TW501066B - Pattern defect detecting method - Google Patents

Pattern defect detecting method Download PDF

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Publication number
TW501066B
TW501066B TW089110780A TW89110780A TW501066B TW 501066 B TW501066 B TW 501066B TW 089110780 A TW089110780 A TW 089110780A TW 89110780 A TW89110780 A TW 89110780A TW 501066 B TW501066 B TW 501066B
Authority
TW
Taiwan
Prior art keywords
pattern
defect
regarded
area
detected
Prior art date
Application number
TW089110780A
Other languages
English (en)
Chinese (zh)
Inventor
Koichi Wakitani
Noriaki Yugawa
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Application granted granted Critical
Publication of TW501066B publication Critical patent/TW501066B/zh

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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/0006—Industrial image inspection using a design-rule based approach
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30141—Printed circuit board [PCB]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Image Processing (AREA)
  • Image Analysis (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)
TW089110780A 1999-06-02 2000-06-02 Pattern defect detecting method TW501066B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15453599A JP4017285B2 (ja) 1999-06-02 1999-06-02 パターン欠陥検出方法

Publications (1)

Publication Number Publication Date
TW501066B true TW501066B (en) 2002-09-01

Family

ID=15586390

Family Applications (1)

Application Number Title Priority Date Filing Date
TW089110780A TW501066B (en) 1999-06-02 2000-06-02 Pattern defect detecting method

Country Status (4)

Country Link
US (1) US6714671B1 (enExample)
JP (1) JP4017285B2 (enExample)
CN (1) CN1187808C (enExample)
TW (1) TW501066B (enExample)

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JP4546607B2 (ja) * 2000-04-18 2010-09-15 パナソニック株式会社 良品パターン登録方法及びパターン検査方法
US6920624B2 (en) * 2002-01-17 2005-07-19 Seagate Technology, Llc Methodology of creating an object database from a Gerber file
US9424634B2 (en) 2004-03-04 2016-08-23 Cybernet Systems Corporation Machine vision system for identifying and sorting projectiles and other objects
US20050226489A1 (en) 2004-03-04 2005-10-13 Glenn Beach Machine vision system for identifying and sorting projectiles and other objects
JP4176041B2 (ja) * 2004-04-14 2008-11-05 オリンパス株式会社 分類装置及び分類方法
US7253650B2 (en) * 2004-05-25 2007-08-07 International Business Machines Corporation Increase productivity at wafer test using probe retest data analysis
JP4885590B2 (ja) * 2006-03-30 2012-02-29 東レエンジニアリング株式会社 半導体ウエーハ検査方法およびその装置
JP5010207B2 (ja) * 2006-08-14 2012-08-29 株式会社日立ハイテクノロジーズ パターン検査装置及び半導体検査システム
US8038897B2 (en) * 2007-02-06 2011-10-18 Taiwan Semiconductor Manufacturing Company, Ltd. Method and system for wafer inspection
CN101477065B (zh) * 2009-01-08 2011-02-09 西安电子科技大学 基于缺陷边界值变化次数的ic缺陷分类方法
CN102142355B (zh) * 2010-02-02 2013-07-17 吕一云 物体制造缺陷的应用方法
CN102156136B (zh) * 2011-03-14 2015-12-02 浙江展邦电子科技有限公司 一种pcb底片检测方法
CN104425302B (zh) * 2013-09-04 2017-09-22 中芯国际集成电路制造(上海)有限公司 半导体器件的缺陷检测方法和装置
CN109065467B (zh) * 2018-08-31 2020-11-13 上海华力微电子有限公司 晶圆缺陷检测系统及检测方法和计算机存储介质
CN110490875B (zh) * 2019-10-16 2020-01-21 武汉精立电子技术有限公司 一种屏缺陷过滤方法、装置及存储介质
CN111353983B (zh) * 2020-02-28 2023-05-23 腾讯科技（深圳）有限公司 缺陷检测识别方法、装置、计算机可读介质及电子设备
CN113554631B (zh) * 2021-07-30 2024-02-20 西安电子科技大学 一种基于改进网络的芯片表面缺陷检测方法

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US4496971A (en) * 1981-07-22 1985-01-29 National Research Development Corporation Detection apparatus
JPS58217074A (ja) * 1982-05-14 1983-12-16 Hitachi Ltd 線の認識方式
DE3347645C1 (de) * 1983-12-30 1985-10-10 Dr.-Ing. Ludwig Pietzsch Gmbh & Co, 7505 Ettlingen Verfahren und Einrichtung zum opto-elektronischen Pruefen eines Flaechenmusters an einem Objekt
US4707734A (en) * 1985-06-17 1987-11-17 The Perkin-Elmer Corporation Coarse flaw detector for printed circuit board inspection
JPH0610815B2 (ja) * 1985-12-04 1994-02-09 株式会社日立製作所 配線パターンの検査方法およびその装置
US5046109A (en) * 1986-03-12 1991-09-03 Nikon Corporation Pattern inspection apparatus
JPH0623999B2 (ja) * 1986-07-28 1994-03-30 株式会社日立製作所 パタ−ン欠陥検出方法
DE3838032A1 (de) * 1987-11-09 1989-05-24 Hitachi Ltd Verfahren und einrichtung zur strukturpruefung
US5272763A (en) * 1990-03-02 1993-12-21 Matsushita Electric Industrial Co., Ltd. Apparatus for inspecting wiring pattern formed on a board
KR960002145B1 (ko) * 1991-07-30 1996-02-13 가부시기가이샤 히다찌세이사구쇼 박막트랜지스터 액정기판의 검사방법 및 그 장치
JPH0763691A (ja) * 1993-08-24 1995-03-10 Toshiba Corp パターン欠陥検査方法及びその装置
US5694481A (en) * 1995-04-12 1997-12-02 Semiconductor Insights Inc. Automated design analysis system for generating circuit schematics from high magnification images of an integrated circuit
JPH0933599A (ja) * 1995-05-15 1997-02-07 Hitachi Ltd パターン検査方法および検査装置
US5912984A (en) * 1996-12-19 1999-06-15 Cognex Corporation Method and apparatus for in-line solder paste inspection
JP4107739B2 (ja) * 1998-12-15 2008-06-25 富士通株式会社 プリント配線板の改造パターン接続認識方法
US6539106B1 (en) * 1999-01-08 2003-03-25 Applied Materials, Inc. Feature-based defect detection
US6427024B1 (en) * 1999-04-02 2002-07-30 Beltronics, Inc. Apparatus for and method of automatic optical inspection of electronic circuit boards, wafers and the like for defects, using skeletal reference inspection and separately programmable alignment tolerance and detection parameters

Also Published As

Publication number Publication date
CN1187808C (zh) 2005-02-02
US6714671B1 (en) 2004-03-30
CN1276577A (zh) 2000-12-13
JP4017285B2 (ja) 2007-12-05
JP2000348171A (ja) 2000-12-15

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MM4A Annulment or lapse of patent due to non-payment of fees