JP2000338164A - Inspection device for substrate - Google Patents

Inspection device for substrate

Info

Publication number
JP2000338164A
JP2000338164A JP11149602A JP14960299A JP2000338164A JP 2000338164 A JP2000338164 A JP 2000338164A JP 11149602 A JP11149602 A JP 11149602A JP 14960299 A JP14960299 A JP 14960299A JP 2000338164 A JP2000338164 A JP 2000338164A
Authority
JP
Japan
Prior art keywords
substrate
pressing
inspection
urging
holding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11149602A
Other languages
Japanese (ja)
Inventor
Hideo Nishikawa
秀雄 西川
Hiroshi Nitta
洋 新田
Masakatsu Ichihara
正勝 市原
Original Assignee
Nidec-Read Corp
日本電産リード株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nidec-Read Corp, 日本電産リード株式会社 filed Critical Nidec-Read Corp
Priority to JP11149602A priority Critical patent/JP2000338164A/en
Publication of JP2000338164A publication Critical patent/JP2000338164A/en
Pending legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To make a substrate pressing member position a substrate in a prescribed position only by energizing force of an energizing means, so as to conduct substrate inspection with high precision. SOLUTION: This device is a substrate inspecting device for bringing a contact into contact with a circuit pattern formed in a substrate 2 to inspect the circuit pattern, and has a table 5 constituted to lay the substrate 2. A substrate holding means 51 for holding the substrate 2 in a prescribed position of the table 5 comprises a positioning pin 53 for holding the substrate 2 in the prescribed position of the table 5, a substrate pressing member 54, an energizing means for energizing the member 54 toward the substrate 2 and a press-releasing means 58 for separating the member 54 from a substrate pressing position against the enegizing means. The substrate pressing member 54 is energized toward the substrate 2 by the energizing means to position the substrate 2 in the prescribed positon when the releasing means 58 is under a non-operated condition, and the substrate pressing means 54 is separated from the substrate pressing position against the enegizing means when the releasing means 58 is under an actuated condition.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION
【0001】[0001]
【発明の属する技術分野】本発明は、基板に形成された
回路パターンに接触子を接触させて当該回路パターンを
検査する基板検査装置に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a board inspection apparatus for inspecting a circuit pattern formed on a substrate by bringing a contact into contact with the circuit pattern.
【0002】[0002]
【従来の技術】この種の基板検査装置としては、例えば
特開平5−73149号公報や特開平6−118115
号公報に記載されたものがある。これらの公報に記載さ
れた基板検査装置では、搬送テーブル上に検査対象たる
基板を載置するとともに、この搬送テーブルを検査治具
の直下位置に移動させた後、検査治具を搬送テーブル側
に下降させることで検査治具に取付けられた接触子を基
板に形成された回路パターンに接触させ、回路パターン
の検査を行っている。
2. Description of the Related Art Japanese Patent Application Laid-Open No. 5-73149 and Japanese Patent Application Laid-Open No. 6-118115
Is described in Japanese Patent Application Publication No. In the board inspection apparatuses described in these publications, a board to be inspected is placed on a transport table, and the transport table is moved to a position immediately below the inspection jig, and then the inspection jig is moved to the transport table side. By descending, the contact attached to the inspection jig is brought into contact with the circuit pattern formed on the substrate, and the circuit pattern is inspected.
【0003】基板を常に搬送テーブル上の設計上の位置
(所定位置)に位置付けするために、互いに直交するX
軸、Y軸上に1〜2個の位置決めピンを設け、エアシリ
ンダ、ソレノイド等を作動させて基板を前記位置決めピ
ン側に付勢することで位置決めしていた。
In order to always position the substrate at a design position (predetermined position) on the transfer table, Xs orthogonal to each other are set.
One or two positioning pins are provided on the axis and the Y axis, and an air cylinder, a solenoid, and the like are operated to bias the substrate toward the positioning pins, thereby performing positioning.
【0004】[0004]
【発明が解決しようとする課題】上記従来技術では、基
板検査中常時シリンダ、ソレノイド等に電気を供給して
おかなければならず省電に反するものであった。また停
電、一時的な電圧変動などでシリンダ、ソレノイド等の
作用が消失すると、基板を所定位置に保持することが出
来なくなり、テーブルから落下し基板の検査を行うこと
ができない。また落下しないとしても、付勢力が変化す
ると基板が所定位置からずれて、正確な検査を行えない
という問題が生じていた。
In the above prior art, electricity must be supplied to the cylinder, the solenoid and the like at all times during the board inspection, which is against power saving. Further, when the action of the cylinder, the solenoid or the like is lost due to a power failure, temporary voltage fluctuation, or the like, the substrate cannot be held at a predetermined position, and the substrate drops from the table and cannot be inspected. Even if the substrate does not fall, there is a problem that if the urging force changes, the substrate is displaced from a predetermined position, making it impossible to perform an accurate inspection.
【0005】本発明は、上記のような問題に鑑みてなさ
れたものであり、省電に寄与するとともに、基板検査装
置においてシリンダ、ソレノイド等の作用力がなくなっ
たとしても、付勢手段の付勢力(自己保持力)のみで基
板押圧部材が基板を所定位置に正確に位置決めして高精
度で基板検査を行うことができる基板検査装置を提供す
ることを目的とする。
The present invention has been made in view of the above-described problems, and contributes to power saving. In addition, even if the operating force of a cylinder, a solenoid, or the like is lost in a board inspection apparatus, the provision of an urging means is not required. It is an object of the present invention to provide a board inspection apparatus capable of performing a board inspection with high accuracy by a board pressing member accurately positioning a board at a predetermined position only by a force (self-holding force).
