TW368749B - Semiconductor memory device and driving method thereof - Google Patents

Semiconductor memory device and driving method thereof

Info

Publication number
TW368749B
TW368749B TW085111010A TW85111010A TW368749B TW 368749 B TW368749 B TW 368749B TW 085111010 A TW085111010 A TW 085111010A TW 85111010 A TW85111010 A TW 85111010A TW 368749 B TW368749 B TW 368749B
Authority
TW
Taiwan
Prior art keywords
insulation film
gates
floating gates
electrons
writing
Prior art date
Application number
TW085111010A
Other languages
English (en)
Inventor
Takahiro Fukumoto
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Application granted granted Critical
Publication of TW368749B publication Critical patent/TW368749B/zh

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/788Field effect transistors with field effect produced by an insulated gate with floating gate
    • H01L29/7881Programmable transistors with only two possible levels of programmation
    • H01L29/7883Programmable transistors with only two possible levels of programmation charging by tunnelling of carriers, e.g. Fowler-Nordheim tunnelling
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C16/00Erasable programmable read-only memories
    • G11C16/02Erasable programmable read-only memories electrically programmable
    • G11C16/04Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
    • G11C16/0408Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors
    • G11C16/0425Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors comprising cells containing a merged floating gate and select transistor
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C16/00Erasable programmable read-only memories
    • G11C16/02Erasable programmable read-only memories electrically programmable
    • G11C16/04Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
    • G11C16/0408Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors
    • G11C16/0433Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors comprising cells containing a single floating gate transistor and one or more separate select transistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40Electrodes ; Multistep manufacturing processes therefor
    • H01L29/41Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
    • H01L29/423Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
    • H01L29/42312Gate electrodes for field effect devices
    • H01L29/42316Gate electrodes for field effect devices for field-effect transistors
    • H01L29/4232Gate electrodes for field effect devices for field-effect transistors with insulated gate
    • H01L29/42324Gate electrodes for transistors with a floating gate
    • H01L29/42328Gate electrodes for transistors with a floating gate with at least one additional gate other than the floating gate and the control gate, e.g. program gate, erase gate or select gate
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B69/00Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Non-Volatile Memory (AREA)
  • Semiconductor Memories (AREA)
TW085111010A 1995-09-11 1996-09-09 Semiconductor memory device and driving method thereof TW368749B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23295195 1995-09-11

Publications (1)

Publication Number Publication Date
TW368749B true TW368749B (en) 1999-09-01

Family

ID=16947424

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085111010A TW368749B (en) 1995-09-11 1996-09-09 Semiconductor memory device and driving method thereof

Country Status (6)

Country Link
US (1) US5753953A (zh)
EP (2) EP0763856B1 (zh)
KR (1) KR100413652B1 (zh)
DE (2) DE69618302T2 (zh)
SG (1) SG44973A1 (zh)
TW (1) TW368749B (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202010001832U1 (de) 2009-12-31 2010-07-08 UNISTAR OPTO CORPORATION, Neihu Röhrenlose, Leuchtdioden-basierte Beleuchtungsvorrichtung
DE202010011792U1 (de) 2010-08-25 2011-02-24 AzureLighting Technologies, Inc., Xindian Schutzschaltkreis einer T8 LED-Beleuchtungsröhre

