FR2963458B1 - Procede d'encartage d'un microcircuit dans un corps de carte pour former une carte a microcircuit resistant a la compression - Google Patents

Procede d'encartage d'un microcircuit dans un corps de carte pour former une carte a microcircuit resistant a la compression

Info

Publication number
FR2963458B1
FR2963458B1 FR1056210A FR1056210A FR2963458B1 FR 2963458 B1 FR2963458 B1 FR 2963458B1 FR 1056210 A FR1056210 A FR 1056210A FR 1056210 A FR1056210 A FR 1056210A FR 2963458 B1 FR2963458 B1 FR 2963458B1
Authority
FR
France
Prior art keywords
microcircuit
card
forming
compression resistant
card body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR1056210A
Other languages
English (en)
Other versions
FR2963458A1 (fr
Inventor
Olivier Bosquet
Mourad Laknin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Idemia France SAS
Original Assignee
Oberthur Technologies SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oberthur Technologies SA filed Critical Oberthur Technologies SA
Priority to FR1056210A priority Critical patent/FR2963458B1/fr
Publication of FR2963458A1 publication Critical patent/FR2963458A1/fr
Application granted granted Critical
Publication of FR2963458B1 publication Critical patent/FR2963458B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743External electrical contacts
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745Mounting details of integrated circuit chips
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745Mounting details of integrated circuit chips
    • G06K19/07747Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
FR1056210A 2010-07-28 2010-07-28 Procede d'encartage d'un microcircuit dans un corps de carte pour former une carte a microcircuit resistant a la compression Expired - Fee Related FR2963458B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR1056210A FR2963458B1 (fr) 2010-07-28 2010-07-28 Procede d'encartage d'un microcircuit dans un corps de carte pour former une carte a microcircuit resistant a la compression

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1056210A FR2963458B1 (fr) 2010-07-28 2010-07-28 Procede d'encartage d'un microcircuit dans un corps de carte pour former une carte a microcircuit resistant a la compression

Publications (2)

Publication Number Publication Date
FR2963458A1 FR2963458A1 (fr) 2012-02-03
FR2963458B1 true FR2963458B1 (fr) 2012-08-31

Family

ID=43280782

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1056210A Expired - Fee Related FR2963458B1 (fr) 2010-07-28 2010-07-28 Procede d'encartage d'un microcircuit dans un corps de carte pour former une carte a microcircuit resistant a la compression

Country Status (1)

Country Link
FR (1) FR2963458B1 (fr)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2632100B1 (fr) * 1988-05-25 1992-02-21 Schlumberger Ind Sa Procede de realisation d'une carte a memoire electronique et cartes a memoire electronique obtenue par la mise en oeuvre dudit procede
FR2662000A1 (fr) * 1990-05-11 1991-11-15 Philips Composants Carte a microcircuit.
US6072698A (en) * 1995-09-27 2000-06-06 Siemens Aktiengesellschaft Chip module with heat insulation for incorporation into a chip card
CA2265845A1 (fr) * 1997-07-18 1999-01-28 Naoki Shimada Module a circuit integre, carte a circuit integre, resine d'etancheite pour module a circuit integre, et procede de fabrication d'un module a circuit integre
FR2793330B1 (fr) * 1999-05-06 2001-08-10 Oberthur Card Systems Sas Procede de montage d'un microcircuit dans une cavite d'une carte formant support et carte ainsi obtenue
US6717819B1 (en) * 1999-06-01 2004-04-06 Amerasia International Technology, Inc. Solderable flexible adhesive interposer as for an electronic package, and method for making same
DE102004039693B4 (de) * 2004-08-16 2009-06-10 Infineon Technologies Ag Vergussmasse, Chipmodul und Verfahren zur Herstellung eines Chipmoduls

Also Published As

Publication number Publication date
FR2963458A1 (fr) 2012-02-03

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Legal Events

Date Code Title Description
PLFP Fee payment

Year of fee payment: 7

PLFP Fee payment

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PLFP Fee payment

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PLFP Fee payment

Year of fee payment: 10

CA Change of address

Effective date: 20200908

CD Change of name or company name

Owner name: IDEMIA FRANCE, FR

Effective date: 20200908

ST Notification of lapse

Effective date: 20210305