【0006】[0006]
【課題を解決するための手段】この発明では、基板に形
成された回路パターンに接触子を接触させて当該回路パ
ターンを検査する基板検査装置であって、前記基板を載
置可能に構成されたテーブルと、前記基板を前記テーブ
ルの所定位置に保持するための基板保持手段とを有し、
前記基板保持手段は、前記基板を前記テーブルの所定位
置に保持するための位置決めピンと、基板押圧部材と、
前記基板押圧部材を前記基板に向けて付勢する付勢手段
と、前記付勢手段に抗して前記基板押圧部材を基板押圧
位置から離間させる押圧解除手段とからなり、前記押圧
解除手段が非作動の状態では前記付勢手段により前記基
板押圧部材を基板に向けて付勢して基板を所定位置に位
置決めし、押圧解除手段が作動の状態では前記付勢手段
に抗して前記基板押圧部材を基板押圧位置から離間させ
ることものである。(請求項1) 上記構成によれば、押圧解除手段を作動状態にして基板
をテーブルに載置した後、当該押圧解除手段を非作動状
態にすると、付勢手段の付勢力によって基板が位置決め
ピンに押圧され、これにより、基板がテーブルの所定位
置に固定される。また、検査終了後、押圧解除手段を作
動させると基板の位置決めピン側への押圧状態が解除さ
れ、当該基板のテーブルからの取り外しが可能となる。
According to the present invention, there is provided a board inspection apparatus for inspecting a circuit pattern formed on a substrate by bringing a contact into contact with the circuit pattern, wherein the substrate can be placed thereon. A table, having a substrate holding means for holding the substrate at a predetermined position of the table,
The substrate holding means, a positioning pin for holding the substrate at a predetermined position of the table, a substrate pressing member,
Urging means for urging the substrate pressing member toward the substrate, and pressing releasing means for separating the substrate pressing member from the substrate pressing position against the urging means, wherein the pressing releasing means is non- In the activated state, the urging means urges the substrate pressing member toward the substrate to position the substrate at a predetermined position, and when the depressing means is activated, the substrate pressing member opposes the urging means. Is separated from the substrate pressing position. (Claim 1) According to the above configuration, when the pressing release means is activated and the substrate is placed on the table, and then the pressing release means is deactivated, the substrate is positioned by the urging force of the urging means. To fix the substrate at a predetermined position on the table. When the pressing release means is operated after the inspection, the pressing state of the substrate toward the positioning pins is released, and the substrate can be removed from the table.
【0007】[0007]
【発明の実施の形態】図1は、この発明にかかる基板検
査装置の一実施形態を示す側断面図であり、図2は図1
の基板検査装置の平面図である。なお、両図には後述す
る各図との方向関係を明確にするために、XYZ直角座
標軸を示している。
FIG. 1 is a side sectional view showing an embodiment of a substrate inspection apparatus according to the present invention, and FIG.
FIG. 2 is a plan view of the substrate inspection apparatus of FIG. Both figures show XYZ rectangular coordinate axes in order to clarify the directional relationship with each figure described later.
【0008】これらの図に示すように、この基板検査装
置では、装置手前側(−Y側)に装置本体1に対して開
閉扉11が開閉自在に取付けられており、この開閉扉1
1を開いて検査対象であるプリント基板などの基板2を
装置前側中央部に設けられた搬出入部3に搬入可能とな
っている。また、この搬出入部3の後側(+Y側)に
は、基板2の検査を行う検査部4が設けられており、こ
の検査部4に電気的に接続されたスキャナー74によっ
て検査されて基板の良否判定が行われた後、検査済みの
基板2が再度搬出入部3に戻され、開閉扉11を介して
オペレータによって搬出可能となっている。なお、この
実施形態では、基板2の搬出入はオペレータによるマニ
ュアル操作となっているが、搬出入部3の左右方向(X
方向)の一方側に外部装置からの基板を受取り、搬出入
部3に検査前の基板2を移載する基板搬入機構を設ける
一方、他方側に搬出入部3から検査済みの基板2を受取
り、外部装置に搬出する基板搬出機構を別途追加装備す
ることで基板の自動搬送が可能となる。
As shown in these figures, in this board inspection apparatus, an opening / closing door 11 is attached to the apparatus body 1 on the front side (−Y side) of the apparatus so as to be openable and closable.
1, a board 2 such as a printed board to be inspected can be carried into a carry-in / carry-out section 3 provided at a central portion on the front side of the apparatus. An inspection section 4 for inspecting the substrate 2 is provided on the rear side (+ Y side) of the carry-in / out section 3. The inspection section 4 is inspected by a scanner 74 which is electrically connected to the inspection section 4, and performs inspection of the substrate. After the pass / fail judgment is made, the inspected substrate 2 is returned to the carry-in / out section 3 again, and can be carried out by the operator via the opening / closing door 11. In this embodiment, the loading and unloading of the substrate 2 is performed manually by an operator.
Direction), a substrate loading mechanism for receiving the substrate 2 from the external device and loading and unloading the substrate 2 before inspection is provided in the loading / unloading unit 3, and receiving the inspected substrate 2 from the loading / unloading unit 3 on the other side. The substrate can be automatically transferred by additionally providing a substrate unloading mechanism for unloading the substrate.
