JP4823628B2 - 基板処理方法および記録媒体 - Google Patents
基板処理方法および記録媒体 Download PDFInfo
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- JP4823628B2 JP4823628B2 JP2005278367A JP2005278367A JP4823628B2 JP 4823628 B2 JP4823628 B2 JP 4823628B2 JP 2005278367 A JP2005278367 A JP 2005278367A JP 2005278367 A JP2005278367 A JP 2005278367A JP 4823628 B2 JP4823628 B2 JP 4823628B2
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/02—Pretreatment of the material to be coated
- C23C16/0227—Pretreatment of the material to be coated by cleaning or etching
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
- C23C16/16—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material from metal carbonyl compounds
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/34—Nitrides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
- C23C16/4405—Cleaning of reactor or parts inside the reactor by using reactive gases
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Description
被処理基板を保持する、加熱手段を有しセラミック材料よりなる保持台と、
前記保持台を内部に備えた処理容器と、を有する成膜装置による基板処理方法であって、
前記処理容器に成膜ガスを供給して前記被処理基板に成膜を行う成膜工程と、
前記成膜工程後に、プラズマ励起されたフッ素含有クリーニングガスを前記処理容器に供給して前記処理容器内のクリーニングをするクリーニング工程と、
前記クリーニング工程後に前記処理容器内にコーティング成膜を行うコーティング工程と、を有し、
前記クリーニング工程では、プラズマ励起された前記フッ素含有クリーニングガス中のフッ素ラジカルが再結合したフッ素分子によるクリーニングが支配的となるよう前記処理容器内の圧力が20Torr以上に制御される高圧工程と、前記高圧工程よりも前記処理容器内の圧力を低くして前記処理容器内をクリーニングする低圧工程とを含み、前記低圧工程では、前記高圧工程よりも前記保持台の温度が低くされ、
前記コーティング工程では、前記成膜工程の前記被処理基板への成膜の場合より前記保持台の温度を下げて前記コーティング成膜が行われる低温成膜工程を含むことを特徴とする。
また、本発明の他の実施形態による基板処理方法は、
被処理基板を保持する、加熱手段を有しセラミック材料よりなる保持台と、
前記保持台を内部に備えた処理容器と、を有する成膜装置による基板処理方法であって、
前記処理容器に成膜ガスを供給して前記被処理基板に成膜を行う成膜工程と、
前記成膜工程後に、プラズマ励起されたフッ素含有クリーニングガスを前記処理容器に供給して前記処理容器内のクリーニングをするクリーニング工程と、
前記クリーニング工程後に前記処理容器内にコーティング成膜を行うコーティング工程と、を有し、
前記クリーニング工程では、プラズマ励起された前記フッ素含有クリーニングガス中のフッ素ラジカルが再結合したフッ素分子によるクリーニングが支配的となるよう前記処理容器内の圧力が20Torr以上に制御される高圧工程を含み、
前記コーティング工程では、前記成膜工程の前記被処理基板への成膜の場合より前記保持台の温度を下げて前記コーティング成膜が行われる低温成膜工程と、前記低温成膜工程より前記保持台の温度を高くして前記処理容器内へコーティング成膜を行う、高温成膜工程とを含むことを特徴とする。
Claims (11)
- 被処理基板を保持する、加熱手段を有しセラミック材料よりなる保持台と、
前記保持台を内部に備えた処理容器と、を有する成膜装置による基板処理方法であって、
前記処理容器に成膜ガスを供給して前記被処理基板に成膜を行う成膜工程と、
