FR2793330B1 - Procede de montage d'un microcircuit dans une cavite d'une carte formant support et carte ainsi obtenue - Google Patents

Procede de montage d'un microcircuit dans une cavite d'une carte formant support et carte ainsi obtenue

Info

Publication number
FR2793330B1
FR2793330B1 FR9905778A FR9905778A FR2793330B1 FR 2793330 B1 FR2793330 B1 FR 2793330B1 FR 9905778 A FR9905778 A FR 9905778A FR 9905778 A FR9905778 A FR 9905778A FR 2793330 B1 FR2793330 B1 FR 2793330B1
Authority
FR
France
Prior art keywords
card
microcircuit
cavity
mounting
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR9905778A
Other languages
English (en)
French (fr)
Other versions
FR2793330A1 (fr
Inventor
Francois Bouchez
Francois Launay
Pierre Loubly
Jacques Venambre
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Idemia France SAS
Original Assignee
Oberthur Card Systems SA France
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oberthur Card Systems SA France filed Critical Oberthur Card Systems SA France
Priority to FR9905778A priority Critical patent/FR2793330B1/fr
Priority to GBGB9914227.5A priority patent/GB9914227D0/en
Priority to EP00401128A priority patent/EP1050845B1/fr
Priority to US09/563,904 priority patent/US6513718B1/en
Priority to TW089108676A priority patent/TW518519B/zh
Priority to JP2000134351A priority patent/JP4601024B2/ja
Publication of FR2793330A1 publication Critical patent/FR2793330A1/fr
Application granted granted Critical
Publication of FR2793330B1 publication Critical patent/FR2793330B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
FR9905778A 1999-05-06 1999-05-06 Procede de montage d'un microcircuit dans une cavite d'une carte formant support et carte ainsi obtenue Expired - Lifetime FR2793330B1 (fr)

Priority Applications (6)

Application Number Priority Date Filing Date Title
FR9905778A FR2793330B1 (fr) 1999-05-06 1999-05-06 Procede de montage d'un microcircuit dans une cavite d'une carte formant support et carte ainsi obtenue
GBGB9914227.5A GB9914227D0 (en) 1999-05-06 1999-06-18 Joining method
EP00401128A EP1050845B1 (fr) 1999-05-06 2000-04-21 Procédé de montage d'un microcircuit dans une cavité d'une carte
US09/563,904 US6513718B1 (en) 1999-05-06 2000-05-04 Method for mounting a microcircuit in a cavity of a card forming a support and resulting card
TW089108676A TW518519B (en) 1999-05-06 2000-05-06 Method of mounting a microcircuit in a cavity of a card forming a support and resulting card
JP2000134351A JP4601024B2 (ja) 1999-05-06 2000-05-08 カードにおける支持部を形成する空胴にマイクロ回路を搭載し、結果としてカードを生じる方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9905778A FR2793330B1 (fr) 1999-05-06 1999-05-06 Procede de montage d'un microcircuit dans une cavite d'une carte formant support et carte ainsi obtenue

Publications (2)

Publication Number Publication Date
FR2793330A1 FR2793330A1 (fr) 2000-11-10
FR2793330B1 true FR2793330B1 (fr) 2001-08-10

Family

ID=9545292

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9905778A Expired - Lifetime FR2793330B1 (fr) 1999-05-06 1999-05-06 Procede de montage d'un microcircuit dans une cavite d'une carte formant support et carte ainsi obtenue

Country Status (5)

Country Link
US (1) US6513718B1 (enExample)
EP (1) EP1050845B1 (enExample)
JP (1) JP4601024B2 (enExample)
FR (1) FR2793330B1 (enExample)
TW (1) TW518519B (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2833801B1 (fr) * 2001-12-19 2005-07-01 Oberthur Card Syst Sa Procede de realisation d'une carte a microcircuit
FI20022094A0 (fi) * 2002-11-25 2002-11-25 Rafsec Oy Transponderi ja menetelmä sen valmistamiseksi
DE102004004289A1 (de) * 2004-01-28 2005-08-25 Infineon Technologies Ag Integrierte Schaltungsanordnung
CA2608458C (en) 2004-08-09 2013-03-19 Oberthur Card Systems Sa Multi-layer cards with aesthetic features and related methods of manufacturing
US20090164381A1 (en) * 2006-12-20 2009-06-25 Brown Kerry D Method of making secure payment cards
US7847380B2 (en) * 2007-09-20 2010-12-07 Samsung Electronics Co., Ltd. Tape substrate and semiconductor module for smart card, method of fabricating the same, and smart card
FR2963458B1 (fr) * 2010-07-28 2012-08-31 Oberthur Technologies Procede d'encartage d'un microcircuit dans un corps de carte pour former une carte a microcircuit resistant a la compression
EP2767935A1 (fr) * 2013-02-18 2014-08-20 NagraID S.A. Couche plastique pour carte électronique
USD729808S1 (en) * 2013-03-13 2015-05-19 Nagrastar Llc Smart card interface
US9888283B2 (en) 2013-03-13 2018-02-06 Nagrastar Llc Systems and methods for performing transport I/O
USD759022S1 (en) * 2013-03-13 2016-06-14 Nagrastar Llc Smart card interface
USD758372S1 (en) * 2013-03-13 2016-06-07 Nagrastar Llc Smart card interface
USD780763S1 (en) * 2015-03-20 2017-03-07 Nagrastar Llc Smart card interface
USD864968S1 (en) 2015-04-30 2019-10-29 Echostar Technologies L.L.C. Smart card interface
CN114330626B (zh) * 2020-09-30 2025-06-27 上海伯乐电子有限公司 用于承载芯片模块的卡片基材及其智能卡

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2486685B1 (fr) * 1980-07-09 1985-10-31 Labo Electronique Physique Carte de paiement electronique et procede de realisation
US4409471A (en) * 1981-12-17 1983-10-11 Seiichiro Aigo Information card
DE3338597A1 (de) * 1983-10-24 1985-05-02 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben
JPS62218196A (ja) * 1986-03-20 1987-09-25 日立マクセル株式会社 Ｉｃカ−ド
DE3639630A1 (de) * 1986-11-20 1988-06-01 Gao Ges Automation Org Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben
US4921160A (en) * 1988-02-29 1990-05-01 American Telephone And Telegraph Company Personal data card and method of constructing the same
FR2629236B1 (fr) * 1988-03-22 1991-09-27 Schlumberger Ind Sa Procede de realisation d'une carte a memoire electronique et carte telle qu'obtenue par la mise en oeuvre dudit procede
FR2632100B1 (fr) * 1988-05-25 1992-02-21 Schlumberger Ind Sa Procede de realisation d'une carte a memoire electronique et cartes a memoire electronique obtenue par la mise en oeuvre dudit procede
FR2677785A1 (fr) * 1991-06-17 1992-12-18 Philips Composants Procede de fabrication d'une carte a microcircuit.
JP2611575B2 (ja) * 1991-07-10 1997-05-21 凸版印刷株式会社 Ｉｃカード、ｉｃカード用モジュールおよびｉｃカードの製造方法
JP3142398B2 (ja) * 1992-11-06 2001-03-07 三菱電機株式会社 携帯用半導体装置及びその製造方法
JPH06219087A (ja) * 1992-11-12 1994-08-09 Furukawa Electric Co Ltd:The Ｉｃ内蔵カード
DE4344297A1 (de) * 1993-12-23 1995-06-29 Giesecke & Devrient Gmbh Verfahren zur Herstellung von Ausweiskarten
DE4443767A1 (de) * 1994-12-08 1996-06-13 Giesecke & Devrient Gmbh Elektronisches Modul und Datenträger mit elektrischem Modul
DE19618101A1 (de) * 1996-05-06 1997-11-13 Siemens Ag Trägerelement mit wenigstens einem integrierten Schaltkreis sowie Verfahren zur Herstellung eines solchen Trägerelementes
DE69612574T2 (de) * 1996-08-05 2001-10-18 Gemplus, Gemenos Verbesserung eines herstellungsverfahrens einer speicherkarte
US5721451A (en) * 1996-12-02 1998-02-24 Motorola, Inc. Integrated circuit assembly adhesive and method thereof
DE69832249T2 (de) * 1997-03-28 2006-05-24 Matsushita Electric Industrial Co., Ltd., Kadoma Chip-induktivität und sein herstellungsverfahren
US6069027A (en) * 1997-05-21 2000-05-30 Lsi Logic Corporation Fixture for lid-attachment for encapsulated packages
US6025054A (en) * 1997-09-08 2000-02-15 Cardxx, Inc. Smart cards having glue-positioned electronic components
EP0942392A3 (en) * 1998-03-13 2000-10-18 Kabushiki Kaisha Toshiba Chip card
FR2793331B1 (fr) * 1999-05-06 2001-08-10 Oberthur Card Systems Sas Procede de fabrication d'une carte a microcircuit

Also Published As

Publication number Publication date
EP1050845A1 (fr) 2000-11-08
TW518519B (en) 2003-01-21
FR2793330A1 (fr) 2000-11-10
EP1050845B1 (fr) 2012-10-03
JP4601024B2 (ja) 2010-12-22
JP2000357220A (ja) 2000-12-26
US6513718B1 (en) 2003-02-04

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