JP3065612B1 - Board inspection equipment - Google Patents

Abstract

Abstract: PROBLEM TO BE SOLVED: To reduce a work load of an operator by automatically finding a relative positional relationship between a contact and a substrate, and to accurately position the substrate and the contact based on the relative positional relationship. Provided is a substrate inspection apparatus capable of performing a substrate inspection with high precision by using the same. SOLUTION: A main camera 44 takes an image of an inner circumference circle of an illumination unit 551 of an auxiliary camera 55 provided on a transfer table 5 and substrate positioning marks 2A and 2B, and a position shift of the substrate 2 in an absolute coordinate system from the mark image. Find the quantity. Then, the auxiliary camera 55 attached to the transport table 5 images the tips of the contacts 42A and 42B, and the coordinates of the contacts 42A and 42B in the absolute reference coordinate system are obtained. The relative positional relationship is determined automatically.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a board inspection apparatus for inspecting a circuit pattern formed on a substrate by bringing a pair of contacts into contact with the circuit pattern.

[0002]

2. Description of the Related Art Japanese Patent Application Laid-Open No. 5-73149 and Japanese Patent Application Laid-Open No. 6-118115
Is described in Japanese Patent Application Publication No. In the board inspection apparatuses described in these publications, a board to be inspected is placed on a transport table, and the transport table is moved to a position immediately below the inspection jig, and then the inspection jig is moved to the transport table side. By descending, a contact such as a checker pin or a probe pin attached to the inspection jig is brought into contact with a circuit pattern formed on the substrate, and the circuit pattern is inspected. Here, if the substrate is always located at the design position (design position) on the transfer table, the transfer table is moved to a predetermined target position immediately below the inspection jig, so that the contact Although the circuit pattern and the circuit pattern are positioned relative to each other, an accurate inspection can be performed, but it is practically difficult to prevent the displacement of the substrate on the transfer table.

Therefore, in these prior arts, a camera is installed in a board inspection apparatus, a camera takes a picture of a board positioning mark formed in advance on the board, and based on the mark image, the board mounted on a transfer table. Is obtained. Then, the moving amount of the inspection jig or the transport table is controlled in accordance with the positional deviation amount thus obtained,
The displacement is corrected.

[0004]

In the above-mentioned prior art, the amount of displacement of the substrate is obtained by imaging the substrate positioning mark with a camera, and the position of the inspection jig or the transfer table is controlled by controlling the amount of movement of the transfer table. Since the shift amount is corrected, it is necessary to determine the relative positional relationship between the camera and the substrate positioning mark in advance.
Therefore, in the conventional board inspection apparatus, prior to the actual inspection, the board is placed on the transfer table, and a number of trials are performed so that the contacts accurately contact the circuit pattern formed on the board. The camera position is adjusted so that the substrate positioning mark of the substrate is located on the optical axis of the camera.

[0005] Such work is performed by an operator, which increases the work load of the operator and is one of the factors that reduce the efficiency of the board inspection work.

Even if the camera position is adjusted, the camera must be adjusted each time the inspection jig is replaced thereafter. This is because the inspection jigs have individual variations. Therefore, it is necessary for the operator to adjust the camera position at an appropriate timing, which results in imposing a large work load on the operator.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-described problems, and reduces the work load on an operator by automatically obtaining a relative positional relationship between a substrate and an inspection jig. It is an object of the present invention to provide a board inspection apparatus capable of accurately moving a contact with respect to a board based on the relative positional relationship and performing board inspection with high accuracy.

[0008]

Means for Solving the Problems At least one pair of contacts that can move independently of each other is provided, and the pair of contacts are moved to a predetermined position of a circuit pattern formed on a substrate according to a moving program stored in advance. A board inspection apparatus for inspecting the board by measuring the conduction or insulation of the circuit pattern by making contact with the table, and a table configured to allow the board to be placed thereon, and a contact holding means for holding the contact. A main camera for imaging a substrate positioning mark provided on a substrate and a table positioning mark provided on the table; an auxiliary camera attached to the table and imaging the contact; and the table and the main camera The relative position of the table is controlled and the table positioning mark and the substrate positioning mark are imaged by the main camera. Obtains the relative positional relationship between the substrate alignment mark with respect to Bull positioning mark, calculates a correction value of the design reference coordinates of the substrate alignment marks to be stored in advance,
Furthermore, from an image obtained by controlling the relative position between the table and the contact and capturing the contact with the auxiliary camera, the moving program is changed based on the two correction values, and the changed program is changed. And a control means for relatively positioning the substrate and the contactor based on the substrate inspection apparatus.

According to the above arrangement, the substrate to be inspected is placed at a predetermined position on the table, and the table is moved to transport the substrate to a predetermined substrate inspection position. At the time of this table movement, the first imaging means images the reference position of the table and the positioning mark formed on the substrate. When the substrate is transported to the substrate inspection position, the pair of contacts are imaged by the second imaging means. Then, the relative position of the substrate positioning mark with respect to the table positioning mark is calculated using the image captured by the first imaging means, and the position relative to the design reference position is calculated using the image captured by the second imaging means. The relative position of each contact located at the predetermined initial position is calculated, and the correction amount of the amount of movement for moving the contact according to the moving program based on the board positioning mark and the relative position of each contact relative to the reference position is calculated. Is calculated.

That is, if the movement of the contact is controlled by the moving program, the relative position information of the substrate positioning mark with respect to the table positioning mark indicates the amount of displacement of the substrate with respect to the table positioning mark, and the predetermined initial position with respect to the design reference position. Since the relative position information of the contact at the position indicates the amount of displacement of the origin of the contact with respect to the design reference position, the relative displacement of the substrate in the coordinate system in the movement control of the contact is determined by the two amounts of displacement. Can be calculated,
This shift amount is calculated as a correction amount of the movement amount for moving the contact according to the movement program.

In the board inspection, the contact is moved by correcting the movement control value of the movement program based on the correction amount, and is brought into contact with a predetermined position of the circuit pattern on the board.

According to the second aspect, the table positioning mark is an inner circumferential circle of the illumination unit attached to the table of the auxiliary camera, so that the relative positional relationship between the contact and the substrate can be easily obtained. .

According to the above arrangement, when the illumination unit is attached to the table positioning mark position and the contact is picked up at the board inspection position, the light image is guided to the second image pickup means and picked up. Therefore, the contact is imaged by the second imaging means from the side facing the contact.

[0014]

FIG. 1 is a side sectional view showing an embodiment of a substrate inspection apparatus according to the present invention, and FIG.
FIG. 2 is a plan view of the substrate inspection apparatus of FIG. In order to clarify the directional relationship with each drawing described later, XYZ rectangular coordinate axes are shown.

As shown in these figures, in this board inspection apparatus, an opening / closing door 11 is attached to the apparatus body 1 on the front side (−Y side) of the apparatus so as to be openable and closable.
1, a board 2 such as a printed board to be inspected can be carried into a carry-in / carry-out section 3 provided at a central portion on the front side of the apparatus. An inspection unit 4 for inspecting the substrate 2 is provided on the rear side (+ Y side) of the carry-in / out unit 3. After the inspection unit 4 inspects and determines whether the substrate is good or not, the inspection unit 4 performs an inspection. The completed substrate 2 is returned to the carry-in / out section 3 again, and can be carried out by the operator via the opening / closing door 11. In this embodiment, the loading / unloading of the substrate 2 is a manual operation by an operator. A substrate loading mechanism for transferring the previous substrate 2 is provided, and a substrate loading mechanism for receiving the inspected substrate 2 from the loading / unloading unit 3 on the other side and transporting the substrate 2 to an external device is additionally provided, thereby enabling automatic transport of the substrate. It becomes possible.