【0009】この基板検査装置では、搬出入部3と検査
部4との間で基板2を搬送するために、搬送テーブル5
がY方向に移動自在に設けられるとともに、搬送テーブ
ル駆動機構6によってY方向に移動位置決めされるよう
に構成されている。すなわち、搬送テーブル駆動機構6
では、Y方向に延びる2本のガイドレール61,61が
一定間隔だけX方向に離隔して配置され、これらのガイ
ドレール61,61に沿って搬送テーブル5がスライド
自在となっている。また、これらのガイドレール61,
61と平行にボールネジ62が配置され、このボールネ
ジ62の一方端側(−Y側)が装置本体1に軸支される
とともに、他方端側(+Y側)が搬送テーブル駆動用の
モータ63の回転軸64と連結されている。さらに、こ
のボールネジ62には、搬送テーブル5を固定したブラ
ケット65が螺合されている。このため、後で説明する
制御部からの指令にしたがってモータ63が回転駆動す
ると、その回転量に応じて搬送テーブル5がY方向に移
動して搬出入部3と検査部4との間を往復移動する。な
お、搬送テーブル5の詳細については、後で説明する。
In this substrate inspection apparatus, the transport table 5 is transported between the loading / unloading section 3 and the inspection section 4 to transport the substrate 2.
Are provided so as to be movable in the Y direction, and are configured to be moved and positioned in the Y direction by the transport table drive mechanism 6. That is, the transport table driving mechanism 6
In the embodiment, two guide rails 61 extending in the Y direction are arranged at a predetermined interval in the X direction, and the transport table 5 is slidable along the guide rails 61. In addition, these guide rails 61,
A ball screw 62 is disposed in parallel with 61. One end (−Y side) of the ball screw 62 is supported by the apparatus main body 1, and the other end (+ Y side) of the motor 63 for driving the transport table is rotated. It is connected to the shaft 64. Further, a bracket 65 to which the transfer table 5 is fixed is screwed to the ball screw 62. For this reason, when the motor 63 is driven to rotate in accordance with a command from the control unit, which will be described later, the transport table 5 moves in the Y direction according to the amount of rotation, and reciprocates between the carry-in / out unit 3 and the inspection unit 4. I do. The details of the transport table 5 will be described later.
【0010】検査部4では、搬送テーブル5の移動経路
を挟んで上方側(+Z側)に基板2の上面側に形成され
た回路パターンを検査するための上部検査ユニット4U
が配置される一方、下方側(−Z側)に基板2の下面側
に形成された回路パターンを検査するための下部検査ユ
ニット4Dが配置されている。これらの検査ユニット4
U,4Dはともに同一構成を有しており、搬送テーブル
5の移動経路を挟んで対称配置されている。したがっ
て、ここでは、上部検査ユニット4Uの構成について説
明し、下部検査ユニット4Dについては同一符号を付し
て説明を省略する。
In the inspection section 4, an upper inspection unit 4U for inspecting a circuit pattern formed on the upper surface side of the substrate 2 on the upper side (+ Z side) with the moving path of the transport table 5 interposed therebetween.
On the other hand, a lower inspection unit 4D for inspecting a circuit pattern formed on the lower surface side of the substrate 2 is disposed below (−Z side). These inspection units 4
U and 4D have the same configuration, and are symmetrically arranged with the moving path of the transport table 5 interposed therebetween. Therefore, here, the configuration of the upper inspection unit 4U will be described, and the lower inspection unit 4D will be denoted by the same reference numerals and description thereof will be omitted.
【0011】この上部検査ユニット4Uでは、検査治具
41によって複数の接触子42が保持されている。これ
らの接触子42の先端部は搬送テーブル5側を向いて検
査治具41から突設しており、この検査治具41に連結
された検査治具駆動機構43を制御部によって駆動制御
することで、検査対象たる基板2に対して相対的に位置
決めされた後に基板2上の回路パターンと接触する。
In the upper inspection unit 4U, a plurality of contacts 42 are held by an inspection jig 41. The distal ends of these contacts 42 project from the inspection jig 41 toward the transfer table 5 side, and the control unit drives and controls the inspection jig driving mechanism 43 connected to the inspection jig 41. Then, after being positioned relatively to the substrate 2 to be inspected, it comes into contact with the circuit pattern on the substrate 2.
【0012】この検査治具駆動機構43は、図3に示す
ように、装置本体1に対してX方向に検査治具41を移
動させるX治具駆動部43Xと、X治具駆動部43Xに
連結されて検査治具41をY方向に移動させるY治具駆
動部43Yと、Y治具駆動部43Yに連結されて検査治
具41をZ軸回り回転移動させるθ治具駆動部43θ
と、θ治具駆動部43θに連結されて検査治具41をZ
方向に移動させるZ治具駆動部43Zとで構成されてお
り、検査治具41を搬送テーブル5に対して相対的に位
置決めしたり、検査治具41を上下方向(Z方向)に昇
降させて接触子42を基板2に形成された回路パターン
に対して接触させたり、離間させたりすることができる
ように構成されている。
As shown in FIG. 3, the inspection jig driving mechanism 43 includes an X jig driving section 43X for moving the inspection jig 41 in the X direction with respect to the apparatus body 1, and an X jig driving section 43X. A Y jig driving unit 43Y connected to move the inspection jig 41 in the Y direction, and a θ jig driving unit 43θ connected to the Y jig driving unit 43Y to rotate the inspection jig 41 around the Z axis.
