TW473846B - Precleaning process for metal plug that minimizes damage to low-K dielectric - Google Patents

Precleaning process for metal plug that minimizes damage to low-K dielectric Download PDF

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Publication number
TW473846B
TW473846B TW089117952A TW89117952A TW473846B TW 473846 B TW473846 B TW 473846B TW 089117952 A TW089117952 A TW 089117952A TW 89117952 A TW89117952 A TW 89117952A TW 473846 B TW473846 B TW 473846B
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TW
Taiwan
Prior art keywords
patent application
dielectric
scope
item
gas mixture
Prior art date
Application number
TW089117952A
Other languages
English (en)
Chinese (zh)
Inventor
Barney M Cohen
Suraj Rengarajan
Kenny King-Tai Ngan
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Application granted granted Critical
Publication of TW473846B publication Critical patent/TW473846B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H10P70/23—Cleaning during device manufacture during, before or after processing of insulating materials
    • H10P70/234—Cleaning during device manufacture during, before or after processing of insulating materials the processing being the formation of vias or contact holes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/071—Manufacture or treatment of dielectric parts thereof
    • H10W20/081—Manufacture or treatment of dielectric parts thereof by forming openings in the dielectric parts

Landscapes

  • Drying Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW089117952A 1999-09-02 2000-09-01 Precleaning process for metal plug that minimizes damage to low-K dielectric TW473846B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/388,991 US6346489B1 (en) 1999-09-02 1999-09-02 Precleaning process for metal plug that minimizes damage to low-κ dielectric

Publications (1)

Publication Number Publication Date
TW473846B true TW473846B (en) 2002-01-21

Family

ID=23536398

Family Applications (1)

Application Number Title Priority Date Filing Date
TW089117952A TW473846B (en) 1999-09-02 2000-09-01 Precleaning process for metal plug that minimizes damage to low-K dielectric

Country Status (6)

Country Link
US (2) US6346489B1 (https=)
EP (1) EP1081750A3 (https=)
JP (1) JP4932075B2 (https=)
KR (1) KR20010050283A (https=)
SG (1) SG93261A1 (https=)
TW (1) TW473846B (https=)

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Also Published As

Publication number Publication date
US6589890B2 (en) 2003-07-08
JP4932075B2 (ja) 2012-05-16
SG93261A1 (en) 2002-12-17
US20020106908A1 (en) 2002-08-08
KR20010050283A (ko) 2001-06-15
US6346489B1 (en) 2002-02-12
JP2001203194A (ja) 2001-07-27
EP1081750A3 (en) 2003-02-05
EP1081750A2 (en) 2001-03-07

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