TW513617B - Lithographic projection apparatus and method of manufacturing a device using a lithographic projection apparatus - Google Patents
Lithographic projection apparatus and method of manufacturing a device using a lithographic projection apparatus Download PDFInfo
- Publication number
- TW513617B TW513617B TW089106410A TW89106410A TW513617B TW 513617 B TW513617 B TW 513617B TW 089106410 A TW089106410 A TW 089106410A TW 89106410 A TW89106410 A TW 89106410A TW 513617 B TW513617 B TW 513617B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- aligner
- wafer
- photomask
- processor
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70208—Multiple illumination paths, e.g. radiation distribution devices, microlens illumination systems, multiplexers or demultiplexers for single or multiple projection systems
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70275—Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70358—Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
- G03F7/70466—Multiple exposures, e.g. combination of fine and coarse exposures, double patterning or multiple exposures for printing a single feature
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
- G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP99201223 | 1999-04-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW513617B true TW513617B (en) | 2002-12-11 |
Family
ID=8240117
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW089106410A TW513617B (en) | 1999-04-21 | 2000-04-07 | Lithographic projection apparatus and method of manufacturing a device using a lithographic projection apparatus |
TW089106530A TW500980B (en) | 1999-04-21 | 2000-04-08 | Lithographic projection apparatus, integrated circuit device manufacturing method, integrated circuit device, and substrate preparing device |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW089106530A TW500980B (en) | 1999-04-21 | 2000-04-08 | Lithographic projection apparatus, integrated circuit device manufacturing method, integrated circuit device, and substrate preparing device |
Country Status (5)
Country | Link |
---|---|
US (2) | US6404483B1 (de) |
JP (2) | JP2000330294A (de) |
KR (2) | KR100588129B1 (de) |
DE (2) | DE60013687T2 (de) |
TW (2) | TW513617B (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8004649B2 (en) | 2003-06-19 | 2011-08-23 | Asml Holding N.V. | Immersion photolithography system and method using microchannel nozzles |
Families Citing this family (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2380602B (en) * | 2001-05-19 | 2005-03-02 | Wentworth Lab Ltd | Wafer alignment device |
US20030168174A1 (en) | 2002-03-08 | 2003-09-11 | Foree Michael Todd | Gas cushion susceptor system |
SG102718A1 (en) * | 2002-07-29 | 2004-03-26 | Asml Holding Nv | Lithography tool having a vacuum reticle library coupled to a vacuum chamber |
US6826451B2 (en) * | 2002-07-29 | 2004-11-30 | Asml Holding N.V. | Lithography tool having a vacuum reticle library coupled to a vacuum chamber |
JP3875158B2 (ja) * | 2002-08-09 | 2007-01-31 | 株式会社東芝 | 露光装置判定システム、露光装置判定方法、露光装置判定プログラム及び半導体装置の製造方法 |
SG115631A1 (en) * | 2003-03-11 | 2005-10-28 | Asml Netherlands Bv | Lithographic projection assembly, load lock and method for transferring objects |
SG115629A1 (en) | 2003-03-11 | 2005-10-28 | Asml Netherlands Bv | Method and apparatus for maintaining a machine part |
SG125948A1 (en) * | 2003-03-31 | 2006-10-30 | Asml Netherlands Bv | Supporting structure for use in a lithographic apparatus |
JP4236252B2 (ja) * | 2003-05-06 | 2009-03-11 | キヤノン株式会社 | ステージ装置及び露光装置 |
JP2005003799A (ja) * | 2003-06-10 | 2005-01-06 | Fuji Photo Film Co Ltd | 感光性板状部材吸着機構及び画像記録装置 |
