TW529080B - Reflection and refraction optical system and exposure device having this system - Google Patents
Reflection and refraction optical system and exposure device having this system Download PDFInfo
- Publication number
- TW529080B TW529080B TW090126179A TW90126179A TW529080B TW 529080 B TW529080 B TW 529080B TW 090126179 A TW090126179 A TW 090126179A TW 90126179 A TW90126179 A TW 90126179A TW 529080 B TW529080 B TW 529080B
- Authority
- TW
- Taiwan
- Prior art keywords
- optical system
- lens
- reticle
- refracting
- imaging optical
- Prior art date
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 477
- 238000003384 imaging method Methods 0.000 claims description 155
- 230000004075 alteration Effects 0.000 claims description 114
- 239000000758 substrate Substances 0.000 claims description 25
- 238000005286 illumination Methods 0.000 claims description 16
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 238000012937 correction Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 5
- 230000005499 meniscus Effects 0.000 description 143
- 235000012431 wafers Nutrition 0.000 description 142
- 238000010586 diagram Methods 0.000 description 60
- 239000004973 liquid crystal related substance Substances 0.000 description 12
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical group [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 description 10
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- 206010010071 Coma Diseases 0.000 description 8
- 229910001634 calcium fluoride Inorganic materials 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 6
- 230000014509 gene expression Effects 0.000 description 6
- 239000013078 crystal Substances 0.000 description 5
- 239000010408 film Substances 0.000 description 4
- 239000001307 helium Substances 0.000 description 4
- 229910052734 helium Inorganic materials 0.000 description 4
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 4
- 239000011261 inert gas Substances 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- 210000002858 crystal cell Anatomy 0.000 description 2
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- 239000010436 fluorite Substances 0.000 description 2
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- 230000005484 gravity Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000005304 optical glass Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- TVEXGJYMHHTVKP-UHFFFAOYSA-N 6-oxabicyclo[3.2.1]oct-3-en-7-one Chemical compound C1C2C(=O)OC1C=CC2 TVEXGJYMHHTVKP-UHFFFAOYSA-N 0.000 description 1
- 206010011878 Deafness Diseases 0.000 description 1
- 101100484217 Rattus norvegicus Slc14a1 gene Proteins 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
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- 238000000206 photolithography Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B17/00—Systems with reflecting surfaces, with or without refracting elements
- G02B17/08—Catadioptric systems
- G02B17/0892—Catadioptric systems specially adapted for the UV
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B17/00—Systems with reflecting surfaces, with or without refracting elements
- G02B17/08—Catadioptric systems
- G02B17/0836—Catadioptric systems using more than three curved mirrors
- G02B17/0844—Catadioptric systems using more than three curved mirrors off-axis or unobscured systems in which all of the mirrors share a common axis of rotational symmetry
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70225—Optical aspects of catadioptric systems, i.e. comprising reflective and refractive elements
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70275—Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lenses (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000322068 | 2000-10-23 | ||
