TW376560B - System, methods and apparatus for storing information during a semiconductor manufacturing process - Google Patents

System, methods and apparatus for storing information during a semiconductor manufacturing process

Info

Publication number
TW376560B
TW376560B TW086115530A TW86115530A TW376560B TW 376560 B TW376560 B TW 376560B TW 086115530 A TW086115530 A TW 086115530A TW 86115530 A TW86115530 A TW 86115530A TW 376560 B TW376560 B TW 376560B
Authority
TW
Taiwan
Prior art keywords
manufacturing process
semiconductor manufacturing
carrier
methods
storing information
Prior art date
Application number
TW086115530A
Other languages
English (en)
Inventor
Daniel J Fraiedman
Original Assignee
Schlumberger Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schlumberger Technologies Inc filed Critical Schlumberger Technologies Inc
Application granted granted Critical
Publication of TW376560B publication Critical patent/TW376560B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67282—Marking devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67326—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333—Trays for chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68313—Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/907—Continuous processing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/914—Doping
    • Y10S438/925—Fluid growth doping control, e.g. delta doping

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • General Factory Administration (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Packaging Frangible Articles (AREA)
TW086115530A 1996-11-25 1997-10-21 System, methods and apparatus for storing information during a semiconductor manufacturing process TW376560B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/756,296 US6078845A (en) 1996-11-25 1996-11-25 Apparatus for carrying semiconductor devices

Publications (1)

Publication Number Publication Date
TW376560B true TW376560B (en) 1999-12-11

Family

ID=25042858

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086115530A TW376560B (en) 1996-11-25 1997-10-21 System, methods and apparatus for storing information during a semiconductor manufacturing process

Country Status (5)

Country Link
US (1) US6078845A (zh)
EP (1) EP0844645A1 (zh)
JP (1) JPH10199777A (zh)
KR (1) KR19980042525A (zh)
TW (1) TW376560B (zh)

