TW518519B - Method of mounting a microcircuit in a cavity of a card forming a support and resulting card - Google Patents

Method of mounting a microcircuit in a cavity of a card forming a support and resulting card Download PDF

Info

Publication number
TW518519B
TW518519B TW089108676A TW89108676A TW518519B TW 518519 B TW518519 B TW 518519B TW 089108676 A TW089108676 A TW 089108676A TW 89108676 A TW89108676 A TW 89108676A TW 518519 B TW518519 B TW 518519B
Authority
TW
Taiwan
Prior art keywords
hole
cavity
resin
microcircuit
card
Prior art date
Application number
TW089108676A
Other languages
English (en)
Chinese (zh)
Inventor
Francois Bouchez
Francois Launay
Pierre Loubly
Jacques Venambre
Original Assignee
Oberthur Card Syst Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oberthur Card Syst Sa filed Critical Oberthur Card Syst Sa
Application granted granted Critical
Publication of TW518519B publication Critical patent/TW518519B/zh

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
TW089108676A 1999-05-06 2000-05-06 Method of mounting a microcircuit in a cavity of a card forming a support and resulting card TW518519B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9905778A FR2793330B1 (fr) 1999-05-06 1999-05-06 Procede de montage d'un microcircuit dans une cavite d'une carte formant support et carte ainsi obtenue

Publications (1)

Publication Number Publication Date
TW518519B true TW518519B (en) 2003-01-21

Family

ID=9545292

Family Applications (1)

Application Number Title Priority Date Filing Date
TW089108676A TW518519B (en) 1999-05-06 2000-05-06 Method of mounting a microcircuit in a cavity of a card forming a support and resulting card

Country Status (5)

Country Link
US (1) US6513718B1 (enExample)
EP (1) EP1050845B1 (enExample)
JP (1) JP4601024B2 (enExample)
FR (1) FR2793330B1 (enExample)
TW (1) TW518519B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI647621B (zh) * 2013-02-18 2019-01-11 納格維遜股份有限公司 用於智慧卡的塑膠層

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2833801B1 (fr) * 2001-12-19 2005-07-01 Oberthur Card Syst Sa Procede de realisation d'une carte a microcircuit
FI20022094A0 (fi) * 2002-11-25 2002-11-25 Rafsec Oy Transponderi ja menetelmä sen valmistamiseksi
DE102004004289A1 (de) * 2004-01-28 2005-08-25 Infineon Technologies Ag Integrierte Schaltungsanordnung
WO2006022695A1 (en) 2004-08-09 2006-03-02 Oberthur Card Systems Sa Multi-layer cards with aesthetic features and related methods of manufacturing
US20090187507A1 (en) * 2006-12-20 2009-07-23 Brown Kerry D Secure financial transaction network
US7847380B2 (en) * 2007-09-20 2010-12-07 Samsung Electronics Co., Ltd. Tape substrate and semiconductor module for smart card, method of fabricating the same, and smart card
FR2963458B1 (fr) * 2010-07-28 2012-08-31 Oberthur Technologies Procede d'encartage d'un microcircuit dans un corps de carte pour former une carte a microcircuit resistant a la compression
USD758372S1 (en) * 2013-03-13 2016-06-07 Nagrastar Llc Smart card interface
USD729808S1 (en) * 2013-03-13 2015-05-19 Nagrastar Llc Smart card interface
US9888283B2 (en) 2013-03-13 2018-02-06 Nagrastar Llc Systems and methods for performing transport I/O
USD759022S1 (en) * 2013-03-13 2016-06-14 Nagrastar Llc Smart card interface
USD780763S1 (en) * 2015-03-20 2017-03-07 Nagrastar Llc Smart card interface
USD864968S1 (en) 2015-04-30 2019-10-29 Echostar Technologies L.L.C. Smart card interface
CN114330626B (zh) 2020-09-30 2025-06-27 上海伯乐电子有限公司 用于承载芯片模块的卡片基材及其智能卡