And the inspection jig 41 connected to the θ jig driving section 43θ
The jig driving unit 43Z moves the inspection jig 41 relative to the transport table 5 or moves the inspection jig 41 up and down (Z direction). It is configured such that the contact 42 can be brought into contact with or separated from the circuit pattern formed on the substrate 2.
【0013】図4は基板保持手段の要部を示す平面図で
ある。図2および図4を参照しつつ搬送テーブル5の構
成について詳述する。この搬送テーブル5には、図4に
示すように、基板2を載置するために基板載置台51が
取り付けられている。基板載置台51の適所にはX軸と
平行なライン上に2個の係合ピン53が、またY軸と平
行なライン上1個の係合ピン53がそれぞれ突設されて
いる。この基板載置台51では、基板2は基板保持手段
52により係合ピン53で位置決めされる所定位置に保
持される。すなわち、載置された基板2が3本の係合ピ
ン53と係合するとともに、これらの係合ピン53と対
向する方向から基板押圧部材54X,54Y、圧縮ばね
55(付勢手段)によって基板2を係合ピン53側に付
勢して基板載置台51上の所定位置で基板2を保持可能
としている。また、このように保持された基板2の下面
に形成された回路パターンに下部検査ユニット4Dの接
触子42を接触させるために、基板載置台51には貫通
開口(図示しない)が形成されている。
FIG. 4 is a plan view showing a main part of the substrate holding means. The configuration of the transport table 5 will be described in detail with reference to FIGS. As shown in FIG. 4, a substrate mounting table 51 for mounting the substrate 2 is attached to the transfer table 5. Two engagement pins 53 are provided at appropriate positions on the substrate mounting table 51 on a line parallel to the X axis, and one engagement pin 53 is provided on a line parallel to the Y axis. In the substrate mounting table 51, the substrate 2 is held by the substrate holding means 52 at a predetermined position determined by the engagement pins 53. That is, the mounted substrate 2 is engaged with the three engagement pins 53, and the substrate pressing members 54X and 54Y and the compression spring 55 (biasing means) from the direction facing the engagement pins 53. The substrate 2 can be held at a predetermined position on the substrate mounting table 51 by urging the substrate 2 toward the engagement pin 53. Further, a through-opening (not shown) is formed in the substrate mounting table 51 in order to make the contact 42 of the lower inspection unit 4D contact the circuit pattern formed on the lower surface of the substrate 2 thus held. .
【0014】次に、図3に戻って、上記のように構成さ
れた基板検査装置の電気的構成について説明する。この
基板検査装置には、CPU,ROM,RAM,モータド
ライバ等を備えて予めROMに記憶されているプログラ
ムに従って装置全体を制御する制御部171を備えてい
る。そして、制御部171が搬送テーブル駆動機構6や
検査治具駆動機構43を駆動制御して搬送テーブル5上
の基板2に形成された回路パターンに接触子42を接触
させる。また、制御部171はテスターコントローラ1
73と電気的に接続されており、上記のようにして回路
パターンへの接触子42の接触が完了すると、制御部1
71からテスターコントローラ173に検査開始指令が
与えられ、接触子42と電気的に接続されたスキャナー
174から検査信号が送られて検査が実行される。そし
て、その検査結果がテスターコントローラ173を介し
て制御部171に与えられる。さらに、制御部171に
は、操作パネル175が電気的に接続されており、オペ
レータからの指令やパラメータなどが制御部171に与
えられる。
Next, returning to FIG. 3, the electrical configuration of the substrate inspection apparatus configured as described above will be described. The board inspection apparatus includes a control unit 171 including a CPU, a ROM, a RAM, a motor driver, and the like, and controlling the entire apparatus according to a program stored in the ROM in advance. Then, the control section 171 drives and controls the transport table driving mechanism 6 and the inspection jig driving mechanism 43 to bring the contact 42 into contact with the circuit pattern formed on the substrate 2 on the transport table 5. The control unit 171 is a tester controller 1
When the contact of the contact 42 with the circuit pattern is completed as described above, the control unit 1
An inspection start command is given from 71 to the tester controller 173, and an inspection signal is sent from a scanner 174 electrically connected to the contact 42 to execute the inspection. Then, the inspection result is provided to the control unit 171 via the tester controller 173. Further, an operation panel 175 is electrically connected to the control unit 171, and commands and parameters from an operator are given to the control unit 171.
【0015】図5は基板押圧部材の詳細図であり、図6
は押圧解除手段全体を示す図である。図4ないし図6に
基づいて本発明に係る基板保持手段について詳述する。
基板押圧部材54X,54Yには図5において中央部、
左方部に長円形状の開口部541,542が形成されて
いる。そして、上方より螺子543,544を導入し
て、基板載置台51の螺合部511,512と螺合させ
る。螺子543,544の中央部分は螺子部が形成され
ておらず、前記長円形状の開口部541,542と係合
し、基板押圧部材54XのX方向への移動、及び54Y
のY方向への移動を自在としている。
FIG. 5 is a detailed view of the substrate pressing member, and FIG.
FIG. 3 is a view showing the entire pressing release means. The substrate holding means according to the present invention will be described in detail with reference to FIGS.
The substrate pressing members 54X and 54Y have central portions in FIG.
Elliptical openings 541 and 542 are formed on the left side. Then, the screws 543 and 544 are introduced from above and screwed into the screwing portions 511 and 512 of the substrate mounting table 51. The central portion of the screws 543 and 544 is not formed with a screw portion, and engages with the elliptical openings 541 and 542 to move the substrate pressing member 54X in the X direction and 54Y.