US7245357B2 (en) * | 2003-12-15 | 2007-07-17 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP5167572B2 (ja) * | 2004-02-04 | 2013-03-21 | 株式会社ニコン | 露光装置、露光方法及びデバイス製造方法 |
KR101579361B1 (ko) * | 2004-02-04 | 2015-12-21 | 가부시키가이샤 니콘 | 노광 장치, 노광 방법 및 디바이스 제조 방법 |
WO2005096101A1 (ja) * | 2004-03-30 | 2005-10-13 | Pioneer Corporation | 露光装置 |
US8749762B2 (en) * | 2004-05-11 | 2014-06-10 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7349067B2 (en) * | 2004-06-21 | 2008-03-25 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
KR100596280B1 (ko) | 2004-12-22 | 2006-06-30 | 동부일렉트로닉스 주식회사 | 오버레이 측정의 프리얼라인먼트 간소화 장치 및 방법 |
JP2006178318A (ja) * | 2004-12-24 | 2006-07-06 | Nsk Ltd | 露光装置 |
US7456935B2 (en) * | 2005-04-05 | 2008-11-25 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method utilizing a positioning device for positioning an object table |
KR100696380B1 (ko) * | 2005-07-06 | 2007-03-19 | 삼성전자주식회사 | 엣지 노광 웨이퍼 방법 |
KR100689843B1 (ko) * | 2006-01-03 | 2007-03-08 | 삼성전자주식회사 | 웨이퍼 스테이지 및 이를 이용한 웨이퍼 안착방법 |
DE502006008851D1 (de) * | 2006-11-08 | 2011-03-17 | Integrated Dynamics Eng Gmbh | Kombiniertes Motion-Control-System |
US20080117402A1 (en) * | 2006-11-20 | 2008-05-22 | Asml Netherlands B.V. | Lithographic apparatus and method |
US11136667B2 (en) | 2007-01-08 | 2021-10-05 | Eastman Kodak Company | Deposition system and method using a delivery head separated from a substrate by gas pressure |
KR20120059630A (ko) * | 2007-06-21 | 2012-06-08 | 에이에스엠엘 네델란즈 비.브이. | 기판 테이블 상에 기판을 적재하는 방법, 디바이스 제조 방법, 컴퓨터 프로그램물, 데이터 캐리어 및 장치 |
US8446566B2 (en) | 2007-09-04 | 2013-05-21 | Asml Netherlands B.V. | Method of loading a substrate on a substrate table and lithographic apparatus and device manufacturing method |
US9013682B2 (en) * | 2007-06-21 | 2015-04-21 | Asml Netherlands B.V. | Clamping device and object loading method |
US20080316461A1 (en) * | 2007-06-21 | 2008-12-25 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US20090086187A1 (en) * | 2007-08-09 | 2009-04-02 | Asml Netherlands | Lithographic Apparatus and Device Manufacturing Method |
JP2010129929A (ja) * | 2008-11-28 | 2010-06-10 | Canon Inc | 基板保持装置、基板保持方法、露光装置およびデバイス製造方法 |
JP5743437B2 (ja) * | 2009-07-09 | 2015-07-01 | キヤノン株式会社 | 露光装置、露光方法、搬送方法及びデバイスの製造方法 |
KR101509809B1 (ko) * | 2009-12-01 | 2015-04-08 | 현대자동차주식회사 | 차량의 커튼에어백용 램프브라켓 |
NL2006565A (en) * | 2010-06-30 | 2012-01-02 | Asml Holding Nv | Reticle clamping system. |
US9120344B2 (en) * | 2011-08-09 | 2015-09-01 | Kateeva, Inc. | Apparatus and method for control of print gap |
US9891541B2 (en) * | 2012-05-17 | 2018-02-13 | Asml Netherlands B.V. | Thermal conditioning unit, lithographic apparatus and device manufacturing method |
CN103972135B (zh) * | 2013-01-25 | 2017-02-22 | 上海微电子装备有限公司 | 一种硅片精确定位传输装置及定位方法 |
CN112296997B (zh) * | 2019-07-31 | 2022-01-14 | 上海微电子装备(集团)股份有限公司 | 一种机械手交接工位标定方法、装置、设备及存储介质 |
WO2021070265A1 (ja) * | 2019-10-08 | 2021-04-15 | 株式会社日立ハイテク | 試料ステージ及び光学式検査装置 |
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US3603646A (en) * | 1970-01-26 | 1971-09-07 | Ibm | Semiconductor wafer air slide with controlled wafer motion |
US3865254A (en) * | 1973-05-21 | 1975-02-11 | Kasker Instr Inc | Prealignment system for an optical alignment and exposure instrument |
JPS59155129A (ja) * | 1983-02-23 | 1984-09-04 | Nec Home Electronics Ltd | 半導体ウエ−ハ露光方法 |
JPS60158626A (ja) * | 1984-01-30 | 1985-08-20 | Canon Inc | 半導体露光装置 |
US4655584A (en) | 1984-05-11 | 1987-04-07 | Nippon Kogaku K. K. | Substrate positioning apparatus |
NL8401710A (nl) * | 1984-05-29 | 1985-12-16 | Philips Nv | Inrichting voor het afbeelden van een maskerpatroon op een substraat. |
JP2919158B2 (ja) * | 1992-02-10 | 1999-07-12 | キヤノン株式会社 | 基板保持装置 |