In this board inspection apparatus, the transfer table 5 is used to transfer the board 2 between the carry-in / out section 3 and the inspection section 4.
Are provided so as to be movable in the Y direction, and are configured to be moved and positioned in the Y direction by the transport table drive mechanism 6. That is, the transport table driving mechanism 6
In this embodiment, two guide rails 61 extending in the Y direction are arranged at a predetermined interval in the X direction, and the transport table 5 is slidable along the guide rails 61. In addition, these guide rails 61,
A ball screw 62 is disposed in parallel with 61. One end (−Y side) of the ball screw 62 is supported by the apparatus main body 1, and the other end (+ Y side) of the motor 63 for driving the transport table is rotated. It is connected to the shaft 64. Further, a bracket 65 to which the transfer table 5 is fixed is screwed to the ball screw 62. Therefore, when the motor 63 is driven to rotate in accordance with a command from the control unit 71 described later, the transport table 5 moves in the Y direction according to the amount of rotation, and reciprocates between the carry-in / out unit 3 and the inspection unit 4. Moving. The details of the transport table 5 will be described later.

FIG. 3 is a schematic view showing the configuration of a board inspection apparatus equipped with a general-purpose inspection jig, and FIG. 4 is a plan view of the general-purpose inspection jig 41. This will be described in detail with reference to FIGS. In FIG. 3, a general-purpose inspection jig 41 is mounted on both the upper inspection unit 4U and the lower inspection unit 4D.

In FIG. 3, in the inspection section 4, an upper inspection unit 4U is arranged on the upper side (+ Z side) of the transfer table 5 for inspecting a circuit pattern formed on the upper surface side of the substrate 2. On the other hand, a lower inspection unit 4D for inspecting a circuit pattern formed on the lower surface side of the substrate 2 is disposed on the lower side (−Z side). These inspection units 4U and 4D have the same configuration.
The transfer tables 5 are symmetrically arranged with respect to the movement path. Therefore, here, the configuration of the upper inspection unit 4U will be described, and the lower inspection unit 4D will be denoted by the same reference numerals and description thereof will be omitted.

In FIGS. 3 and 4, the general-purpose inspection jig 41 has two contact driving mechanisms 41A and 41 which are independent of each other on the left and right.
B. The contact drive mechanisms 41A and 41B hold the contacts 42A and 42B and move the contacts 42A and 42B in the Z direction with respect to the apparatus main body 1 in the Z direction drive unit 41.
AZ, 41BZ; X-direction driving units 41AX, 41BX connected to the Z-direction driving units 41AZ, 41BZ to move the contacts 42A, 42B in the X-direction;
AX, 41BX and the contacts 42A, 42B
And Y-direction driving units 41AY and 41BY for moving in the directions. These drive units are configured using drive sources such as an AC motor and a stepping motor, and a slide moving mechanism.

By controlling the driving of the contact drive mechanisms 41A and 41B by the control section 71, the contacts 42A and 42B become independent after being relatively positioned with respect to the substrate 2 to be inspected as described later. To come into contact with the circuit pattern on the substrate 2.

The contact driving mechanisms 41A and 41B are moved up and down (Z direction) to move the contacts 42A and 42B to the substrate 2.
It is configured such that it can be brought into contact with or separated from the circuit pattern formed on the substrate. As shown in FIG. 9, the main camera 44 is fixed to an appropriate position on the main body frame.

As shown in FIG. 3, the substrate 2 and the contacts 42A, 42B are provided inside the contact drive mechanisms 41A, 41B.
A matching confirmation camera 45 for confirming the matching state with the camera is provided.

Next, the structure of the transport table 5 will be described in detail with reference to FIGS. This transport table 5
As shown in FIG. 6, is composed of a substrate mounting portion 51 for mounting the substrate 2 and an auxiliary camera holding portion 52 projecting from the substrate mounting portion 51 in the (+ Y) direction. . In the substrate mounting portion 51, the mounted substrate 2 is engaged with the three engagement pins 53, and the substrate 2 is engaged by urging means (not shown) from a direction facing the engagement pins 53. The substrate 2 can be held on the substrate mounting portion 51 by being urged toward the mating pin 53 side. Further, in order to bring the contacts 42A and 42B of the lower inspection unit 4D into contact with the circuit pattern formed on the lower surface of the substrate 2 held in this manner, a through-opening (not shown) 54 is formed in the substrate mounting portion 51. Is formed.

An auxiliary camera 55 for imaging the contacts 42A and 42B held by the contact drive mechanisms 41A and 41B of the general-purpose inspection jig 41 at the inspection position shown in FIG. The contacts 42A, 4 held by the contact drive mechanisms 41A, 41B of the lower inspection unit 4D.
An auxiliary camera 56 for imaging 2B is arranged in the X direction (see FIG. 3). Since the auxiliary camera 56 has the same configuration as the auxiliary camera 55, here, the auxiliary camera 55
Will be described with reference to FIG. 5, and the description of the configuration of the other auxiliary camera 56 will be omitted.

The auxiliary camera 55 is provided with an illumination unit 551 on the upper surface of the auxiliary camera holding portion 52 so as to face the upper inspection unit 4U (general-purpose inspection jig 41), so that the upper side can be illuminated. ing. Further, below the lighting unit 551, the auxiliary camera holding section 52 is provided.
Inside the prism 553 is fixedly disposed by the prism holder 552, and the light L incident on the inside of the auxiliary camera holding unit 52 via the illumination unit 551 is guided to the CCD 556 via the lens 555 disposed in the lens barrel 554. ,
It is configured to form an image on the CCD 556.
Further, a guide fiber cable 557 is provided,
The upper part is illuminated. Therefore, when the table 5 moves and the substrate 2 reaches the inspection position, the contacts 42 held by the contact drive mechanisms 41A and 41B of the upper inspection unit 4U.
A and 42B are located immediately above the auxiliary camera 55. The contactors 42A and 42B are provided by the CCD 556.
And the inner circle of the lighting unit 551, and the contact 4
The coordinate values of each of 2A and 42B are obtained. The center of the inner circumference circle of the illumination unit 551 is set as the optical axis of the auxiliary camera 55.

Next, returning to FIG. 3, the electrical configuration of the substrate inspection apparatus configured as described above will be described. The board inspection apparatus includes a control unit 71 including a CPU, a ROM, a RAM, a motor driver, and the like, and controlling the entire apparatus according to a program stored in the ROM in advance, cameras 44, 45, An image processing unit 7 that performs predetermined image processing based on the image signals from 55 and 56 and provides a signal related to the image processing result to the control unit 71.
2 is provided. Then, based on a signal from the image processing unit 72, the control unit 71 drives and controls the transport table driving mechanism 6 and the contactor driving mechanisms 41A and 41B to control the transport table 5
The contacts 42A, 42A,
42B is brought into contact. As will be described later, the control unit 71 and the image processing unit 72 constitute a first calculation unit, a second calculation unit, and a correction unit. The control unit 71 is electrically connected to the tester controller 73. When the contacts of the contacts 42A and 42B to the circuit pattern are completed as described above, the control unit 71 sends the tester controller 7
An inspection start command is given to 3 and the inspection is executed. And
The inspection result is provided to the control unit 71 via the tester controller 73. Further, an operation panel 75 is electrically connected to the control unit 71, and commands and parameters from an operator are given to the control unit 71.

Next, the operation of the board inspection apparatus will be described in detail.

FIG. 8 is a flowchart showing the basic operation of the board inspection apparatus of this embodiment. In this board inspection apparatus, when an operator loads the board 2 before inspection into the loading / unloading section 3 and gives an inspection command via the operation panel 75, the control section 71 gives various commands to each section of the apparatus and the control section 71 gives various commands as shown in FIG. The board inspection is automatically performed according to the flowchart. Since both the upper inspection unit 4U and the lower inspection unit 4D perform inspection by the same operation, the operation on the upper inspection unit 4U side will be described here, and the description on the operation on the lower inspection unit 4D will be omitted.

When receiving the inspection command, first, the substrate 2 to be inspected is set on the substrate mounting portion 51 of the transfer table 5 at the substrate mounting position indicated by the imaginary line in FIG. 2 (step S1 in FIG. 8). In this embodiment, the operator directly sets the substrate on the substrate mounting portion 51. However, as described above, the substrate is automatically set by additionally providing the substrate loading mechanism and the substrate unloading mechanism. Is also good.