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2486685B1 (fr) * 1980-07-09 1985-10-31 Labo Electronique Physique Carte de paiement electronique et procede de realisation
US4409471A (en) * 1981-12-17 1983-10-11 Seiichiro Aigo Information card
DE3338597A1 (de) * 1983-10-24 1985-05-02 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben
JPS62218196A (ja) * 1986-03-20 1987-09-25 日立マクセル株式会社 Ｉｃカ−ド
DE3639630A1 (de) * 1986-11-20 1988-06-01 Gao Ges Automation Org Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben
US4921160A (en) * 1988-02-29 1990-05-01 American Telephone And Telegraph Company Personal data card and method of constructing the same
FR2629236B1 (fr) * 1988-03-22 1991-09-27 Schlumberger Ind Sa Procede de realisation d'une carte a memoire electronique et carte telle qu'obtenue par la mise en oeuvre dudit procede
FR2632100B1 (fr) * 1988-05-25 1992-02-21 Schlumberger Ind Sa Procede de realisation d'une carte a memoire electronique et cartes a memoire electronique obtenue par la mise en oeuvre dudit procede
FR2677785A1 (fr) * 1991-06-17 1992-12-18 Philips Composants Procede de fabrication d'une carte a microcircuit.
JP2611575B2 (ja) * 1991-07-10 1997-05-21 凸版印刷株式会社 Ｉｃカード、ｉｃカード用モジュールおよびｉｃカードの製造方法
JP3142398B2 (ja) * 1992-11-06 2001-03-07 三菱電機株式会社 携帯用半導体装置及びその製造方法
JPH06219087A (ja) * 1992-11-12 1994-08-09 Furukawa Electric Co Ltd:The Ｉｃ内蔵カード
DE4344297A1 (de) * 1993-12-23 1995-06-29 Giesecke & Devrient Gmbh Verfahren zur Herstellung von Ausweiskarten
DE4443767A1 (de) * 1994-12-08 1996-06-13 Giesecke & Devrient Gmbh Elektronisches Modul und Datenträger mit elektrischem Modul
DE19618101A1 (de) * 1996-05-06 1997-11-13 Siemens Ag Trägerelement mit wenigstens einem integrierten Schaltkreis sowie Verfahren zur Herstellung eines solchen Trägerelementes
US6223989B1 (en) * 1996-08-05 2001-05-01 Gemplus S.C.A. Method for making smart cards, and resulting cards
US5721451A (en) * 1996-12-02 1998-02-24 Motorola, Inc. Integrated circuit assembly adhesive and method thereof
US6084500A (en) * 1997-03-28 2000-07-04 Matsushita Electric Industrial Co., Ltd. Chip inductor and method for manufacturing the same
US6069027A (en) * 1997-05-21 2000-05-30 Lsi Logic Corporation Fixture for lid-attachment for encapsulated packages
US6025054A (en) * 1997-09-08 2000-02-15 Cardxx, Inc. Smart cards having glue-positioned electronic components
US6208019B1 (en) * 1998-03-13 2001-03-27 Kabushiki Kaisha Toshiba Ultra-thin card-type semiconductor device having an embredded semiconductor element in a space provided therein
FR2793331B1 (fr) * 1999-05-06 2001-08-10 Oberthur Card Systems Sas Procede de fabrication d'une carte a microcircuit

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI647621B (zh) * 2013-02-18 2019-01-11 納格維遜股份有限公司 用於智慧卡的塑膠層

Also Published As

Publication number Publication date
FR2793330A1 (fr) 2000-11-10
JP2000357220A (ja) 2000-12-26
EP1050845A1 (fr) 2000-11-08
EP1050845B1 (fr) 2012-10-03
FR2793330B1 (fr) 2001-08-10
JP4601024B2 (ja) 2010-12-22
US6513718B1 (en) 2003-02-04

Similar Documents

Publication Publication Date Title
TW518519B (en) Method of mounting a microcircuit in a cavity of a card forming a support and resulting card
RU2324976C2 (ru) Способ изготовления бесконтактной или контактной/бесконтактной гибридной карточки со встроенной интегральной схемой (ис) с повышенной степенью ровности
US8142249B2 (en) Manufacturing method of display device
CN108282570B (zh) 电子设备
CN109272868A (zh) 一种电子设备及其装配方法
TW201005886A (en) Electronic device and method of manufacturing the electronic device
EP0926538A2 (en) Liquid crystal display device, electronic equipment, and method for making liquid crystal display device
TWI717244B (zh) 顯示裝置
CN103777812A (zh) 液态光学透明粘合剂层叠过程控制
MY140213A (en) Adhesive sheet for producing semiconductor device, semiconductor device, and manufacturing method thereof
CN1298111A (zh) 光学互连设备及其制造方法
CN105915670A (zh) 单曲面盖板的加工方法、单曲面盖板和终端设备
US20170344797A1 (en) Method for packaging fingerprint sensing chip and fingerprint sensing module made using the same
KR20140053563A (ko) 적층 기재, 이를 이용한 기판의 제조 방법, 기판
CN101923414A (zh) 电子装置及其制造方法
TW406207B (en) A method to manufacture an anisotropic conductive film used in liquid crystal display means and a method to meanufacture a liquid crystal panel
CN101093263B (zh) 光波导及其制造方法以及光通信模块
CN116072006B (zh) 显示组件及显示装置
US7676918B2 (en) Method for forming a molded circuit board
CN110782788A (zh) 柔性显示面板及显示装置
ATE259980T1 (de) Verfahren zur herstellung einer ic-karte und eine solche hergestellte karte
KR20110040173A (ko) 스마트카드
KR960001811A (ko) 이방성 도전 접착제를 사용한 집적회로 실장 방법
CN109117695A (zh) 指纹模组及设有该指纹模组的电子设备
CN101115354A (zh) 模造电路板及其制造方法

Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees