TW364164B - CVD film forming method comprising post treatment after cleaning - Google Patents
CVD film forming method comprising post treatment after cleaningInfo
- Publication number
- TW364164B TW364164B TW086118510A TW86118510A TW364164B TW 364164 B TW364164 B TW 364164B TW 086118510 A TW086118510 A TW 086118510A TW 86118510 A TW86118510 A TW 86118510A TW 364164 B TW364164 B TW 364164B
- Authority
- TW
- Taiwan
- Prior art keywords
- film forming
- treatment chamber
- treatment
- chamber
- gas
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 3
- 238000004140 cleaning Methods 0.000 title 1
- 238000005108 dry cleaning Methods 0.000 abstract 2
- 239000011859 microparticle Substances 0.000 abstract 1
- 238000010926 purge Methods 0.000 abstract 1
Classifications
-
- H01L21/205—
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45563—Gas nozzles
- C23C16/45565—Shower nozzles
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
- C23C16/4405—Cleaning of reactor or parts inside the reactor by using reactive gases
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
- C23C16/4408—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber by purging residual gases from the reaction chamber or gas lines
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45561—Gas plumbing upstream of the reaction chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45563—Gas nozzles
- C23C16/45574—Nozzles for more than one gas
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/905—Cleaning of reaction chamber
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP35460396A JP3476638B2 (ja) | 1996-12-20 | 1996-12-20 | Cvd成膜方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW364164B true TW364164B (en) | 1999-07-11 |
Family
ID=18438681
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW086118510A TW364164B (en) | 1996-12-20 | 1997-12-09 | CVD film forming method comprising post treatment after cleaning |
Country Status (4)
Country | Link |
---|---|
US (1) | US5963834A (zh) |
JP (1) | JP3476638B2 (zh) |
KR (1) | KR100329515B1 (zh) |
TW (1) | TW364164B (zh) |
Families Citing this family (46)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3003608B2 (ja) * | 1997-01-23 | 2000-01-31 | 日本電気株式会社 | 半導体装置の製造方法 |
US6087261A (en) * | 1997-09-30 | 2000-07-11 | Fujitsu Limited | Method for production of semiconductor device |
TW589398B (en) * | 1998-05-20 | 2004-06-01 | Samsung Electronics Co Ltd | Filtering technique for CVD chamber process gases and the same apparatus |
US6302964B1 (en) * | 1998-06-16 | 2001-10-16 | Applied Materials, Inc. | One-piece dual gas faceplate for a showerhead in a semiconductor wafer processing system |
US6190732B1 (en) * | 1998-09-03 | 2001-02-20 | Cvc Products, Inc. | Method and system for dispensing process gas for fabricating a device on a substrate |
JP3818480B2 (ja) * | 1999-04-21 | 2006-09-06 | 株式会社日立国際電気 | 半導体素子の製造方法及びその装置 |
US6291358B1 (en) * | 1999-10-15 | 2001-09-18 | Micron Technology, Inc. | Plasma deposition tool operating method |
JP4547744B2 (ja) * | 1999-11-17 | 2010-09-22 | 東京エレクトロン株式会社 | プリコート膜の形成方法、成膜装置のアイドリング方法、載置台構造及び成膜装置 |
KR100709801B1 (ko) * | 1999-11-17 | 2007-04-23 | 동경 엘렉트론 주식회사 | 프리코트막의 형성방법, 성막장치의 아이들링 방법,재치대 구조, 성막장치 및 성막방법 |
WO2001042529A1 (en) * | 1999-12-09 | 2001-06-14 | Tokyo Electron Limited | METHOD FOR FORMING TiSiN FILM, DIFFUSION PREVENTIVE FILM COMPRISING TiSiN FILM, SEMICONDUCTOR DEVICE AND ITS PRODUCTION METHOD, AND APPARATUS FOR FORMING TiSiN FILM |
JP4419237B2 (ja) * | 1999-12-22 | 2010-02-24 | 東京エレクトロン株式会社 | 成膜装置及び被処理体の処理方法 |
JP4505915B2 (ja) * | 2000-01-13 | 2010-07-21 | 東京エレクトロン株式会社 | 成膜方法 |
JP4703810B2 (ja) * | 2000-03-07 | 2011-06-15 | 東京エレクトロン株式会社 | Cvd成膜方法 |
US6502530B1 (en) * | 2000-04-26 | 2003-01-07 | Unaxis Balzers Aktiengesellschaft | Design of gas injection for the electrode in a capacitively coupled RF plasma reactor |
EP1167568B1 (en) * | 2000-06-21 | 2006-06-07 | Tokyo Electron Limited | Heat treatment apparatus and cleaning method of the same |
