark of the fixture. Ϊ́: ΐ Photographic equipment, according to the inspection auxiliary device, the image from the existing base rate position to the fixture positioning mark is captured in the field of view. Page 62 2014-4599-PFN.ptd 548413 VI. Patent application scope Fixture positioning mark shadow in the field of view of the camera device = position information relative to the optical axis of the auxiliary camera device, and calculate the relative position deviation between the inspection and the rotating table. 7. If the substrate inspection device of the scope of the patent application No. 6 is provided, which provides :, the power supply device and the above computing device to the above auxiliary photographing device, and the rotating table are installed on different device main bodies, respectively, The auxiliary imaging device sets the inspection jig ^ jig positioning mark at the contact point where the above-mentioned computing device and power supply device and the auxiliary imaging device 2 are in contact with each other and are electrically connected together, and are electrically connected 8 · For example, the substrate inspection device for patent application No. 7 in which the upper contact is set on the rotating table includes: set / '乾 上 此 # 番 旋转 rotating table extends concentrically and can cover the above auxiliary photography, = confirmed Read the angle moved by the setting of the relative position of the check fixture and the rotating table. Contact: U; placed on the main body, it can move between the contact position in contact with the conductor and the non-contact position separated from the conductor; And “moving” is used to move the brush to a contact position when shooting is performed by the auxiliary photographing device. 9. As for the substrate inspection device of the scope of application for patent, the planar shape of the inspected substrate is approximately rectangular; ', ^ The substrate holding device includes: a first abutting portion, which is adjacent to the inspected substrate; To abut; to pass T 'logic 548413 VI. Scope of patent application " " ------a. The second abutting portion is in abutment with the other of the two sides; the first pressing portion is opposite to the two sides of the inspected substrate. -The side-by-side action acts to push the substrate to be inspected to the first abutment portion; the second pressing portion acts on the side opposite to the other of the two sides of the substrate to be inspected "and will be inspected The substrate is pressed to the second abutting portion; the switching device is used for the first and second pressing portions at a pressing position for pressing a substrate to be inspected and a releasing position for releasing a pressed state of the substrate to be inspected To switch between them. μ 10 · If the substrate inspection device of the ninth scope of the patent application, the switching device includes: a cam mechanism, which acts on the first and second pressing parts, so that the first and second pressing parts are usually pressed. And a release device, when the substrate holding device is in the carry-in position and the carry-out position, it acts on the cam device so that the first and second pressing portions are in the removal position. '11 · A substrate inspection method including the following steps: A rotating table provided with a plurality of substrate holding devices at predetermined angular intervals is sequentially rotated at the predetermined angular intervals described above, and the substrate holding devices are moved in at respective predetermined angles. The position, position deviation 2 detection position, inspection position, and carry-out position are sequentially moved in sequence, and the following processes are performed in parallel: at the carry-in position, the substrate to be inspected is mounted and fixed on the substrate holding device; The position deviation detection position detects the deviation amount of the substrate from the reference position; at the inspection position, the S difference corresponding to the deviation of the substrate from the reference position is detected. 548413 VI. Scope of patent application Quantity: Adjust the wiring of the inspection jig and the board of the rotating table; after the above-mentioned carry-out position, check the position, and then inspect the substrate to be removed from the substrate holding device. f The inspected substrate that has been inspected 12. As described in the U.S. patent application, the deviation of the inspected substrate from the reference \\ substrate ^ inspection / method 'includes the following steps: The deviation of the inspection process package 1 will have an optical axis And the point of the predetermined field of view; ~ The device is located on the mechanical source and the image of the positioning mark formed on the mechanical origin is moved from the mechanical origin to the J-view: the device until the amount of the substrate to be inspected and: the movement when the positioning mark is captured in the field of view The amount of deviation ^ The image of the oblique position I mark is calculated with the optical axis of the photographing device; and the deviation of the deviation from the reference position of the substrate to be checked is moved to the center. 'The relative adjustment of the inspection jig is adjusted based on the calculated deviation. The relative position of the substrate to be inspected. , ^ = · Λ application / benefit range of the substrate inspection method of item 12, wherein the upper = 疋 self 'is formed at two predetermined positions on each inspected substrate, and the above-mentioned photographing device sequentially captures the positioning marks in the field of view. , Using the above-mentioned mechanical origin as the origin to detect the coordinate position of the positioning mark 'to calculate the deviation from the reference position. 14. If the method for inspecting the substrate of item 12 or item 13 of the scope of patent application, wherein the rotating table is rotated according to a predetermined amount, the predetermined place of the rotating table is on page 65 548413. 6. The origin mark formed by the scope of the patent application is set on the substrate. Deviation detection position; The above-mentioned photographing device calculates rotation based on the amount of movement from the mechanical origin to the point where the origin mark is viewed and the deviation between the origin mark horse image in the field of view and the optical axis of the photographing device. The relative deviation amount; 摄 and the shirt and clothing according to this deviation amount to correct the alignment of the inspection jig and the substrate to be inspected. Position a week 15 · If the patent application scope of the 12th or 13th substrate inspection method, The rotating table is set at a predetermined position; — the rotating table is rotated according to a predetermined amount, and the optical axis and the predetermined visual aid photographing device are set at the above-mentioned inspection position; the inspection jig is driven so that the The image of a pair of fixture positioning marks is captured in the field of view of the auxiliary photography device in turn; at this time, the fixture is moved from the mechanical origin based on the inspection fixture. The initial movement amount and the deviation of the fixture position mark from the optical axis in the field of view of the auxiliary photographic device calculate the relative deviation between the inspection fixture and the rotating table; according to this deviation amount, the inspection fixture is deviated from the substrate being inspected The relative position of the reference position is adjusted. 16. The method for inspecting a substrate according to item 15 of the patent application scope, wherein a reference inspection jig is used to perform a calculation of the relative deviation k of the inspection jig and the rotating table.