Next, the illumination unit 55 of the auxiliary camera 55
The coordinate positions in the absolute coordinate system of the inner circumferential circle 551 of FIG. 1 and the original substrate positioning marks 2A and 2B formed on the substrate 2 are obtained. The lighting unit 55 of the auxiliary camera 55
An absolute coordinate system having the origin at the center of the inner circle of 1 is set in advance. That is, as shown in FIG. 6, the main camera 44 conveys the image of the inner circumference circle of the illumination unit 551 of the auxiliary camera 55 and the images of the substrate positioning marks 2A and 2B from the mounting position of the substrate 2 to the inspection position ( O 'in FIG.
(Step S2), and the auxiliary camera 5
5 is processed by performing image processing on the inner circumferential circle of the illumination unit 551 and the mark images of the substrate positioning marks 2A and 2B, thereby obtaining the XY of the substrate positioning marks 2A and 2B in the absolute coordinate system.
A coordinate value on the axis is obtained (step S3). Subsequently, coordinate values of the substrate positioning marks 2A and 2B of the substrate 2 on the XY axes at the design reference position in the absolute coordinate system,
The coordinate values actually mounted and measured on the table mounting portion 51 are compared and examined, and the first arithmetic means calculates the correction value of the substrate 2 in the absolute coordinate system (step S4).

Next, it is determined whether the board inspection apparatus is newly installed or moved (step S5). If “YES” is determined in step S5, the process proceeds to step S5.
Then, the process proceeds to step 7, where the positional displacement amount of the contact is measured.
If “NO” is determined, the process proceeds to step S6.

Next, it is determined whether or not the contact drive mechanisms 41A and 41B or the contacts 42A and 42B have been newly set (step S6). If "NO" is determined in step S6, the position shift amount measurement processing of the contact (step S7) is not performed.
Proceeding to step S8, a board inspection is performed by adding the above-mentioned information on the correction amount of the board 2 to the relative positional relationship between the board 2 and the contacts 42A and 42B already stored in the control unit 71.

On the other hand, if "YES" is determined in the step S6, the positional displacement amount measuring process of the contact (step S6).
Execute 7). FIG. 9 is a flowchart showing the contact displacement measurement processing. These contacts 42A, 42
In the position shift amount measurement process of B, first, the table 5 is moved by a predetermined number of steps from the substrate mounting position indicated by a virtual line in FIG. 2 to move the table 5 to the inspection position shown in FIG. At the inspection position, the center O of the inner circumference of the illumination unit 551 of the auxiliary camera 55 is the origin O. Then, at the inspection position, the auxiliary camera 55 captures an image of the tips of the contacts 42A and 42B actually located at the predetermined initial position (step S701), performs image processing based on the image, and executes the contact 42A in the absolute coordinate system. , 42B are obtained (step S702).

Thereafter, the contact 42 in the absolute coordinate system is
The coordinate values at the design reference positions of A and 42B and the measured coordinate values of the contacts 42A and 42B are compared and examined, and the first arithmetic means calculates the correction value (step S70).
3). The correction amount is input to the memory of the control unit 71 (step S704).

Thus, the contact 42 in the absolute coordinate system
When the position correction amounts of A and 42B and the position correction amount of the substrate 2 are obtained, the two position correction amounts are added together by the second calculating means to obtain the movement correction amounts of the contacts 42A and 42B with respect to the substrate 2. The moving amount of the program written in the control unit 71 in advance is rewritten by the correction means and initialized (step S8). Next, the contact drive mechanism 41A,
The contacts 42A and 42B are moved by 41B according to the rewritten new program. As a result, the circuit pattern formed on the substrate 2 and the contact driving mechanism 41
The contacts 42A and 42B held by the contacts A and 41B are positioned with high accuracy.

Subsequently, the contacts 42A and 42B are brought into contact with the circuit pattern of the substrate 2 (step S9).
An inspection is performed (Step S10).

By the way, as described above, the contacts 42A, 4
2B is moved to the substrate 2 side and inspected (step S1
0), the substrate 2 may move. If such a displacement of the substrate 2 occurs, the contact contacts a position shifted from the circuit pattern, and it becomes impossible to perform an accurate inspection. Therefore, in this embodiment, the alignment state in the inspection is confirmed, and if a position shift occurs,
The position is corrected and the inspection is performed again (step S11).

