TW429592B - Manufacturing method for semiconductor device - Google Patents
Manufacturing method for semiconductor deviceInfo
- Publication number
- TW429592B TW429592B TW088104166A TW88104166A TW429592B TW 429592 B TW429592 B TW 429592B TW 088104166 A TW088104166 A TW 088104166A TW 88104166 A TW88104166 A TW 88104166A TW 429592 B TW429592 B TW 429592B
- Authority
- TW
- Taiwan
- Prior art keywords
- inspection
- inspected object
- manufacturing
- semiconductor device
- electronic characteristic
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 238000007689 inspection Methods 0.000 abstract 5
- 238000000034 method Methods 0.000 abstract 2
- 239000004020 conductor Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06744—Microprobes, i.e. having dimensions as IC details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP06978698A JP4006081B2 (ja) | 1998-03-19 | 1998-03-19 | 半導体装置の製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW429592B true TW429592B (en) | 2001-04-11 |
Family
ID=13412800
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW088104166A TW429592B (en) | 1998-03-19 | 1999-03-17 | Manufacturing method for semiconductor device |
Country Status (7)
Country | Link |
---|---|
US (2) | US6511857B1 (zh) |
JP (1) | JP4006081B2 (zh) |
KR (1) | KR100384287B1 (zh) |
CN (2) | CN1155070C (zh) |
MY (1) | MY122226A (zh) |
TW (1) | TW429592B (zh) |
WO (1) | WO1999048147A1 (zh) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6551857B2 (en) | 1997-04-04 | 2003-04-22 | Elm Technology Corporation | Three dimensional structure integrated circuits |
US5915167A (en) * | 1997-04-04 | 1999-06-22 | Elm Technology Corporation | Three dimensional structure memory |
JP2001091543A (ja) | 1999-09-27 | 2001-04-06 | Hitachi Ltd | 半導体検査装置 |
JP2002090390A (ja) | 2000-09-20 | 2002-03-27 | Hitachi Ltd | 半導体装置の検査装置及びそれを用いた半導体の製造方法 |
JP2002110751A (ja) * | 2000-10-03 | 2002-04-12 | Hitachi Ltd | 半導体集積回路装置の検査装置および製造方法 |
JP4041663B2 (ja) | 2001-09-12 | 2008-01-30 | 株式会社ルネサステクノロジ | 半導体装置及びその検査装置 |
KR100726059B1 (ko) * | 2002-01-23 | 2007-06-08 | 피닉스 프리시젼 테크날로지 코포레이션 | 플립칩 조인트 및 보드대면형 솔더 조인트를 위한유기회로보드 상의 전기도금 솔더 형성 |
EP1542010A4 (en) * | 2002-07-12 | 2007-11-21 | Mitsubishi Chem Corp | ANALYSIS CHIP, ANALYTICAL CHIP UNIT, ANALYSIS APPARATUS, ANALYSIS METHOD WITH THE APPARATUS AND METHOD FOR PRODUCING THE ANALYSIS CHIP |
US6912437B2 (en) * | 2002-09-30 | 2005-06-28 | Advanced Micro Devices, Inc. | Method and apparatus for controlling a fabrication process based on a measured electrical characteristic |
JP4465995B2 (ja) * | 2003-07-02 | 2010-05-26 | 株式会社日立製作所 | プローブシート、プローブカード、半導体検査装置および半導体装置の製造方法 |
JP2005136246A (ja) * | 2003-10-31 | 2005-05-26 | Renesas Technology Corp | 半導体集積回路装置の製造方法 |
JP5370323B2 (ja) * | 2010-09-22 | 2013-12-18 | 富士電機株式会社 | プローブユニット |
CN104049316B (zh) * | 2013-03-11 | 2017-06-16 | 赛恩倍吉科技顾问(深圳)有限公司 | 光通讯模组组装装置 |
CN109590940B (zh) * | 2017-09-30 | 2021-08-24 | 创新服务股份有限公司 | 精密组装机构 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5917707A (en) * | 1993-11-16 | 1999-06-29 | Formfactor, Inc. | Flexible contact structure with an electrically conductive shell |
JPH01147374A (ja) | 1987-12-04 | 1989-06-09 | Hitachi Ltd | マイクロプローバ |
US5408190A (en) * | 1991-06-04 | 1995-04-18 | Micron Technology, Inc. | Testing apparatus having substrate interconnect for discrete die burn-in for nonpackaged die |