| JP2001003200 | 2001-01-11 | ||
| JP2001309516A JP4245286B2 (ja) | 2000-10-23 | 2001-10-05 | 反射屈折光学系および該光学系を備えた露光装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW529080B true TW529080B (en) | 2003-04-21 |
Family
ID=27345004
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW090126179A TW529080B (en) | 2000-10-23 | 2001-10-23 | Reflection and refraction optical system and exposure device having this system |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US7030965B2 (enExample) |
| EP (1) | EP1336887A4 (enExample) |
| JP (1) | JP4245286B2 (enExample) |
| KR (1) | KR100799418B1 (enExample) |
| CN (1) | CN100460921C (enExample) |
| AU (1) | AU2001295994A1 (enExample) |
| TW (1) | TW529080B (enExample) |
| WO (1) | WO2002035273A1 (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8208198B2 (en) | 2004-01-14 | 2012-06-26 | Carl Zeiss Smt Gmbh | Catadioptric projection objective |
| US8289619B2 (en) | 2004-01-14 | 2012-10-16 | Carl Zeiss Smt Gmbh | Catadioptric projection objective |
| US8363315B2 (en) | 2004-04-08 | 2013-01-29 | Carl Zeiss Smt Gmbh | Catadioptric projection objective with mirror group |
| US8913316B2 (en) | 2004-05-17 | 2014-12-16 | Carl Zeiss Smt Gmbh | Catadioptric projection objective with intermediate images |
Families Citing this family (60)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6995930B2 (en) | 1999-12-29 | 2006-02-07 | Carl Zeiss Smt Ag | Catadioptric projection objective with geometric beam splitting |
| TW538256B (en) | 2000-01-14 | 2003-06-21 | Zeiss Stiftung | Microlithographic reduction projection catadioptric objective |
| JP2004514943A (ja) | 2000-11-28 | 2004-05-20 | カール・ツアイス・エスエムテイ・アーゲー | 157nmリソグラフィ用の反射屈折投影系 |
| DE10210899A1 (de) | 2002-03-08 | 2003-09-18 | Zeiss Carl Smt Ag | Refraktives Projektionsobjektiv für Immersions-Lithographie |
| DE10316428A1 (de) * | 2003-04-08 | 2004-10-21 | Carl Zeiss Smt Ag | Katadioptrisches Reduktionsobjektiv |
| KR101532824B1 (ko) | 2003-04-09 | 2015-07-01 | 가부시키가이샤 니콘 | 노광 방법 및 장치, 그리고 디바이스 제조 방법 |
| KR101516140B1 (ko) * | 2003-05-06 | 2015-05-04 | 가부시키가이샤 니콘 | 투영 광학계, 노광 장치 및 노광 방법 |
| JP4706171B2 (ja) * | 2003-10-24 | 2011-06-22 | 株式会社ニコン | 反射屈折投影光学系、露光装置及び露光方法 |
| US7348575B2 (en) | 2003-05-06 | 2008-03-25 | Nikon Corporation | Projection optical system, exposure apparatus, and exposure method |
| CN1307456C (zh) * | 2003-05-23 | 2007-03-28 | 佳能株式会社 | 投影光学系统、曝光装置及器件的制造方法 |
| US7085075B2 (en) * | 2003-08-12 | 2006-08-01 | Carl Zeiss Smt Ag | Projection objectives including a plurality of mirrors with lenses ahead of mirror M3 |
| TWI609409B (zh) | 2003-10-28 | 2017-12-21 | 尼康股份有限公司 | 照明光學裝置、曝光裝置、曝光方法以及元件製造方法 |
| TWI519819B (zh) | 2003-11-20 | 2016-02-01 | 尼康股份有限公司 | 光束變換元件、光學照明裝置、曝光裝置、以及曝光方法 |
| US7466489B2 (en) * | 2003-12-15 | 2008-12-16 | Susanne Beder | Projection objective having a high aperture and a planar end surface |
| WO2005059645A2 (en) * | 2003-12-19 | 2005-06-30 | Carl Zeiss Smt Ag | Microlithography projection objective with crystal elements |
| CN1910494B (zh) * | 2004-01-14 | 2011-08-10 | 卡尔蔡司Smt有限责任公司 | 反射折射投影物镜 |
| US7463422B2 (en) | 2004-01-14 | 2008-12-09 | Carl Zeiss Smt Ag | Projection exposure apparatus |
| TWI609410B (zh) | 2004-02-06 | 2017-12-21 | 尼康股份有限公司 | 光學照明裝置、曝光裝置、曝光方法以及元件製造方法 |
| US7400381B2 (en) * | 2004-05-26 | 2008-07-15 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| EP1754110B1 (en) | 2004-06-10 | 2008-07-30 | Carl Zeiss SMT AG | Projection objective for a microlithographic projection exposure apparatus |
| EP1771771B1 (en) | 2004-07-14 | 2009-12-30 | Carl Zeiss SMT AG | Catadioptric projection objective |
| JP5600128B2 (ja) * | 2004-07-14 | 2014-10-01 | カール・ツァイス・エスエムティー・ゲーエムベーハー | カタディオプトリック投影対物系 |