More specifically, as shown in FIG. 10, first, the alignment confirmation camera 45 captures an image of the substrate positioning mark 2A of the substrate 2. Then, the displacement of the board positioning mark 2A is obtained from this image (step S110).
1). If the positional deviation thus found is within the allowable range, the process proceeds to the next step S11 (FIG. 8) without performing the inspection again, while if the positional deviation exceeds the allowable range, the position of the substrate positioning mark 2A is determined. The position of the substrate 2 was corrected so that the deviation was within the allowable range (step S110).
3) Later, the contactors 42A and 42B are moved to the substrate 2 side again to perform the inspection (step S1104). There are various methods for correcting the position of the substrate 2, but in the present embodiment, the contacts 42A, 42B are once separated from the substrate 2 and the substrate positioning operation by the pressing means (not shown) is executed again.

As described above, in this embodiment, the contact 4
Even if a displacement occurs due to the contact between the substrates 2A and 42B, the displacement is corrected and the substrate 2 and the contacts 42A and 4B are corrected.
Since the inspection is performed again after returning the 2B to the matching state, the inspection accuracy can be further improved.

When the board inspection is completed, the inspection result is displayed, and the inspected board 2 is returned to the loading / unloading section 3 again, and then it is determined whether or not the next board is inspected (step S12). When it is determined that the next substrate is to be inspected, the process returns to step S1, and a series of operations is repeated. On the other hand, if “NO” is determined in the step S12, the process ends.

As described above, in this embodiment, the auxiliary camera 55 is mounted on the transport table 5, and the main camera 44 captures an image of the inner circumference of the illumination unit 551 of the auxiliary camera 55 on the transport table 5, and the board inspection position. Auxiliary camera 5
5, the contacts 42A, 4 of the contact moving mechanisms 41A, 41B.
2B is imaged, and the deviation between the design reference value in the absolute coordinate system of the substrate 2 and the design reference value in the absolute coordinate system of the initial positions of the contacts 42A and 42B is obtained.
Since the correction amount is input to 1 and the inspection program is changed, the substrate inspection can be performed automatically without the need for trial adjustment by the operator unlike the related art, and the operator's work load is reduced. be able to.

Further, since the substrate 2 and the contacts 42A and 42B are positioned based on the above relative positional relationship, the contacts 42A and 42B accurately move and contact the corresponding circuit pattern of the substrate 2. Therefore, the board inspection can be performed with high accuracy.

In the above embodiment, step S11
Is performing the correction of confirmation of the matching state in the inspection,
If the degree of matching is extremely high, this step can be omitted.

In the above embodiment, the type using a pair of contacts has been exemplified, but a type using two or more contacts may be used.

In the above embodiment, the auxiliary camera 55
The inner circumference circle of the imaging unit 551 is used as a table positioning mark, and the inner circumference circle and the substrate positioning marks 2A and 2B are used.
Is captured by the main camera 44, and the coordinate values of the substrate positioning marks 2A and 2B are obtained by image processing. However, a table positioning mark may be separately provided at a required position of the table 5. Then, the table positioning marks and the substrate positioning marks 2A and 2B may be imaged by the main camera 44, and the coordinate values of the substrate positioning marks 2A and 2B may be obtained by image processing. In this case, it is necessary to measure in advance the relative positional relationship between the table positioning mark and the inner circumference of the imaging unit 551 of the auxiliary camera 55, and to perform an arithmetic process as a correction coefficient when calculating the correction amount.

Further, in the above-described embodiment, while the substrate 2 is being conveyed on the table 5, the inner circumference of the imaging unit 551 of the auxiliary camera 55 and the substrate positioning marks 2A and 2B are simultaneously imaged by the main camera 44 and the images are taken. Although the image processing and the measurement of the coordinate values of the substrate positioning marks 2A and 2B have been exemplified, instead of this, the auxiliary camera 55 is first used by the main camera 44 during the transportation of the substrate 2 on the table 5.
Of the inner circumferential circle of the image pickup unit 551, and thereafter, the table positioning marks 2A, 2
B is imaged, and the amount of movement of the table 5 in the XY directions is calculated from the number of driving steps of the driving source.
The coordinate values of A and 2B may be measured.

Further, the orthogonality of the table 5 in the X and Y movement directions by the transport table driving mechanism 6 and the contactor driving mechanism 4
The orthogonality of the contacts 42A and 42B in the XY movement directions by 1A and 41B is measured, and the correction value is further added to the correction value of the first embodiment to adjust the positions of the contacts 42A and 42B with respect to the substrate 2. The system is improving.

[0048]

As described above, according to the present invention, an image obtained by controlling and aligning the relative positions of the table and the main camera to image the table positioning mark and the substrate positioning mark with the main camera is provided. Since the relative position of the contact with the substrate is automatically determined based on an image obtained by controlling and matching the relative position of the contact with the contact and capturing the contact with an auxiliary camera, The work load on the operator can be reduced.

Further, since the substrate and the contact are relatively positioned, the contact accurately contacts the circuit pattern of the corresponding substrate, and a high-precision board inspection can be performed.

[Brief description of the drawings]

FIG. 1 is a side sectional view showing an embodiment of a substrate inspection apparatus according to the present invention.

FIG. 2 is a plan view of the substrate inspection apparatus of FIG.

FIG. 3 is a schematic diagram illustrating a schematic configuration of the substrate inspection apparatus of FIG. 1;

FIG. 4 is a plan view of a general-purpose inspection jig.

FIG. 5 is a cross-sectional view illustrating a configuration of an auxiliary camera.

FIG. 6 is a perspective view showing an operation of the substrate inspection apparatus of FIG. 1;

FIG. 7 is a perspective view showing an operation of the substrate inspection apparatus of FIG. 1;

FIG. 8 is a flowchart showing the operation of the board inspection device.

FIG. 9 is a flowchart showing a process of measuring a displacement amount of a contact.

FIG. 10 is a flowchart showing a process for confirming and correcting a matching state in an inspection.

[Explanation of symbols]

2 ... Substrate 2A, 2B ... Substrate positioning mark 4 ... Inspection unit 4D ... Lower inspection unit 4U ... Upper inspection unit 5 ... Transport table 6 ... Transport table drive mechanism 41A, 41B ... Contact drive mechanism 42A, 42B ... Contact 44 ... Main camera (first imaging means) 51 ... substrate mounting section 52 ... auxiliary camera holding section 55, 56 ... auxiliary camera (second imaging means) 71 ... control section (first arithmetic means, second arithmetic means) , Correction means) 72 image processing unit (first calculation means, second calculation means,
Correction means) 551 ... Illumination unit (table positioning mark)

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-4-268406 (JP, A) JP-A-4-144300 (JP, A) JP-A-7-110364 (JP, A) JP-A-6-106 331681 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) G01R 31/02 G01R 31/28 G01R 31/26 G01R 1/06 H05K 3/00

Claims (2)

(57) [Claims] An electronic apparatus comprising: at least one pair of independently movable contacts, wherein said pair of contacts are moved to a predetermined position of a circuit pattern formed on a substrate in accordance with a movement program stored in advance and brought into contact therewith. A board inspection apparatus for inspecting the board by measuring conduction or insulation of the circuit pattern, wherein the board having a board positioning mark formed on a table surface on which a table positioning mark is formed is mountable. A table configured to be able to move the substrate to an inspection position where the substrate is inspected by bringing the contact into contact with the circuit pattern; a table positioning mark provided on the table; and a substrate provided on the substrate. First imaging means for imaging a positioning mark, attached to the table, and the table moves to the inspection position A second imaging unit that images the contact located at a predetermined initial position when the image is captured, and a relative position of the substrate positioning mark with respect to the table positioning mark using an image captured by the first imaging unit. And a first calculating means for calculating a relative position of the contact located at a predetermined initial position with respect to a design reference position using an image taken by the second imaging means; A second calculating means for calculating a correction amount of a movement amount for moving the contactor in accordance with the moving program based on a calculation result of the calculating means; and a correction amount calculated by the second calculating means. A substrate inspection apparatus comprising: a correction unit configured to correct a movement control value of a movement program. 2. The lighting device according to claim 1, wherein the illumination unit of the second imaging means is attached to the position of the table positioning mark, and the table positioning mark is an inner circumference of the illumination unit. Board inspection equipment.