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JP2882392B2 (ja) * 1996-12-25 1999-04-12 日本電気株式会社 不揮発性半導体記憶装置およびその製造方法
US6835979B1 (en) 1997-04-11 2004-12-28 Altera Corporation Nonvolatle memory
US6027974A (en) * 1997-04-11 2000-02-22 Programmable Silicon Solutions Nonvolatile memory
US6159800A (en) * 1997-04-11 2000-12-12 Programmable Silicon Solutions Method of forming a memory cell
JP3378879B2 (ja) 1997-12-10 2003-02-17 松下電器産業株式会社 不揮発性半導体記憶装置及びその駆動方法
EP0926260A3 (en) 1997-12-12 2001-04-11 Matsushita Electric Industrial Co., Ltd. Using antibody - antigen interaction for formation of a patterened metal film
KR100289813B1 (ko) * 1998-07-03 2001-10-26 윤종용 노아형플렛-셀마스크롬장치
US6005807A (en) * 1998-09-16 1999-12-21 Winbond Electronics Corp. Method and apparatus for self-aligned memory cells and array using source side injection
JP3344331B2 (ja) * 1998-09-30 2002-11-11 日本電気株式会社 不揮発性半導体記憶装置
TW444402B (en) 1999-03-11 2001-07-01 Mosel Vitelic Inc Flash memory cell and its manufacturing method
JP5014543B2 (ja) * 1999-07-29 2012-08-29 エヌエックスピー ビー ヴィ 半導体装置
TW492189B (en) * 2001-06-15 2002-06-21 Mosel Vitelic Inc EEPROM device and the erasing method thereof
FR2826496A1 (fr) 2001-06-25 2002-12-27 St Microelectronics Sa Memoire eeprom protegee contre les effets d'un claquage de transistor d'acces
DE10201304A1 (de) * 2002-01-15 2003-07-31 Infineon Technologies Ag Nichtflüchtige Halbleiter -Speicherzelle sowie zugehöriges Herstellungsverfahren
EP1424700B1 (en) * 2002-11-28 2005-08-03 STMicroelectronics S.r.l. Single cell erasing method for recovering cells under programming disturbs in non volatile semiconductor memory devices
US6819594B2 (en) * 2003-01-06 2004-11-16 Ememory Technology Inc. Electrically erasable programmable logic device
KR100583968B1 (ko) * 2004-08-03 2006-05-26 삼성전자주식회사 스페이스 트랜치들을 갖는 불 휘발성 메모리 장치들 및 그형성방법들
CN100411145C (zh) * 2005-08-19 2008-08-13 力晶半导体股份有限公司 非挥发性存储器及其制造方法与操作方法
TWI281753B (en) * 2005-12-13 2007-05-21 Powerchip Semiconductor Corp Non-volatile memory and manufacturing method and operating method thereof
US8320191B2 (en) 2007-08-30 2012-11-27 Infineon Technologies Ag Memory cell arrangement, method for controlling a memory cell, memory array and electronic device
US7974114B2 (en) * 2009-04-28 2011-07-05 Infineon Technologies Ag Memory cell arrangements
JP6751002B2 (ja) * 2016-10-19 2020-09-02 旭化成エレクトロニクス株式会社 電流源
JP6751013B2 (ja) * 2016-12-27 2020-09-02 旭化成エレクトロニクス株式会社 温度特性調整回路

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JPS62113478A (ja) * 1985-11-13 1987-05-25 Toshiba Corp 不揮発性半導体メモリ
JPH04359476A (ja) * 1991-06-05 1992-12-11 Oki Electric Ind Co Ltd 不揮発性半導体メモリの書き換え方法
JP2862434B2 (ja) * 1991-06-07 1999-03-03 シャープ株式会社 不揮発性メモリ
EP0517353B1 (en) * 1991-06-07 1997-05-14 Sharp Kabushiki Kaisha Non-volatile memory
JPH05110071A (ja) * 1991-10-17 1993-04-30 Seiko Epson Corp 半導体装置
JPH05226662A (ja) * 1992-02-18 1993-09-03 Matsushita Electron Corp 半導体記憶装置
JPH06120515A (ja) * 1992-10-09 1994-04-28 Oki Electric Ind Co Ltd 半導体不揮発性メモリのデータ書き込み及びデータ消去方法
US5910912A (en) * 1992-10-30 1999-06-08 International Business Machines Corporation Flash EEPROM with dual-sidewall gate
DE69325505T2 (de) * 1993-02-19 1999-10-28 St Microelectronics Srl Programmierungsverfahren einer EEPROM-Zelle mit doppelter Polysiliziumschicht
US5596529A (en) * 1993-11-30 1997-01-21 Kabushiki Kaisha Toshiba Nonvolatile semiconductor memory device
US5422504A (en) * 1994-05-02 1995-06-06 Motorola Inc. EEPROM memory device having a sidewall spacer floating gate electrode and process
US5429969A (en) * 1994-05-31 1995-07-04 Motorola, Inc. Process for forming electrically programmable read-only memory cell with a merged select/control gate
KR0144421B1 (ko) * 1994-07-18 1998-07-01 김주용 플레쉬 이.이.피.롬의 제조방법

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202010001832U1 (de) 2009-12-31 2010-07-08 UNISTAR OPTO CORPORATION, Neihu Röhrenlose, Leuchtdioden-basierte Beleuchtungsvorrichtung
DE102010006857A1 (de) 2009-12-31 2011-07-07 Unistar Opto Corporation Röhrenlose, Leuchtdioden-basierte Beleuchtungsvorrichtung
DE202010011792U1 (de) 2010-08-25 2011-02-24 AzureLighting Technologies, Inc., Xindian Schutzschaltkreis einer T8 LED-Beleuchtungsröhre

Also Published As

Publication number Publication date
KR970018630A (ko) 1997-04-30
KR100413652B1 (ko) 2004-05-27
DE69618302T2 (de) 2002-08-08
EP1020925A2 (en) 2000-07-19
SG44973A1 (en) 1997-12-19
DE69628056D1 (de) 2003-06-12
EP1020925B1 (en) 2003-05-07
DE69628056T2 (de) 2003-11-20
US5753953A (en) 1998-05-19
EP0763856A1 (en) 1997-03-19
EP1020925A3 (en) 2000-09-20
DE69618302D1 (de) 2002-02-07
EP0763856B1 (en) 2002-01-02

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