US5953105A (en) * | 1995-05-30 | 1999-09-14 | U.S. Philips Corporation | Positioning device with a reference frame for a measuring system, and a lithographic device provided with such a positioning device |
JPH09218519A (ja) * | 1996-02-09 | 1997-08-19 | Nikon Corp | 露光装置の環境制御方法及び装置 |
WO1997033205A1 (en) | 1996-03-06 | 1997-09-12 | Philips Electronics N.V. | Differential interferometer system and lithographic step-and-scan apparatus provided with such a system |
JPH09280251A (ja) * | 1996-04-10 | 1997-10-28 | Nikon Corp | ステージ装置 |
JPH09320934A (ja) * | 1996-05-28 | 1997-12-12 | Nikon Corp | ステージ装置 |
JP3695000B2 (ja) * | 1996-08-08 | 2005-09-14 | 株式会社ニコン | 露光方法及び露光装置 |
JP3779393B2 (ja) * | 1996-09-06 | 2006-05-24 | 東京エレクトロン株式会社 | 処理システム |
DE69735016T2 (de) | 1996-12-24 | 2006-08-17 | Asml Netherlands B.V. | Lithographisches Gerät mit zwei Objekthaltern |
JP3626504B2 (ja) | 1997-03-10 | 2005-03-09 | アーエスエム リソグラフィ ベスローテン フェンノートシャップ | 2個の物品ホルダを有する位置決め装置 |
JP3260096B2 (ja) | 1997-03-19 | 2002-02-25 | 富士男 板垣 | 建築物の沈下修正用アンカーボルト装置 |
US6232615B1 (en) * | 1998-03-31 | 2001-05-15 | Asm Lithography B.V. | Lithographic projection apparatus with improved substrate holder |
US6161311A (en) * | 1998-07-10 | 2000-12-19 | Asm America, Inc. | System and method for reducing particles in epitaxial reactors |
-
2000
- 2000-04-07 TW TW089106410A patent/TW513617B/zh not_active IP Right Cessation
- 2000-04-08 TW TW089106530A patent/TW500980B/zh not_active IP Right Cessation
- 2000-04-10 DE DE60013687T patent/DE60013687T2/de not_active Expired - Fee Related
- 2000-04-14 DE DE60020638T patent/DE60020638T2/de not_active Expired - Fee Related
- 2000-04-19 JP JP2000117810A patent/JP2000330294A/ja active Pending
- 2000-04-19 US US09/552,671 patent/US6404483B1/en not_active Expired - Lifetime
- 2000-04-19 KR KR1020000020658A patent/KR100588129B1/ko not_active IP Right Cessation
- 2000-04-19 JP JP2000117317A patent/JP3840034B2/ja not_active Expired - Fee Related
- 2000-04-19 KR KR1020000020679A patent/KR100540364B1/ko not_active IP Right Cessation
- 2000-04-19 US US09/552,672 patent/US6721035B1/en not_active Expired - Lifetime
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8004649B2 (en) | 2003-06-19 | 2011-08-23 | Asml Holding N.V. | Immersion photolithography system and method using microchannel nozzles |
US8670105B2 (en) | 2003-06-19 | 2014-03-11 | Asml Holding N.V. | Immersion photolithography system and method using microchannel nozzles |
US8730450B2 (en) | 2003-06-19 | 2014-05-20 | Asml Holdings N.V. | Immersion photolithography system and method using microchannel nozzles |
US8817230B2 (en) | 2003-06-19 | 2014-08-26 | Asml Holding N.V. | Immersion photolithography system and method using microchannel nozzles |
US9709899B2 (en) | 2003-06-19 | 2017-07-18 | Asml Holding N.V. | Immersion photolithography system and method using microchannel nozzles |
US9715178B2 (en) | 2003-06-19 | 2017-07-25 | Asml Holding N.V. | Immersion photolithography system and method using microchannel nozzles |
Also Published As
Publication number | Publication date |
---|---|
KR20010014775A (ko) | 2001-02-26 |
JP2000330294A (ja) | 2000-11-30 |
DE60013687D1 (de) | 2004-10-21 |
KR20000077050A (ko) | 2000-12-26 |
JP3840034B2 (ja) | 2006-11-01 |
DE60020638D1 (de) | 2005-07-14 |
JP2000323406A (ja) | 2000-11-24 |
DE60020638T2 (de) | 2006-05-04 |
KR100588129B1 (ko) | 2006-06-09 |
TW500980B (en) | 2002-09-01 |
US6721035B1 (en) | 2004-04-13 |
US6404483B1 (en) | 2002-06-11 |
KR100540364B1 (ko) | 2006-01-10 |
DE60013687T2 (de) | 2005-09-29 |
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Legal Events
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GD4A | Issue of patent certificate for granted invention patent | ||
MM4A | Annulment or lapse of patent due to non-payment of fees |