| JP2006119244A (ja) * | 2004-10-20 | 2006-05-11 | Canon Inc | 反射屈折型投影光学系及び当該反射屈折型投影光学系を有する露光装置、デバイス製造方法 |
| EP1844365A1 (en) * | 2005-02-03 | 2007-10-17 | Carl Zeiss SMT AG | Catadioptric projection objective with intermediate image |
| US7324185B2 (en) | 2005-03-04 | 2008-01-29 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| JP5495555B2 (ja) * | 2005-03-31 | 2014-05-21 | ケーエルエー−テンカー コーポレイション | 非球面を使用した小型で超高naの反射屈折対物レンズ |
| JP2006309220A (ja) | 2005-04-29 | 2006-11-09 | Carl Zeiss Smt Ag | 投影対物レンズ |
| US8248577B2 (en) | 2005-05-03 | 2012-08-21 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| KR20170089028A (ko) | 2005-05-12 | 2017-08-02 | 가부시키가이샤 니콘 | 투영 광학계, 노광 장치 및 디바이스 제조 방법 |
| DE102005024290A1 (de) * | 2005-05-27 | 2006-11-30 | Carl Zeiss Smt Ag | Abbildungssystem, insbesondere für eine mikrolithographische Projektionsbelichtungsanlage |
| WO2006128613A1 (en) | 2005-06-02 | 2006-12-07 | Carl Zeiss Smt Ag | Microlithography projection objective |
| EP1746463A2 (de) | 2005-07-01 | 2007-01-24 | Carl Zeiss SMT AG | Verfahren zum Korrigieren eines lithographischen Projektionsobjektivs und derartiges Projektionsobjektiv |
| US7738188B2 (en) * | 2006-03-28 | 2010-06-15 | Carl Zeiss Smt Ag | Projection objective and projection exposure apparatus including the same |
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| EP1852745A1 (en) * | 2006-05-05 | 2007-11-07 | Carl Zeiss SMT AG | High-NA projection objective |
| EP1890191A1 (en) | 2006-08-14 | 2008-02-20 | Carl Zeiss SMT AG | Catadioptric projection objective with pupil mirror |
| WO2008087827A1 (ja) * | 2007-01-16 | 2008-07-24 | Nikon Corporation | 結像光学系、露光装置、およびデバイス製造方法 |
| US7929114B2 (en) | 2007-01-17 | 2011-04-19 | Carl Zeiss Smt Gmbh | Projection optics for microlithography |
| WO2008104192A1 (en) * | 2007-02-28 | 2008-09-04 | Carl Zeiss Smt Ag | Catadioptric projection objective with pupil correction |
| US20080259304A1 (en) * | 2007-04-20 | 2008-10-23 | Asml Netherlands B.V. | Lithographic apparatus and method |
| JP5267029B2 (ja) | 2007-10-12 | 2013-08-21 | 株式会社ニコン | 照明光学装置、露光装置及びデバイスの製造方法 |
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| JP5567098B2 (ja) * | 2012-10-31 | 2014-08-06 | カール・ツァイス・エスエムティー・ゲーエムベーハー | 瞳補正を有する反射屈折投影対物系 |
| DE102013105586B4 (de) * | 2013-05-30 | 2023-10-12 | Carl Zeiss Ag | Vorrichtung zur Abbildung einer Probe |
| CN104062746B (zh) * | 2014-06-23 | 2016-08-24 | 中国科学院光电技术研究所 | 一种大数值孔径的折反射浸没投影光学系统 |
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| CN105807410B (zh) * | 2014-12-31 | 2018-11-09 | 上海微电子装备(集团)股份有限公司 | 一种基于高数值孔径的折反射式投影物镜 |
| JP2015132843A (ja) * | 2015-03-02 | 2015-07-23 | 株式会社ニコン | 投影光学系、露光装置、露光方法、およびデバイス製造方法 |
| JP6358242B2 (ja) * | 2015-11-30 | 2018-07-18 | 株式会社ニコン | 露光装置、露光方法、デバイス製造方法およびパターン形成方法 |
| JP2016136273A (ja) * | 2016-03-07 | 2016-07-28 | 株式会社ニコン | 投影光学系、露光装置、露光方法、およびデバイス製造方法 |
| CN108152940B (zh) * | 2016-12-05 | 2021-04-27 | 佳能株式会社 | 反射折射光学系统、照明光学系统、曝光装置 |
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| CN107582020B (zh) * | 2017-10-20 | 2019-05-31 | 视微影像(河南)科技有限公司 | 一种眼科成像诊断系统 |
| JP2019082711A (ja) * | 2019-01-15 | 2019-05-30 | 株式会社ニコン | 投影光学系、露光装置、露光方法、及びデバイス製造方法 |
| JP2019091057A (ja) * | 2019-01-15 | 2019-06-13 | 株式会社ニコン | 露光装置及びデバイス製造方法 |
| US11512948B2 (en) * | 2020-05-26 | 2022-11-29 | Kla Corporation | Imaging system for buried metrology targets |
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| DE59914179D1 (de) | 1999-02-15 | 2007-03-22 | Zeiss Carl Smt Ag | Mikrolithographie-Reduktionsobjektiveinrichtung sowie Projektionsbelichtungsanlage |
| JP4717974B2 (ja) | 1999-07-13 | 2011-07-06 | 株式会社ニコン | 反射屈折光学系及び該光学系を備える投影露光装置 |
| EP1093021A3 (en) * | 1999-10-15 | 2004-06-30 | Nikon Corporation | Projection optical system as well as equipment and methods making use of said system |
| JP2001185480A (ja) * | 1999-10-15 | 2001-07-06 | Nikon Corp | 投影光学系及び該光学系を備える投影露光装置 |
| US6600608B1 (en) * | 1999-11-05 | 2003-07-29 | Carl-Zeiss-Stiftung | Catadioptric objective comprising two intermediate images |
| TW538256B (en) * | 2000-01-14 | 2003-06-21 | Zeiss Stiftung | Microlithographic reduction projection catadioptric objective |
| JP2001228401A (ja) * | 2000-02-16 | 2001-08-24 | Canon Inc | 投影光学系、および該投影光学系による投影露光装置、デバイス製造方法 |
| US6842298B1 (en) * | 2000-09-12 | 2005-01-11 | Kla-Tencor Technologies Corporation | Broad band DUV, VUV long-working distance catadioptric imaging system |
| JP2004514943A (ja) * | 2000-11-28 | 2004-05-20 | カール・ツアイス・エスエムテイ・アーゲー | 157nmリソグラフィ用の反射屈折投影系 |
-
2001
- 2001-10-05 JP JP2001309516A patent/JP4245286B2/ja not_active Expired - Fee Related
- 2001-10-23 EP EP01976807A patent/EP1336887A4/en not_active Withdrawn
- 2001-10-23 TW TW090126179A patent/TW529080B/zh active
- 2001-10-23 US US10/399,716 patent/US7030965B2/en not_active Expired - Fee Related
- 2001-10-23 AU AU2001295994A patent/AU2001295994A1/en not_active Abandoned
- 2001-10-23 CN CNB018178618A patent/CN100460921C/zh not_active Expired - Fee Related
- 2001-10-23 WO PCT/JP2001/009266 patent/WO2002035273A1/ja not_active Ceased
- 2001-10-23 KR KR1020037005588A patent/KR100799418B1/ko not_active Expired - Fee Related
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8416490B2 (en) | 2004-01-14 | 2013-04-09 | Carl Zeiss Smt Gmbh | Catadioptric projection objective |
| US8730572B2 (en) | 2004-01-14 | 2014-05-20 | Carl Zeiss Smt Gmbh | Catadioptric projection objective |
| US8289619B2 (en) | 2004-01-14 | 2012-10-16 | Carl Zeiss Smt Gmbh | Catadioptric projection objective |
| US8339701B2 (en) | 2004-01-14 | 2012-12-25 | Carl Zeiss Smt Gmbh | Catadioptric projection objective |
| US8355201B2 (en) | 2004-01-14 | 2013-01-15 | Carl Zeiss Smt Gmbh | Catadioptric projection objective |
| US9772478B2 (en) | 2004-01-14 | 2017-09-26 | Carl Zeiss Smt Gmbh | Catadioptric projection objective with parallel, offset optical axes |
| US8208199B2 (en) | 2004-01-14 | 2012-06-26 | Carl Zeiss Smt Gmbh | Catadioptric projection objective |
| US8804234B2 (en) | 2004-01-14 | 2014-08-12 | Carl Zeiss Smt Gmbh | Catadioptric projection objective including an aspherized plate |
| US8208198B2 (en) | 2004-01-14 | 2012-06-26 | Carl Zeiss Smt Gmbh | Catadioptric projection objective |
| US8908269B2 (en) | 2004-01-14 | 2014-12-09 | Carl Zeiss Smt Gmbh | Immersion catadioptric projection objective having two intermediate images |
| US8363315B2 (en) | 2004-04-08 | 2013-01-29 | Carl Zeiss Smt Gmbh | Catadioptric projection objective with mirror group |
| US8913316B2 (en) | 2004-05-17 | 2014-12-16 | Carl Zeiss Smt Gmbh | Catadioptric projection objective with intermediate images |
| US9019596B2 (en) | 2004-05-17 | 2015-04-28 | Carl Zeiss Smt Gmbh | Catadioptric projection objective with intermediate images |
| US9134618B2 (en) | 2004-05-17 | 2015-09-15 | Carl Zeiss Smt Gmbh | Catadioptric projection objective with intermediate images |
| US9726979B2 (en) | 2004-05-17 | 2017-08-08 | Carl Zeiss Smt Gmbh | Catadioptric projection objective with intermediate images |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1535392A (zh) | 2004-10-06 |
| KR20030045130A (ko) | 2003-06-09 |
| KR100799418B1 (ko) | 2008-01-30 |
| AU2001295994A1 (en) | 2002-05-06 |
| JP2002277742A (ja) | 2002-09-25 |
| JP4245286B2 (ja) | 2009-03-25 |
| US20040130806A1 (en) | 2004-07-08 |
| CN100460921C (zh) | 2009-02-11 |
| EP1336887A1 (en) | 2003-08-20 |
| EP1336887A4 (en) | 2008-07-09 |
| WO2002035273A1 (en) | 2002-05-02 |
| US7030965B2 (en) | 2006-04-18 |
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