前記成膜工程後に、プラズマ励起されたフッ素含有クリーニングガスを前記処理容器に供給して前記処理容器内のクリーニングをするクリーニング工程と、
前記クリーニング工程後に前記処理容器内にコーティング成膜を行うコーティング工程と、を有し、
前記クリーニング工程では、プラズマ励起された前記フッ素含有クリーニングガス中のフッ素ラジカルが再結合したフッ素分子によるクリーニングが支配的となるよう前記処理容器内の圧力が20Torr以上に制御される高圧工程と、前記高圧工程よりも前記処理容器内の圧力を低くして前記処理容器内をクリーニングする低圧工程とを含み、前記低圧工程では、前記高圧工程よりも前記保持台の温度が低くされ、
前記コーティング工程では、前記成膜工程の前記被処理基板への成膜の場合より前記保持台の温度を下げて前記コーティング成膜が行われる低温成膜工程を含むことを特徴とする基板処理方法。 - 前記低圧工程では、前記処理容器内の圧力が10Torr以下とされることを特徴とする請求項1記載の基板処理方法。
- 前記低圧工程では、前記保持台の温度が300℃以下とされることを特徴とする請求項2記載の基板処理方法。
- 前記クリーニング工程では、前記低圧工程後に、前記高圧工程が実施されることを特徴とする請求項1乃至3のうち、いずれか1項記載の基板処理方法。
- 被処理基板を保持する、加熱手段を有しセラミック材料よりなる保持台と、
前記保持台を内部に備えた処理容器と、を有する成膜装置による基板処理方法であって、
前記処理容器に成膜ガスを供給して前記被処理基板に成膜を行う成膜工程と、
前記成膜工程後に、プラズマ励起されたフッ素含有クリーニングガスを前記処理容器に供給して前記処理容器内のクリーニングをするクリーニング工程と、
前記クリーニング工程後に前記処理容器内にコーティング成膜を行うコーティング工程と、を有し、
前記クリーニング工程では、プラズマ励起された前記フッ素含有クリーニングガス中のフッ素ラジカルが再結合したフッ素分子によるクリーニングが支配的となるよう前記処理容器内の圧力が20Torr以上に制御される高圧工程を含み、
前記コーティング工程では、前記成膜工程の前記被処理基板への成膜の場合より前記保持台の温度を下げて前記コーティング成膜が行われる低温成膜工程と、前記低温成膜工程より前記保持台の温度を高くして前記処理容器内へコーティング成膜を行う、高温成膜工程とを含むことを特徴とする基板処理方法。 - 前記コーティング工程では、前記低温成膜工程の後で、前記高温成膜工程が行われることを特徴とする請求項5記載の基板処理方法。
- 前記クリーニングガスは、NF3よりなり、前記成膜工程で成膜される膜はWを含むことを特徴とする請求項1乃至6のうち、いずれか1項記載の基板処理方法。
- 前記高圧工程では、前記保持台の温度が350℃以上とされることを特徴とする請求項7記載の基板処理方法。
- 前記低温成膜工程では、前記保持台の温度が、430℃以下とされることを特徴とする請求項1乃至8のうち、いずれか1項記載の基板処理方法。
- 前記クリーニング工程と前記コーティング工程の間に、前記処理容器内を不活性ガスでパージするパージ工程をさらに有することを特徴とする請求項1乃至9のうち、いずれか1項記載の基板処理方法。
- 請求項1乃至10のうち、いずれか1項記載の基板処理方法をコンピュータに動作させるプログラムを記憶した記録媒体。
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JP2005278367A JP4823628B2 (ja) | 2005-09-26 | 2005-09-26 | 基板処理方法および記録媒体 |
CNA2006800354936A CN101273154A (zh) | 2005-09-26 | 2006-07-25 | 基板处理方法和记录介质 |
PCT/JP2006/314612 WO2007034624A1 (ja) | 2005-09-26 | 2006-07-25 | 基板処理方法および記録媒体 |
US12/088,153 US20090117270A1 (en) | 2005-09-26 | 2006-07-25 | Method for treating substrate and recording medium |
KR1020087007208A KR101012959B1 (ko) | 2005-09-26 | 2006-07-25 | 기판 처리 방법 및 기록매체 |
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KR (1) | KR101012959B1 (ja) |
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