KR100444149B1 (ko) * | 2000-07-22 | 2004-08-09 | 주식회사 아이피에스 | Ald 박막증착설비용 클리닝방법 |
KR100375102B1 (ko) * | 2000-10-18 | 2003-03-08 | 삼성전자주식회사 | 반도체 장치의 제조에서 화학 기상 증착 방법 및 이를수행하기 위한 장치 |
JP5001489B2 (ja) * | 2001-03-19 | 2012-08-15 | 東京エレクトロン株式会社 | 処理装置 |
JP2003077838A (ja) * | 2001-08-30 | 2003-03-14 | Toshiba Corp | 半導体製造装置のドライクリーニング時期判定システム、半導体製造装置のドライクリーニング方法、半導体製造装置のドライクリーニングシステム及び半導体装置の製造方法 |
JP2003077839A (ja) * | 2001-08-30 | 2003-03-14 | Toshiba Corp | 半導体製造装置のパージ方法及び半導体装置の製造方法 |
US20050136657A1 (en) * | 2002-07-12 | 2005-06-23 | Tokyo Electron Limited | Film-formation method for semiconductor process |
JP4430918B2 (ja) * | 2003-03-25 | 2010-03-10 | 東京エレクトロン株式会社 | 薄膜形成装置の洗浄方法及び薄膜形成方法 |
KR100527047B1 (ko) * | 2003-07-01 | 2005-11-09 | 주식회사 아이피에스 | 박막증착방법 |
CN1823404B (zh) * | 2003-09-19 | 2012-08-29 | 株式会社日立国际电气 | 半导体装置的制造方法及衬底处理装置 |
KR100718180B1 (ko) * | 2004-03-29 | 2007-05-15 | 가부시키가이샤 히다치 고쿠사이 덴키 | 반도체 장치의 제조 방법 및 기판 처리 장치 |
JP2006165246A (ja) * | 2004-12-07 | 2006-06-22 | Tokyo Electron Ltd | プラズマエッチング方法 |
JP4703230B2 (ja) * | 2005-03-29 | 2011-06-15 | 株式会社日立国際電気 | 半導体装置の製造方法及び基板処理装置 |
JP4823628B2 (ja) * | 2005-09-26 | 2011-11-24 | 東京エレクトロン株式会社 | 基板処理方法および記録媒体 |
KR100706810B1 (ko) * | 2006-02-07 | 2007-04-12 | 삼성전자주식회사 | 박박 형성 장치의 세정 방법 및 이를 이용한 박막 형성방법 |
CN101490307B (zh) | 2006-07-11 | 2011-06-08 | 东京毅力科创株式会社 | 成膜方法、清洁方法和成膜装置 |
CN100451163C (zh) * | 2006-10-18 | 2009-01-14 | 中微半导体设备(上海)有限公司 | 用于半导体工艺件处理反应器的气体分布装置及其反应器 |
JP5208756B2 (ja) * | 2006-10-19 | 2013-06-12 | 東京エレクトロン株式会社 | Ti系膜の成膜方法および記憶媒体 |
US20090114245A1 (en) * | 2007-11-02 | 2009-05-07 | Hidehiro Kojiri | In-situ chamber cleaning method |
JP4975605B2 (ja) | 2007-12-26 | 2012-07-11 | 東京エレクトロン株式会社 | 処理システム、処理システムの制御方法およびソフトウェアのバージョンアップ方法 |
JP5439771B2 (ja) * | 2008-09-05 | 2014-03-12 | 東京エレクトロン株式会社 | 成膜装置 |
US20100273291A1 (en) * | 2009-04-28 | 2010-10-28 | Applied Materials, Inc. | Decontamination of mocvd chamber using nh3 purge after in-situ cleaning |
WO2010129289A2 (en) * | 2009-04-28 | 2010-11-11 | Applied Materials, Inc. | Decontamination of mocvd chamber using nh3 purge after in-situ cleaning |
CN102414786B (zh) * | 2009-04-28 | 2016-08-24 | 应用材料公司 | 在原位清洁后利用nh3净化对mocvd腔室进行去污染处理 |
WO2011001394A2 (en) | 2009-07-02 | 2011-01-06 | L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude | Method of removing residual fluorine from deposition chamber |
JP5194036B2 (ja) * | 2010-01-27 | 2013-05-08 | 株式会社日立国際電気 | 基板処理装置、半導体デバイスの製造方法およびクリーニング方法 |
JP5194047B2 (ja) * | 2010-04-14 | 2013-05-08 | 株式会社日立国際電気 | 基板処理装置、半導体デバイスの製造方法およびクリーニング方法 |
CN102517564A (zh) * | 2011-12-16 | 2012-06-27 | 汉能科技有限公司 | 一种lpcvd工艺腔中的气体吹扫系统及方法 |
JP6107327B2 (ja) * | 2013-03-29 | 2017-04-05 | 東京エレクトロン株式会社 | 成膜装置及びガス供給装置並びに成膜方法 |
KR20150029427A (ko) * | 2013-09-10 | 2015-03-18 | 삼성디스플레이 주식회사 | 기상 증착 장치, 기상 증착 방법 및 유기 발광 표시 장치 제조 방법 |
JP6495875B2 (ja) | 2016-09-12 | 2019-04-03 | 株式会社東芝 | 流路構造及び処理装置 |
JP6971887B2 (ja) * | 2018-03-02 | 2021-11-24 | 東京エレクトロン株式会社 | 成膜方法及び成膜装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0637074A (ja) * | 1992-07-17 | 1994-02-10 | Fujitsu Ltd | 半導体製造装置のクリーニング方法 |
US5326723A (en) * | 1992-09-09 | 1994-07-05 | Intel Corporation | Method for improving stability of tungsten chemical vapor deposition |
US5616208A (en) * | 1993-09-17 | 1997-04-01 | Tokyo Electron Limited | Vacuum processing apparatus, vacuum processing method, and method for cleaning the vacuum processing apparatus |
JP3247270B2 (ja) * | 1994-08-25 | 2002-01-15 | 東京エレクトロン株式会社 | 処理装置及びドライクリーニング方法 |
-
1996
- 1996-12-20 JP JP35460396A patent/JP3476638B2/ja not_active Expired - Lifetime
-
1997
- 1997-12-09 TW TW086118510A patent/TW364164B/zh active
- 1997-12-11 KR KR1019970067905A patent/KR100329515B1/ko not_active IP Right Cessation
- 1997-12-17 US US08/992,178 patent/US5963834A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH10189488A (ja) | 1998-07-21 |
KR19980064042A (ko) | 1998-10-07 |
US5963834A (en) | 1999-10-05 |
JP3476638B2 (ja) | 2003-12-10 |
KR100329515B1 (ko) | 2002-08-21 |
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