US5679977A (en) * | 1990-09-24 | 1997-10-21 | Tessera, Inc. | Semiconductor chip assemblies, methods of making same and components for same |
JPH05211219A (ja) * | 1991-03-18 | 1993-08-20 | Matsushita Electron Corp | 半導体記憶装置のバーンイン方法 |
US5180977A (en) | 1991-12-02 | 1993-01-19 | Hoya Corporation Usa | Membrane probe contact bump compliancy system |
JPH06123746A (ja) | 1992-10-12 | 1994-05-06 | Tokyo Seimitsu Co Ltd | プローブカード |
JPH06213930A (ja) | 1993-01-19 | 1994-08-05 | Nippon Steel Corp | シリコンウェハを利用したプローブカード |
JPH06230030A (ja) | 1993-01-29 | 1994-08-19 | Nippon Steel Corp | シリコンウェハを利用したプローブカード |
JPH077052A (ja) | 1993-06-16 | 1995-01-10 | Seiko Epson Corp | 電気特性測定用プローブ |
US5986459A (en) * | 1994-03-18 | 1999-11-16 | Fujitsu Limited | Semiconductor device testing carrier and method of fixing semiconductor device to testing carrier |
JP3502874B2 (ja) * | 1994-06-03 | 2004-03-02 | 株式会社ルネサステクノロジ | 接続装置およびその製造方法 |
JPH08148533A (ja) | 1994-11-15 | 1996-06-07 | Nec Corp | 半導体ウェハの試験装置及び試験方法 |
JP2691875B2 (ja) * | 1995-02-14 | 1997-12-17 | 日本電子材料株式会社 | プローブカード及びそれに用いられるプローブの製造方法 |
JP3838381B2 (ja) | 1995-11-22 | 2006-10-25 | 株式会社アドバンテスト | プローブカード |
JPH09243663A (ja) | 1996-03-05 | 1997-09-19 | Fujikura Ltd | コンタクトプローブ |
JP3022312B2 (ja) * | 1996-04-15 | 2000-03-21 | 日本電気株式会社 | プローブカードの製造方法 |
US6072323A (en) * | 1997-03-03 | 2000-06-06 | Micron Technology, Inc. | Temporary package, and method system for testing semiconductor dice having backside electrodes |
US5931685A (en) * | 1997-06-02 | 1999-08-03 | Micron Technology, Inc. | Interconnect for making temporary electrical connections with bumped semiconductor components |
US6245444B1 (en) * | 1997-10-02 | 2001-06-12 | New Jersey Institute Of Technology | Micromachined element and method of fabrication thereof |
US6380755B1 (en) * | 1998-09-14 | 2002-04-30 | Tokyo Electron Limited | Testing apparatus for test piece testing method contactor and method of manufacturing the same |
-
1998
- 1998-03-19 JP JP06978698A patent/JP4006081B2/ja not_active Expired - Fee Related
-
1999
- 1999-03-17 TW TW088104166A patent/TW429592B/zh not_active IP Right Cessation
- 1999-03-18 KR KR10-2000-7010326A patent/KR100384287B1/ko not_active IP Right Cessation
- 1999-03-18 WO PCT/JP1999/001366 patent/WO1999048147A1/ja active IP Right Grant
- 1999-03-18 CN CNB998042013A patent/CN1155070C/zh not_active Expired - Fee Related
- 1999-03-18 CN CNB2004100420108A patent/CN1299344C/zh not_active Expired - Fee Related
- 1999-03-18 US US09/646,511 patent/US6511857B1/en not_active Expired - Lifetime
- 1999-03-18 MY MYPI99001011A patent/MY122226A/en unknown
-
2002
- 2002-12-23 US US10/326,663 patent/US7119362B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
MY122226A (en) | 2006-03-31 |
US7119362B2 (en) | 2006-10-10 |
JPH11274251A (ja) | 1999-10-08 |
KR100384287B1 (ko) | 2003-05-16 |
US6511857B1 (en) | 2003-01-28 |
KR20010041998A (ko) | 2001-05-25 |
US20030092206A1 (en) | 2003-05-15 |
JP4006081B2 (ja) | 2007-11-14 |
CN1299344C (zh) | 2007-02-07 |
WO1999048147A1 (fr) | 1999-09-23 |
CN1538515A (zh) | 2004-10-20 |
CN1293824A (zh) | 2001-05-02 |
CN1155070C (zh) | 2004-06-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GD4A | Issue of patent certificate for granted invention patent | ||
MM4A | Annulment or lapse of patent due to non-payment of fees |