Can be freely moved in the Y direction.
【0016】基板載置台51には基板押圧部材54X,
54Yと実質的に同一幅の溝部510が形成され、基板
押圧部材54XはX方向、54YはY方向に移動自在に
支持されている。さらに基板載置台51には各基板の大
きさに応じた位置決めを行うための位置決めピン53が
所定位置に3個設けられている。さらに基板載置台51
には、テーブル5に取り付けるための位置基準を行うた
めの位置基準孔51Aが2箇所に形成されている。従っ
て、検査する基板の種類を変更する時には基板載置台5
1全体を各基板に応じたものに交換してテーブル5の位
置決めピン(図示せず)に前記位置基準孔51Aを係合
させて取り付ける。
A substrate pressing member 54X,
A groove 510 having substantially the same width as 54Y is formed, and the substrate pressing member 54X is movably supported in the X direction and 54Y is movably supported in the Y direction. Further, the substrate mounting table 51 is provided with three positioning pins 53 at predetermined positions for performing positioning according to the size of each substrate. Further, the substrate mounting table 51
Are provided with two position reference holes 51A for performing position reference for attaching to the table 5. Therefore, when changing the type of the substrate to be inspected, the substrate mounting table 5
1 is replaced with a component corresponding to each substrate, and the positioning pin (not shown) of the table 5 is engaged with the position reference hole 51A and attached.
【0017】基板押圧部材54X,54Yの両側部には
側溝546,547が形成されている。該側溝546,
547には圧縮ばね55より構成される付勢手段が介装
される。圧縮ばね55は一端部(足部)が側溝546,
547の左端部と係合し、他端部(頭部)は基板載置台
51に形成された凹部56に係合される。従って、圧縮
ばね55の作用により基板押圧部材54Xは+X方向
(図4において右方向)、基板押圧部材54Yは+Y方
向(図4において上方向)へ押圧されることになる。
Side grooves 546 and 547 are formed on both sides of the substrate pressing members 54X and 54Y. The side groove 546,
A biasing means including a compression spring 55 is interposed in 547. One end (foot) of the compression spring 55 has a side groove 546,
The other end (head) is engaged with a concave portion 56 formed in the substrate mounting table 51. Accordingly, the substrate pressing member 54X is pressed in the + X direction (rightward in FIG. 4) and the substrate pressing member 54Y is pressed in the + Y direction (upward in FIG. 4) by the action of the compression spring 55.
【0018】図4ないし図6に基いて押圧解除手段58
を説明する。押圧解除手段58はエアシリンダー59、
Y方向の解除作動片60、X方向の解除作動片61,6
2より主に構成される。具体的には、Y方向の解除作動
片60は中央部に解除作動片60が旋回するための枢支
軸601が設けられ、一端部に基板押圧部材54Yの係
合孔545に係合する係合ピン602が植設されてい
る。さらに、他端部603はエアシリンダ59のプラン
ジャー591に係合している。
Referring to FIG. 4 to FIG.
Will be described. The pressing release means 58 includes an air cylinder 59,
Release operation piece 60 in the Y direction, release operation pieces 61 and 6 in the X direction
It is mainly composed of two. More specifically, the release operation piece 60 in the Y direction is provided with a pivot shaft 601 for turning the release operation piece 60 at the center, and has an end engaged with the engagement hole 545 of the substrate pressing member 54Y. A mating pin 602 is implanted. Further, the other end 603 is engaged with a plunger 591 of the air cylinder 59.
【0019】同様にX方向の解除作動片61は中央部に
解除作動片61が旋回するための枢支軸611が設けら
れ、一端部にはもう一方の解除作動片62の一端部(図
4において下方部)に形成されている長口622と係合
している。解除作動片62は上部に枢支軸621があ
り、右端部には基板押圧部材54Xの係合孔545に係
合する係合ピン623が植設されている。
Similarly, the release operation piece 61 in the X direction is provided with a pivot shaft 611 for turning the release operation piece 61 at the center, and one end of the other release operation piece 62 (FIG. 4). At the lower part). The release operation piece 62 has a pivot shaft 621 at the upper part, and an engagement pin 623 that engages with the engagement hole 545 of the substrate pressing member 54X is implanted at the right end.
【0020】上述した如く構成されていることにより、
エアシリンダ59が非作動の場合(プランジャー591
が下方位置に停止している場合)には、基板押圧部材5
4X,54Yが側溝546,547に介在されている圧
縮ばね55による付勢力により、基板2を基板載置台5
1の所定位置に位置づける。
By being configured as described above,
When the air cylinder 59 is not operated (plunger 591
Is stopped at the lower position), the substrate pressing member 5
The substrate 2 is moved to the substrate mounting table 5 by the urging force of the compression spring 55 in which 4X and 54Y are interposed in the side grooves 546 and 547.
1 at a predetermined position.
【0021】一方、エアシリンダ59が作動すると、プ
ランジャー591が上方へ伸長し、これにより右側の解
除作動片60は、図4において仮想線図示されている如
く枢支軸601を中心として時計周り方向へ旋回し、基
板押圧部材54Yは係合ピン602の作用を受けて圧縮
ばね55の付勢力に抗して下方へ移動して、基板2に対
する押圧作用が解除される。
On the other hand, when the air cylinder 59 is actuated, the plunger 591 is extended upward, so that the release actuating piece 60 on the right side rotates clockwise about the pivot shaft 601 as shown in phantom in FIG. Then, the substrate pressing member 54Y moves downward against the urging force of the compression spring 55 under the action of the engagement pin 602, and the pressing operation on the substrate 2 is released.
【0022】また図4において仮想線図示されている如
く、左側の解除作動片61が枢支軸611を中心として
反時計周り方向へ旋回し、同時に解除作動片62が枢支
軸621を中心として反時計周り方向へ旋回し、基板押
圧部材54Xは係合ピン623の作用を受けて圧縮ばね
55の付勢力に抗して左方へ移動し、基板2に対する押
圧作用が解除される。
As shown by the imaginary line in FIG. 4, the release operation piece 61 on the left side pivots counterclockwise around the pivot shaft 611, and at the same time, the release operation piece 62 pivots about the pivot shaft 621. Turning in the counterclockwise direction, the board pressing member 54X moves to the left against the urging force of the compression spring 55 under the action of the engagement pin 623, and the pressing action on the board 2 is released.
【0023】図7は基板保持手段の他の実施形態を示す
図であり、同図により説明する。この実施形態におい
て、基板保持手段70はX方向に基板を位置決めする基
板押圧部材71X、及びY方向に基板を位置決めする基
板押圧部材71Yから主に構成される。基板押圧部材7
1X,71Yには中央部に長円形状の開口部711が2
ケ所に形成されている。基板載置台51の2箇所の所定
位置にはピン72が間隔をおいて2本植設されており、
ピン72と基板押圧部材71の開口部711が係合させ
られる。基板押圧部材71XのX方向への移動、及び7
1YのY方向への移動を自在に保持している。
FIG. 7 is a view showing another embodiment of the substrate holding means, which will be described with reference to FIG. In this embodiment, the substrate holding means 70 mainly includes a substrate pressing member 71X for positioning the substrate in the X direction and a substrate pressing member 71Y for positioning the substrate in the Y direction. Substrate pressing member 7
1X and 71Y have two elliptical openings 711 at the center.
It is formed in two places. At two predetermined positions of the substrate mounting table 51, two pins 72 are planted at intervals.
The pin 72 and the opening 711 of the substrate pressing member 71 are engaged. Movement of the substrate pressing member 71X in the X direction;
1Y is freely movable in the Y direction.
【0024】基板押圧部材71X,71Yの両側部には
圧縮ばね73より構成される付勢手段が形成されてい
る。まず、付勢手段支持部材74は基板押圧片71の左
右2ケ所に基板載置台51に対して固着して設けられて
おり、当該付勢手段支持部材74の立設片741に対し
て螺子75が螺合されている。さらに螺子75は基板押
圧片71X,71Yの立設部711に形成された係合孔
(図示せず)に遊挿される。圧縮ばね73は立設片74
1及び立設部711に亘って螺子75を外囲するように
して介装される。これにより、圧縮ばね73の作用によ
り基板押圧部材71XはX方向、基板押圧部材71Yは
Y方向へ押圧されることになる。従って、基板2は基板
載置台51の所定位置に位置決めピン53によって位置
付けられる。
On both sides of the substrate pressing members 71X and 71Y, urging means constituted by a compression spring 73 are formed. First, the urging means support members 74 are fixedly provided on the substrate mounting table 51 at two places on the left and right sides of the substrate pressing piece 71, and a screw 75 is attached to the standing piece 741 of the urging means support member 74. Is screwed. Further, the screw 75 is loosely inserted into an engagement hole (not shown) formed in the upright portion 711 of the substrate pressing pieces 71X and 71Y. The compression spring 73 is a standing piece 74
It is interposed so as to surround the screw 75 over the 1 and the standing portion 711. Thus, the substrate pressing member 71X is pressed in the X direction and the substrate pressing member 71Y is pressed in the Y direction by the action of the compression spring 73. Therefore, the substrate 2 is positioned at a predetermined position on the substrate mounting table 51 by the positioning pins 53.
【0025】同図に基いて押圧解除手段の他の実施形態
について説明する。押圧解除手段80は基板保持手段7
1に関連して設けられ、エアシリンダー83より主に構
成される。具体的には圧縮ばね73による基板押圧部材
71X,71Yの付勢力を解除するために基板押圧部材
71X,71Yに対して各々設けられている。エアシリ
ンダー支持部材81は螺子82によりテーブル5に固定
され、エアシリンダー支持部材81の立設片811に対
しエアシリンダー83はナット832により支持されて
いる。基板押圧部材71X,71Yの一端部には枢支軸
713が設けられ、該枢支軸713に回転体712が回
転自在に支持されている。そして回転体712はエアシ
リンダ83のプランジャー831に係合可能な如く配置
されている。
Another embodiment of the pressure releasing means will be described with reference to FIG. The pressing release means 80 is the substrate holding means 7
1 and is mainly constituted by the air cylinder 83. Specifically, it is provided for each of the substrate pressing members 71X and 71Y in order to release the urging force of the substrate pressing members 71X and 71Y by the compression spring 73. The air cylinder support member 81 is fixed to the table 5 by screws 82, and the air cylinder 83 is supported by a nut 832 with respect to the standing piece 811 of the air cylinder support member 81. A pivot 713 is provided at one end of each of the substrate pressing members 71X and 71Y, and a rotating body 712 is rotatably supported by the pivot 713. The rotating body 712 is arranged to be able to engage with the plunger 831 of the air cylinder 83.
【0026】上述した如く構成されていることにより、
エアシリンダ83が非作動の場合には、基板押圧部材7
1X,71Yが圧縮ばね73の付勢力により、基板2を
所定位置に位置付ける。
With the above configuration,
When the air cylinder 83 is not operated, the substrate pressing member 7
1X and 71Y position the substrate 2 at a predetermined position by the urging force of the compression spring 73.
【0027】エアシリンダ83の作動については、基板
押圧部材71Yについてのみ説明を行う。エアシリンダ
83が作動すると、作動部材831が右方へ移動し、こ
れにより枢支軸713の回転体712が圧縮ばね73の
付勢力に抗して回転しながら下方に押し下げられ基板押
圧部材71Y全体が下方に移動する。これによって、基
板2に対する押圧手段の押圧が解除される。
The operation of the air cylinder 83 will be described only for the substrate pressing member 71Y. When the air cylinder 83 operates, the operating member 831 moves to the right, whereby the rotating body 712 of the pivot shaft 713 is pushed down while rotating against the urging force of the compression spring 73, and the entire substrate pressing member 71Y is rotated. Moves down. Thereby, the pressing of the pressing means against the substrate 2 is released.
【0028】前記実施形態においては、基板押圧部材5
4X,54Yの開口部541,542の上方より螺子5
43,544を導入し、基板載置台51の螺合部51
1,512と螺合させて、基板押圧部材54X、54Y
をX方向、Y方向に移動させたものを例示したが、螺子
543,544に代えてテーブル5の所要位置にピンを
突設させて、このピンに対して基板押圧部材54X,5
4Yの開口部541,542を係合させてもよい。
In the above embodiment, the substrate pressing member 5
4X, 54Y screws 5 from above the openings 541, 542
43 and 544 are introduced, and the threaded portion 51 of the substrate mounting table 51 is introduced.
1, 512, and the substrate pressing members 54X, 54Y
Is moved in the X direction and the Y direction. However, instead of the screws 543 and 544, a pin is protruded at a required position of the table 5, and the board pressing members 54X and 5
The openings 541 and 542 of the 4Y may be engaged.
【0029】本実施形態においては、被検査基板の大き
さに応じて基板押圧部材、位置決めピン、付勢部材を具
備する基板載置台51を交換することで、各基板に応じ
た位置決めが正確になされる。また、付勢手段を適切な
付勢力へ変更することが容易であり、かつ基板載置台5
1を上方からの交換が可能で作業自体も容易となる。
In this embodiment, the positioning according to each substrate is accurately performed by replacing the substrate mounting table 51 provided with the substrate pressing member, the positioning pin, and the urging member according to the size of the substrate to be inspected. Done. Further, it is easy to change the urging means to an appropriate urging force, and the substrate mounting table 5
1 can be exchanged from above, and the work itself becomes easy.
【0030】更に、本実施形態においては、付勢手段と
しての圧縮ばね55,73の交換が極めて容易なため、
被検査基板の大きさが同じであっても、厚さが異なるよ
うな場合、基板載置台51自体は交換せずに、各基板の
厚みに応じた適切な付勢力の付勢手段に交換して基板を
所定位置に位置決めし保持することもできる。
Further, in this embodiment, since the replacement of the compression springs 55 and 73 as the urging means is extremely easy,
In the case where the thicknesses of the substrates to be inspected are the same but the thicknesses are different, the substrate mounting table 51 is not replaced, but replaced with a biasing means having an appropriate biasing force according to the thickness of each substrate. Thus, the substrate can be positioned and held at a predetermined position.
【0031】[0031]
【発明の効果】以上詳述した如く本発明のよれば、基板
をテーブルの所定位置に保持するための基板保持手段
は、基板をテーブルの所定位置に保持するための位置決
めピンと、基板押圧部材と、基板押圧部材を基板に向け
て付勢する付勢手段と、付勢手段に抗して基板押圧部材
を基板押圧位置から離間させる押圧解除手段とからな
り、押圧解除手段が非作動の状態では付勢手段により基
板押圧部材を基板に向けて付勢し基板を所定位置に位置
決めし、押圧解除手段が作動の状態では付勢手段に抗し
て基板押圧部を基板押圧位置から離間させるようにした
ので、停電、一時的電圧変動などでシリンダ、ソレノイ
ド等の押圧解除手段の作用力がなくなったとしても、付
勢手段の付勢力(自己保持力)のみで基板押圧部材が基
板を所定位置に正確に押圧し位置決めして高精度で基板
検査を行うことができる。また基板の検査時は押圧手段
が非作動であるため省電が可能となる。さらに、被検査
基板の大きさ、厚さ等サイズに応じた適切な付勢力の付
勢手段によって基板を所定位置に位置決めし保持するこ
とが出来る。
As described above in detail, according to the present invention, the substrate holding means for holding the substrate at the predetermined position on the table comprises: a positioning pin for holding the substrate at the predetermined position on the table; An urging means for urging the substrate pressing member toward the substrate, and a pressure releasing means for separating the substrate pressing member from the substrate pressing position in opposition to the urging means. The biasing means biases the substrate pressing member toward the substrate to position the substrate at a predetermined position, and when the pressing release means is in operation, the substrate pressing portion is separated from the substrate pressing position against the biasing means. Therefore, even if the pressing force of the cylinder, the solenoid or the like is lost due to power failure, temporary voltage fluctuation, etc., the substrate pressing member moves the substrate to a predetermined position only by the urging force (self-holding force) of the urging means. accurately It is possible to perform substrate inspection was pressurized positioned with high accuracy. Further, when the substrate is inspected, power is saved because the pressing means is not operated. Further, the substrate can be positioned and held at a predetermined position by an urging means of an appropriate urging force according to the size, thickness, and the like of the substrate to be inspected.
