JP5375895B2 - 研磨システム - Google Patents
研磨システム Download PDFInfo
- Publication number
- JP5375895B2 JP5375895B2 JP2011178443A JP2011178443A JP5375895B2 JP 5375895 B2 JP5375895 B2 JP 5375895B2 JP 2011178443 A JP2011178443 A JP 2011178443A JP 2011178443 A JP2011178443 A JP 2011178443A JP 5375895 B2 JP5375895 B2 JP 5375895B2
- Authority
- JP
- Japan
- Prior art keywords
- slurry
- polishing
- plate
- polishing pad
- glass substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
- B24B7/242—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass for plate glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/12—Devices for exhausting mist of oil or coolant; Devices for collecting or recovering materials resulting from grinding or polishing, e.g. of precious metals, precious stones, diamonds or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Liquid Crystal (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Description
Claims (7)
- 一辺の長さが1000mm以上の板状体を保持する板状体保持手段と、
前記板状体保持手段に保持された前記板状体に対向して設置された研磨パッドと、を有し、
前記研磨パッドには、前記板状体の対向面に形成され前記研磨パッドと前記板状体との当接部にスラリーを供給する複数のスラリー供給孔と、前記板状体の対向面の中央部のみに形成され前記当接部に供給された前記スラリーを吸引するスラリー吸引孔とが形成されており、
研磨剤として砥粒を含むスラリーを貯留するスラリータンクと、
前記スラリータンクから、前記スラリー供給孔を介して、前記研磨パッドと前記板状体との当接部に前記スラリーを供給するスラリー供給手段と、
前記スラリー吸引孔を介して、前記当接部に供給された前記スラリーを吸引し、該吸引したスラリーを前記スラリータンクに戻すスラリー回収手段と、
前記スラリー供給手段に設けられた前記スラリーの濃度を検出する濃度計と、
前記濃度計の検出結果に基づいて、前記スラリーの濃度が予め設定された下限値を下回った場合に、前記スラリータンクに研磨材及び所定の添加剤を加えるように制御するとともに、前記スラリーの濃度が予め設定された上限値を超えた場合に、前記濃度計の洗浄を行うように制御する制御部と、
を有することを特徴とする研磨システム。 - 前記所定の添加剤は、前記研磨材の凝集を防止する分散剤である請求項1に記載の研磨システム。
- 前記スラリー吸引孔が形成される前記研磨パッドの前記板状体の対向面の中央部とは、研磨パッドの中心からその径の25%以内の範囲である請求項1または2に記載の研磨システム。
- 前記濃度計の洗浄は、前記スラリーの濃度が予め設定された上限値を超えた場合に加えて、またはそれに代えて、30分〜40分毎に行う請求項1〜3のいずれか一項に記載の研磨システム。
- 請求項1〜4のいずれか一項に記載の研磨システムであって、
前記研磨パッドの前記板状体の対向面に、任意の方向に直線状に複数の溝が形成され、前記任意の方向に直交する方向の中央部に形成された溝の幅が前記任意の方向に直交する方向の中央部の外側に形成された溝の幅よりも広く形成された研磨システム。 - 請求項5に記載の研磨システムであって、さらに、前記研磨パッドを前記板状体保持手段に対して相対的に水平方向に揺動させる手段と、前記研磨パッドを自転及び公転させる手段を備え、
前記研磨パッドの前記板状体の対向面に形成された前記複数の溝は、前記揺動の方向に対して直交する方向に形成される研磨システム。 - 請求項5又は6に記載の研磨システムであって、前記中央部とは、前記研磨パッドの中心から前記研磨パッドの径の25%以内の範囲である研磨システム。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011178443A JP5375895B2 (ja) | 2011-08-17 | 2011-08-17 | 研磨システム |
TW101129094A TWI526276B (zh) | 2011-08-17 | 2012-08-10 | Plate body grinding device and grinding system |
KR1020120089847A KR20130020614A (ko) | 2011-08-17 | 2012-08-17 | 판상체 연마 장치 및 연마 시스템 |
CN201210295630.7A CN102950538B (zh) | 2011-08-17 | 2012-08-17 | 板状体研磨装置及研磨系统 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011178443A JP5375895B2 (ja) | 2011-08-17 | 2011-08-17 | 研磨システム |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013039639A JP2013039639A (ja) | 2013-02-28 |
JP5375895B2 true JP5375895B2 (ja) | 2013-12-25 |
Family
ID=47760233
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011178443A Expired - Fee Related JP5375895B2 (ja) | 2011-08-17 | 2011-08-17 | 研磨システム |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5375895B2 (ja) |
KR (1) | KR20130020614A (ja) |
CN (1) | CN102950538B (ja) |
TW (1) | TWI526276B (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014156114A1 (ja) * | 2013-03-25 | 2014-10-02 | Hoya株式会社 | 情報記録媒体用ガラス基板の製造方法 |
KR101971150B1 (ko) * | 2017-08-18 | 2019-04-22 | 에스케이실트론 주식회사 | 웨이퍼의 에지 연마부, 이를 포함하는 웨이퍼의 에지 연마 장치 및 방법 |
JP7003897B2 (ja) * | 2018-11-16 | 2022-02-04 | 株式会社Sumco | ウェーハの製造方法、ワイヤーソー用再利用スラリーの品質評価方法、及びワイヤーソー用使用済みスラリーの品質評価方法 |
JP7178662B2 (ja) * | 2019-04-10 | 2022-11-28 | パナソニックIpマネジメント株式会社 | 研磨装置および研磨方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06246623A (ja) * | 1993-02-26 | 1994-09-06 | Asahi Glass Co Ltd | 板状体の連続研磨方法及び装置 |
US5695392A (en) * | 1995-08-09 | 1997-12-09 | Speedfam Corporation | Polishing device with improved handling of fluid polishing media |
JPH1015823A (ja) * | 1996-07-04 | 1998-01-20 | Canon Inc | 化学機械研磨装置における研磨スラリー供給方法および装置 |
CN1080620C (zh) * | 1998-09-08 | 2002-03-13 | 台湾积体电路制造股份有限公司 | 化学机械研磨机台 |
JP2001009699A (ja) * | 1999-07-05 | 2001-01-16 | Nichiden Mach Ltd | 平面研磨装置 |
JP2002028853A (ja) * | 2000-07-14 | 2002-01-29 | Ebara Corp | 研磨装置 |
JP2003220553A (ja) * | 2002-01-28 | 2003-08-05 | Mitsubishi Materials Corp | 研磨ヘッド及び研磨方法 |
DE10220273A1 (de) * | 2002-05-07 | 2003-11-27 | Hydac Process Technology Gmbh | Verfahren zum Herstellen von konischen Filterelementen |
JP2004306210A (ja) * | 2003-04-08 | 2004-11-04 | Speedfam Co Ltd | ガラス研磨における排出水中の酸化セリウム系研磨剤と水を再利用するための処理方法とその処理装置 |
JP2007103602A (ja) * | 2005-10-03 | 2007-04-19 | Toshiba Corp | 研磨パッド及び研磨装置 |
TW200736001A (en) * | 2006-03-27 | 2007-10-01 | Toshiba Kk | Polishing pad, method of polishing and polishing apparatus |
JP5408789B2 (ja) * | 2009-03-06 | 2014-02-05 | エルジー・ケム・リミテッド | フロートガラス研磨システム |
-
2011
- 2011-08-17 JP JP2011178443A patent/JP5375895B2/ja not_active Expired - Fee Related
-
2012
- 2012-08-10 TW TW101129094A patent/TWI526276B/zh not_active IP Right Cessation
- 2012-08-17 KR KR1020120089847A patent/KR20130020614A/ko not_active Application Discontinuation
- 2012-08-17 CN CN201210295630.7A patent/CN102950538B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
TW201309417A (zh) | 2013-03-01 |
CN102950538B (zh) | 2015-07-29 |
TWI526276B (zh) | 2016-03-21 |
JP2013039639A (ja) | 2013-02-28 |
KR20130020614A (ko) | 2013-02-27 |
CN102950538A (zh) | 2013-03-06 |
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