SG93261A1 - Precleaning process for metal plug that minimizes damage to low-k dielectric - Google Patents

Precleaning process for metal plug that minimizes damage to low-k dielectric

Info

Publication number
SG93261A1
SG93261A1 SG200004970A SG200004970A SG93261A1 SG 93261 A1 SG93261 A1 SG 93261A1 SG 200004970 A SG200004970 A SG 200004970A SG 200004970 A SG200004970 A SG 200004970A SG 93261 A1 SG93261 A1 SG 93261A1
Authority
SG
Singapore
Prior art keywords
dielectric
low
metal plug
minimizes damage
precleaning process
Prior art date
Application number
SG200004970A
Other languages
English (en)
Inventor
M Cohen Barney
Tengarajan Suraj
King-Tai Ngan Kenny
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of SG93261A1 publication Critical patent/SG93261A1/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H10P70/23—Cleaning during device manufacture during, before or after processing of insulating materials
    • H10P70/234—Cleaning during device manufacture during, before or after processing of insulating materials the processing being the formation of vias or contact holes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/071—Manufacture or treatment of dielectric parts thereof
    • H10W20/081—Manufacture or treatment of dielectric parts thereof by forming openings in the dielectric parts
SG200004970A 1999-09-02 2000-08-31 Precleaning process for metal plug that minimizes damage to low-k dielectric SG93261A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/388,991 US6346489B1 (en) 1999-09-02 1999-09-02 Precleaning process for metal plug that minimizes damage to low-κ dielectric

Publications (1)

Publication Number Publication Date
SG93261A1 true SG93261A1 (en) 2002-12-17

Family

ID=23536398

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200004970A SG93261A1 (en) 1999-09-02 2000-08-31 Precleaning process for metal plug that minimizes damage to low-k dielectric

Country Status (6)

Country Link
US (2) US6346489B1 (https=)
EP (1) EP1081750A3 (https=)
JP (1) JP4932075B2 (https=)
KR (1) KR20010050283A (https=)
SG (1) SG93261A1 (https=)
TW (1) TW473846B (https=)

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Also Published As

Publication number Publication date
US6589890B2 (en) 2003-07-08
TW473846B (en) 2002-01-21
JP4932075B2 (ja) 2012-05-16
US20020106908A1 (en) 2002-08-08
KR20010050283A (ko) 2001-06-15
US6346489B1 (en) 2002-02-12
JP2001203194A (ja) 2001-07-27
EP1081750A3 (en) 2003-02-05
EP1081750A2 (en) 2001-03-07

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