TW392073B - Probe assembly and probe - Google Patents

Probe assembly and probe Download PDF

Info

Publication number
TW392073B
TW392073B TW087105403A TW87105403A TW392073B TW 392073 B TW392073 B TW 392073B TW 087105403 A TW087105403 A TW 087105403A TW 87105403 A TW87105403 A TW 87105403A TW 392073 B TW392073 B TW 392073B
Authority
TW
Taiwan
Prior art keywords
probe
leader
needle
block
guide
Prior art date
Application number
TW087105403A
Other languages
English (en)
Chinese (zh)
Inventor
Satoshi Narita
Tomoaki Kuga
Original Assignee
Micronics Japan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=17889693&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TW392073(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Micronics Japan Co Ltd filed Critical Micronics Japan Co Ltd
Application granted granted Critical
Publication of TW392073B publication Critical patent/TW392073B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06794—Devices for sensing when probes are in contact, or in position to contact, with measured object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Liquid Crystal (AREA)
TW087105403A 1996-10-28 1998-04-10 Probe assembly and probe TW392073B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30083596A JP3750831B2 (ja) 1996-10-28 1996-10-28 プローブ組立体

Publications (1)

Publication Number Publication Date
TW392073B true TW392073B (en) 2000-06-01

Family

ID=17889693

Family Applications (1)

Application Number Title Priority Date Filing Date
TW087105403A TW392073B (en) 1996-10-28 1998-04-10 Probe assembly and probe

Country Status (3)

Country Link
JP (1) JP3750831B2 (ko)
KR (1) KR100252566B1 (ko)
TW (1) TW392073B (ko)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001050858A (ja) * 1999-08-04 2001-02-23 Micronics Japan Co Ltd 表示用パネル基板の検査装置
JP4634059B2 (ja) * 2004-03-26 2011-02-16 株式会社日本マイクロニクス プローブ組立体
JP4571517B2 (ja) * 2004-10-19 2010-10-27 株式会社日本マイクロニクス プローブ組立体
KR100669827B1 (ko) * 2005-08-10 2007-01-16 주식회사 파이컴 프로브 어셈블리
KR100610889B1 (ko) 2005-10-10 2006-08-08 (주)엠씨티코리아 초미세 피치를 갖는 평판형 디스플레이장치 검사용프로브유니트
WO2007102401A1 (ja) 2006-03-03 2007-09-13 Nhk Spring Co., Ltd. 導電性接触子ユニット
US7955122B2 (en) 2006-03-03 2011-06-07 Nhk Spring Co., Ltd. Conductive contact unit
KR100692179B1 (ko) * 2006-05-01 2007-03-12 주식회사 코디에스 평판디스플레이 검사를 위한 프로브 조립체
JP4916763B2 (ja) 2006-05-08 2012-04-18 株式会社日本マイクロニクス プローブ組立体
JP4916766B2 (ja) * 2006-05-11 2012-04-18 株式会社日本マイクロニクス プローブおよびプローブ組立体
KR100715492B1 (ko) * 2006-06-05 2007-05-07 (주)엠씨티코리아 극미세 피치를 갖는 프로브유니트 및 이를 이용한프로브장치
KR100696416B1 (ko) * 2006-11-20 2007-03-19 주식회사 리뷰텍 평판표시소자 검사용 프로브 조립체
JP2008256410A (ja) 2007-04-02 2008-10-23 Micronics Japan Co Ltd プローブ組立体
JP4909803B2 (ja) * 2007-05-16 2012-04-04 株式会社日本マイクロニクス プローブ組立体及び検査装置
JP5364877B2 (ja) * 2009-04-28 2013-12-11 有限会社清田製作所 積層型プローブ
JP2011203275A (ja) * 2011-07-05 2011-10-13 Micronics Japan Co Ltd プローブおよびプローブ組立体
JP7154835B2 (ja) * 2018-06-22 2022-10-18 株式会社日本マイクロニクス プローブ組立体
KR102241059B1 (ko) * 2020-01-14 2021-04-16 (주)위드멤스 프로브 블록 조립체

Also Published As

Publication number Publication date
JPH10132853A (ja) 1998-05-22
JP3750831B2 (ja) 2006-03-01
KR100252566B1 (ko) 2000-04-15
KR19980032242A (ko) 1998-07-25

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Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MK4A Expiration of patent term of an invention patent