Families Citing this family (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4365914B2 (ja) * 1998-11-25 2009-11-18 キヤノン株式会社 半導体製造装置およびデバイス製造方法
US6644982B1 (en) * 1998-12-04 2003-11-11 Formfactor, Inc. Method and apparatus for the transport and tracking of an electronic component
US6718629B1 (en) * 1999-04-30 2004-04-13 Siemens Aktiengesellschaft Method and apparatus for mounting components onto a substrate of an electrical assembly
JP2000331962A (ja) * 1999-05-18 2000-11-30 Lintec Corp 半導体ウエハの加工方法および半導体ウエハ支持部材
US6368901B2 (en) * 1999-07-15 2002-04-09 Texas Instruments Incorporated Integrated circuit wireless tagging
DE19934114A1 (de) * 1999-07-21 2001-01-25 Bosch Gmbh Robert Substrat und Werkstückträger zur Aufnahme des Substrates
JP2001155980A (ja) * 1999-11-25 2001-06-08 Nec Corp 検査補修システム、製品製造システム、部材検査装置、データ処理装置、部材補修装置、情報記憶媒体
US6640151B1 (en) * 1999-12-22 2003-10-28 Applied Materials, Inc. Multi-tool control system, method and medium
GB0004455D0 (en) * 2000-02-26 2000-04-19 Glaxo Group Ltd Manufacturing method
GB0004456D0 (en) * 2000-02-26 2000-04-19 Glaxo Group Ltd Medicament dispenser
ATE390655T1 (de) * 2000-04-20 2008-04-15 Cogiscan Inc Automatisches herstellungssteuerungssystem
GB0012465D0 (en) * 2000-05-24 2000-07-12 Glaxo Group Ltd Monitoring method
GB0013619D0 (en) * 2000-06-06 2000-07-26 Glaxo Group Ltd Sample container
CN1443081A (zh) * 2000-07-15 2003-09-17 葛兰素集团有限公司 药剂配送器
US6708074B1 (en) 2000-08-11 2004-03-16 Applied Materials, Inc. Generic interface builder
EP1184805A1 (en) * 2000-08-29 2002-03-06 Motorola, Inc. Electronic device for a wafer container, wafer manufacturing system, and method
EP1187065A3 (de) * 2000-09-05 2002-07-31 ACG Aktiengesellschaft für Chipkarten und Informationssysteme Verfahren zur Serienherstellung von Chips, insbesondere für SIM-Karten
US6795743B1 (en) * 2000-09-18 2004-09-21 Dell Products L.P. Apparatus and method for electronically encoding an article with work-in-progress information
DE10047060B4 (de) * 2000-09-22 2011-02-24 Schneider Automation Gmbh Produktionssystem sowie Verfahren zur Konfiguration eines solchen
US6441606B1 (en) 2000-10-17 2002-08-27 Micron Technology, Inc. Dual zone wafer test apparatus
US7188142B2 (en) 2000-11-30 2007-03-06 Applied Materials, Inc. Dynamic subject information generation in message services of distributed object systems in a semiconductor assembly line facility
US20020066693A1 (en) * 2000-12-01 2002-06-06 Jones Zhu Coded tray for holding packaged semiconductor devices
US20020082746A1 (en) * 2000-12-27 2002-06-27 Honeywell International Inc. Replaceable media with programmable device
JP2002231594A (ja) * 2001-01-31 2002-08-16 Mitsubishi Electric Corp 半導体装置の生産管理システム、半導体装置の生産管理方法、および半導体装置の製造方法
US7160739B2 (en) 2001-06-19 2007-01-09 Applied Materials, Inc. Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles
US7698012B2 (en) * 2001-06-19 2010-04-13 Applied Materials, Inc. Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing
US7101799B2 (en) * 2001-06-19 2006-09-05 Applied Materials, Inc. Feedforward and feedback control for conditioning of chemical mechanical polishing pad
US6722033B2 (en) 2001-10-08 2004-04-20 Newport Corporation Pallet assembly for assembling a fiber optic module that includes a housing
US20030199112A1 (en) 2002-03-22 2003-10-23 Applied Materials, Inc. Copper wiring module control
EP2790210A3 (en) 2002-06-19 2014-12-31 Murata Machinery, Ltd. Automated material handling system
US20040063224A1 (en) * 2002-09-18 2004-04-01 Applied Materials, Inc. Feedback control of a chemical mechanical polishing process for multi-layered films
US20070092359A1 (en) * 2002-10-11 2007-04-26 Brooks Automation, Inc. Access to one or more levels of material storage shelves by an overhead hoist transport vehicle from a single track position
KR101475662B1 (ko) * 2002-10-11 2014-12-24 무라다기카이가부시끼가이샤 오버헤드 호이스트를 탑재한 오버헤드 호이스트 수송 차량
AU2003290932A1 (en) 2002-11-15 2004-06-15 Applied Materials, Inc. Method, system and medium for controlling manufacture process having multivariate input parameters
CN1319003C (zh) * 2003-08-05 2007-05-30 旺宏电子股份有限公司 多批晶圆修改属性编号的方法
US6993405B2 (en) * 2003-11-05 2006-01-31 International Business Machines Corporation Manufacturing product carrier environment and event monitoring system
US7101138B2 (en) * 2003-12-03 2006-09-05 Brooks Automation, Inc. Extractor/buffer
US20050283266A1 (en) * 2004-06-17 2005-12-22 Geraci Gwen R Method and system for providing unit level traceability of semiconductor die
MY137694A (en) * 2004-07-06 2009-02-27 Dainichi Can Co Ltd Marking clip for ic tray
US8231098B2 (en) 2004-12-07 2012-07-31 Newport Corporation Methods and devices for active vibration damping of an optical structure
US20070289896A1 (en) * 2006-06-19 2007-12-20 International Business Machines Corporation Method for packaging contamination vulnerable articles and package therefore
US20080109098A1 (en) * 2006-11-08 2008-05-08 Honeywell International Inc. Apparatus and method for integrating people and asset tracking information into a process control system
US9146274B2 (en) * 2007-08-24 2015-09-29 Advantest Corporation Wafer boat for semiconductor testing
EP2051189A1 (en) * 2007-10-18 2009-04-22 Siemens Aktiengesellschaft Device for electronic identification of items
DE102007062376A1 (de) * 2007-12-22 2009-06-25 Dietz-Automotive Gmbh & Co. Kg Verfahren zur Montage einer Baugruppe
JP2011098808A (ja) * 2009-11-05 2011-05-19 Nikon Corp 基板カートリッジ、基板処理装置、基板処理システム、基板処理方法、制御装置及び表示素子の製造方法
US9678501B2 (en) * 2013-01-08 2017-06-13 Bloom Energy Corporation Serialization of fuel cell components
US9508653B2 (en) * 2013-09-18 2016-11-29 Taiwan Semiconductor Manufacturing Company, Ltd. Die-tracing in integrated circuit manufacturing and packaging
US9305816B2 (en) 2013-12-28 2016-04-05 Intel Corporation Methods and devices for securing and transporting singulated die in high volume manufacturing
US10163675B2 (en) 2016-06-24 2018-12-25 Invensas Corporation Method and apparatus for stacking devices in an integrated circuit assembly
US10822181B2 (en) * 2018-10-30 2020-11-03 Taiwan Semiconductor Manufacturing Co., Ltd. Systems and methods for die transfer
WO2022036185A1 (en) * 2020-08-13 2022-02-17 Accu-Assembly Incorporated Reel labeling