【図面の簡単な説明】[Brief description of the drawings]
【図1】この発明にかかる基板検査装置の一実施形態を
示す側断面図である。
FIG. 1 is a side sectional view showing an embodiment of a substrate inspection apparatus according to the present invention.
【図2】図1の基板検査装置の平面図である。FIG. 2 is a plan view of the substrate inspection apparatus of FIG.
【図3】図1の基板検査装置の概略構成を示す模式図で
ある。
FIG. 3 is a schematic diagram illustrating a schematic configuration of the substrate inspection apparatus of FIG. 1;
【図4】基板保持手段全体を示す図である。FIG. 4 is a diagram showing the entire substrate holding means.
【図5】基板押圧部材の詳細を示す断面図である。FIG. 5 is a sectional view showing details of a substrate pressing member.
【図6】押圧解除手段全体を示す図である。FIG. 6 is a diagram showing the entire pressing release means.
【図7】基板保持手段の他の実施形態を示す図である。FIG. 7 is a view showing another embodiment of the substrate holding means.
【符号の説明】[Explanation of symbols]
2…基板 5…搬送テーブル 41…検査治具 42…接触子 52,70…基板保持手段 53…位置決めピン 54X,54Y,71X,71Y…基板押圧部材 55,73…圧縮ばね(付勢手段) 58,80…押圧解除手段 2 ... substrate 5 ... transport table 41 ... inspection jig 42 ... contact 52, 70 ... substrate holding means 53 ... positioning pins 54X, 54Y, 71X, 71Y ... substrate pressing members 55, 73 ... compression springs (biasing means) 58 , 80 ... Press release means
───────────────────────────────────────────────────── フロントページの続き Fターム(参考) 2G011 AA02 AA16 AB01 AB03 AC06 AC21 AE01 AF06 2G014 AA14 AB59 AC09 AC10 AC12 2G032 AA00 AC10 AE01 AE02 AE03 AE04 AE07 AE10 AE12 AF04 AL00  ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2G011 AA02 AA16 AB01 AB03 AC06 AC21 AE01 AF06 2G014 AA14 AB59 AC09 AC10 AC12 2G032 AA00 AC10 AE01 AE02 AE03 AE04 AE07 AE10 AE12 AF04 AL00

Claims (1)

    【特許請求の範囲】[Claims]
  1. 【請求項1】 基板に形成された回路パターンに接触子
    を接触させて当該回路パターンを検査する基板検査装置
    であって、 前記基板を載置可能に構成されたテーブルと、 前記基板を前記テーブルの所定位置に保持するための基
    板保持手段とを有し、 前記基板保持手段は、 前記基板を前記テーブルの所定位置に保持するための位
    置決めピンと、 基板押圧部材と、 前記基板押圧部材を前記基板に向けて付勢する付勢手段
    と、 前記付勢手段に抗して前記基板押圧部材を基板押圧位置
    から離間させる押圧解除手段とからなり、 前記押圧解除手段が非作動の状態では前記付勢手段によ
    り前記基板押圧部材を基板に向けて付勢して基板を所定
    位置に位置決めし、押圧解除手段が作動の状態では前記
    付勢手段に抗して前記基板押圧部材を基板押圧位置から
    離間させることを特徴とする基板検査装置。
    1. A board inspection apparatus for inspecting a circuit pattern formed by contacting a contact with a circuit pattern formed on the board, comprising: a table on which the substrate can be placed; Substrate holding means for holding the substrate at a predetermined position, the substrate holding means comprising: a positioning pin for holding the substrate at a predetermined position on the table; a substrate pressing member; and And urging means for urging the substrate pressing member away from the substrate pressing position against the urging means, wherein the urging is performed when the pressing releasing means is not operated. Means for urging the substrate pressing member toward the substrate to position the substrate at a predetermined position, and when the pressing release means is in operation, the substrate pressing member is moved to the substrate pressing position against the urging means. Substrate inspection device, characterized in that to separate.
JP11149602A 1999-05-28 1999-05-28 Inspection device for substrate Pending JP2000338164A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11149602A JP2000338164A (en) 1999-05-28 1999-05-28 Inspection device for substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11149602A JP2000338164A (en) 1999-05-28 1999-05-28 Inspection device for substrate

Publications (1)

Publication Number Publication Date
JP2000338164A true JP2000338164A (en) 2000-12-08

Family

ID=15478803

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11149602A Pending JP2000338164A (en) 1999-05-28 1999-05-28 Inspection device for substrate

Country Status (1)

Country Link
JP (1) JP2000338164A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020060931A (en) * 2001-01-12 2002-07-19 니혼 덴산 리드 가부시끼가이샤 Apparatus and Method For Probe Testing Printed Circuit Board
JP2014185950A (en) * 2013-03-25 2014-10-02 Hioki Ee Corp Substrate fixing device of substrate to be inspected and substrate fixing method thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020060931A (en) * 2001-01-12 2002-07-19 니혼 덴산 리드 가부시끼가이샤 Apparatus and Method For Probe Testing Printed Circuit Board
JP2002277502A (en) * 2001-01-12 2002-09-25 Nidec-Read Corp Substrate inspection device and substrate inspection method
JP2014185950A (en) * 2013-03-25 2014-10-02 Hioki Ee Corp Substrate fixing device of substrate to be inspected and substrate fixing method thereof

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