TW480204B - Apparatus for polishing a flat surface - Google Patents
Apparatus for polishing a flat surface Download PDFInfo
- Publication number
- TW480204B TW480204B TW089113343A TW89113343A TW480204B TW 480204 B TW480204 B TW 480204B TW 089113343 A TW089113343 A TW 089113343A TW 89113343 A TW89113343 A TW 89113343A TW 480204 B TW480204 B TW 480204B
- Authority
- TW
- Taiwan
- Prior art keywords
- polishing
- light
- fixed table
- wafer
- transmission window
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18991699A JP2001009699A (ja) | 1999-07-05 | 1999-07-05 | 平面研磨装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW480204B true TW480204B (en) | 2002-03-21 |
Family
ID=16249366
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW089113343A TW480204B (en) | 1999-07-05 | 2000-07-04 | Apparatus for polishing a flat surface |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2001009699A (ko) |
KR (1) | KR100351695B1 (ko) |
CN (1) | CN1279506A (ko) |
TW (1) | TW480204B (ko) |
Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6776692B1 (en) * | 1999-07-09 | 2004-08-17 | Applied Materials Inc. | Closed-loop control of wafer polishing in a chemical mechanical polishing system |
JP3506114B2 (ja) * | 2000-01-25 | 2004-03-15 | 株式会社ニコン | モニタ装置及びこのモニタ装置を具えた研磨装置及び研磨方法 |
US7160739B2 (en) | 2001-06-19 | 2007-01-09 | Applied Materials, Inc. | Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles |
JP2003001560A (ja) * | 2001-06-22 | 2003-01-08 | Semiconductor Leading Edge Technologies Inc | 基板研磨装置、基板研磨方法及び半導体装置 |
AU2003285800A1 (en) * | 2002-12-28 | 2004-07-22 | Skc Co., Ltd. | Polishing pad having multi-windows |
KR100653725B1 (ko) * | 2004-10-01 | 2006-12-04 | 주식회사 신안에스엔피 | 오엘이디용 아이티오 박막 연마장치 |
CN100395079C (zh) * | 2004-11-10 | 2008-06-18 | 中国科学院长春光学精密机械与物理研究所 | 一种数控抛光用非接触式喷液磨头 |
JP4654275B2 (ja) * | 2008-07-31 | 2011-03-16 | 信越半導体株式会社 | 両面研磨装置 |
CN102089121B (zh) | 2008-07-31 | 2015-04-08 | 信越半导体股份有限公司 | 芯片的研磨方法及双面研磨装置 |
JP4955624B2 (ja) * | 2008-07-31 | 2012-06-20 | 信越半導体株式会社 | 両面研磨装置 |
JP5028354B2 (ja) * | 2008-07-31 | 2012-09-19 | 信越半導体株式会社 | ウェーハの研磨方法 |
US20110281510A1 (en) * | 2010-05-12 | 2011-11-17 | Applied Materials, Inc. | Pad Window Insert |
US8298041B2 (en) | 2010-10-08 | 2012-10-30 | Taiwan Semiconductor Manufacturing Company, Ltd. | System and method for wafer back-grinding control |
JP5980476B2 (ja) * | 2010-12-27 | 2016-08-31 | 株式会社荏原製作所 | ポリッシング装置およびポリッシング方法 |
US8535115B2 (en) | 2011-01-28 | 2013-09-17 | Applied Materials, Inc. | Gathering spectra from multiple optical heads |
JP5375895B2 (ja) * | 2011-08-17 | 2013-12-25 | 旭硝子株式会社 | 研磨システム |
US10226853B2 (en) * | 2013-01-18 | 2019-03-12 | Applied Materials, Inc. | Methods and apparatus for conditioning of chemical mechanical polishing pads |
JP6027454B2 (ja) * | 2013-02-05 | 2016-11-16 | 株式会社荏原製作所 | 研磨装置 |
CN103471899B (zh) * | 2013-08-28 | 2016-01-20 | 西安隆基硅材料股份有限公司 | 硅片加工装置 |
JP2016007689A (ja) * | 2014-06-26 | 2016-01-18 | 株式会社ディスコ | ワイヤーソー装置 |
KR20190039171A (ko) | 2016-08-31 | 2019-04-10 | 어플라이드 머티어리얼스, 인코포레이티드 | 환형 플래튼 또는 연마 패드를 갖는 연마 시스템 |
CN107799433B (zh) * | 2016-09-07 | 2020-03-17 | 台湾积体电路制造股份有限公司 | 半导体制造装置及其研磨模块 |
JP6791553B2 (ja) * | 2016-11-24 | 2020-11-25 | 株式会社ディスコ | スピンドルユニット及び研削装置 |
JP6985107B2 (ja) * | 2017-11-06 | 2021-12-22 | 株式会社荏原製作所 | 研磨方法および研磨装置 |
CN108838870B (zh) * | 2018-06-05 | 2020-02-14 | 南通瑞森光学股份有限公司 | 一种半导体晶圆研磨设备 |
KR102580487B1 (ko) * | 2018-06-18 | 2023-09-21 | 주식회사 케이씨텍 | 패드 모니터링 장치 및 이를 포함하는 패드 모니터링 시스템, 패드 모니터링 방법 |
JP7117171B2 (ja) * | 2018-06-20 | 2022-08-12 | 株式会社荏原製作所 | 研磨装置、研磨方法、及び研磨制御プログラム |
CN109171960B (zh) * | 2018-07-25 | 2020-11-06 | 杭州三坛医疗科技有限公司 | 光束定位方法、导向通道定位方法和定位机构 |
US11328965B2 (en) * | 2018-07-31 | 2022-05-10 | Taiwan Semiconductor Manufacturing Co., Ltd. | Systems and methods for suction pad assemblies |
CN109397032A (zh) * | 2018-12-30 | 2019-03-01 | 苏州富强科技有限公司 | 一种3d曲面玻璃抛光机构 |
CN111668121B (zh) * | 2019-03-05 | 2022-05-27 | 台湾积体电路制造股份有限公司 | 晶圆接合结构及其形成方法 |
KR102339948B1 (ko) * | 2019-07-02 | 2021-12-17 | (주)미래컴퍼니 | 연마 시스템 및 연마 방법 |
CN112405305A (zh) * | 2020-11-20 | 2021-02-26 | 西安奕斯伟硅片技术有限公司 | 单面抛光装置及方法 |
JP2023030756A (ja) * | 2021-08-24 | 2023-03-08 | 株式会社荏原製作所 | 研磨装置 |
-
1999
- 1999-07-05 JP JP18991699A patent/JP2001009699A/ja active Pending
-
2000
- 2000-07-04 TW TW089113343A patent/TW480204B/zh not_active IP Right Cessation
- 2000-07-05 CN CN00109568A patent/CN1279506A/zh active Pending
- 2000-07-05 KR KR1020000038424A patent/KR100351695B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP2001009699A (ja) | 2001-01-16 |
KR20010015184A (ko) | 2001-02-26 |
KR100351695B1 (ko) | 2002-09-11 |
CN1279506A (zh) | 2001-01-10 |
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Legal Events
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GD4A | Issue of patent certificate for granted invention patent | ||
MM4A | Annulment or lapse of patent due to non-payment of fees |