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5988845A (ja) * 1982-11-12 1984-05-22 Toshiba Corp 半導体収納容器
US5166884A (en) * 1984-12-24 1992-11-24 Asyst Technologies, Inc. Intelligent system for processing and storing articles
JPS61236136A (ja) * 1985-04-12 1986-10-21 Hitachi Ltd ウエハカセツト治具
JPS61267338A (ja) * 1985-05-22 1986-11-26 Toshiba Corp 半導体ウエハ用カセツト
JPS62169409A (ja) * 1986-01-22 1987-07-25 Hitachi Ltd 最適作業条件探索用ウエハ管理装置
JPS63250114A (ja) * 1987-04-07 1988-10-18 Nec Corp 樹脂製キヤリア
US4827110A (en) * 1987-06-11 1989-05-02 Fluoroware, Inc. Method and apparatus for monitoring the location of wafer disks
US5305221A (en) * 1990-05-04 1994-04-19 Atherton Robert W Real world modeling and control process for integrated manufacturing equipment
KR920001028A (ko) * 1990-06-22 1992-01-29 백팔식 부직포를 이용한 의류 얼룩방지 및 섬유린스제의 일회용 티슈 제조방법
US5668056A (en) * 1990-12-17 1997-09-16 United Microelectronics Corporation Single semiconductor wafer transfer method and manufacturing system
US5256204A (en) * 1991-12-13 1993-10-26 United Microelectronics Corporation Single semiconductor water transfer method and manufacturing system
JP3659981B2 (ja) * 1992-07-09 2005-06-15 アドバンスト・マイクロ・ディバイシズ・インコーポレイテッド ダイ特定情報に特徴付けられるダイ上の集積回路を含む装置
JPH07245332A (ja) * 1994-03-04 1995-09-19 Hitachi Ltd 半導体製造装置および半導体装置の製造方法ならびに半導体装置
US5625816A (en) * 1994-04-05 1997-04-29 Advanced Micro Devices, Inc. Method and system for generating product performance history

Also Published As

Publication number Publication date
JPH10199777A (ja) 1998-07-31
US6078845A (en) 2000-06-20
KR19980042525A (ko) 1998-08-17
EP0844645A1 (en) 1998-05-27

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees