TW356584B - Ferroelectric transistors of thin film semiconductor gate electrodes - Google Patents

Ferroelectric transistors of thin film semiconductor gate electrodes

Info

Publication number
TW356584B
TW356584B TW086115734A TW86115734A TW356584B TW 356584 B TW356584 B TW 356584B TW 086115734 A TW086115734 A TW 086115734A TW 86115734 A TW86115734 A TW 86115734A TW 356584 B TW356584 B TW 356584B
Authority
TW
Taiwan
Prior art keywords
thin film
gate electrodes
film semiconductor
semiconductor gate
ferroelectric transistors
Prior art date
Application number
TW086115734A
Other languages
English (en)
Inventor
Theodore S Moyes
Scott R Summerfelt
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Application granted granted Critical
Publication of TW356584B publication Critical patent/TW356584B/zh

Links

Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C29/00Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/04Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
    • G11C29/08Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
    • G11C29/12Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details
    • G11C29/44Indication or identification of errors, e.g. for repair
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/40Electrodes ; Multistep manufacturing processes therefor
    • H01L29/401Multistep manufacturing processes
    • H01L29/4011Multistep manufacturing processes for data storage electrodes
    • H01L29/40111Multistep manufacturing processes for data storage electrodes the electrodes comprising a layer which is used for its ferroelectric properties
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/78391Field effect transistors with field effect produced by an insulated gate the gate comprising a layer which is used for its ferroelectric properties
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/22Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using ferroelectric elements
    • G11C11/223Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using ferroelectric elements using MOS with ferroelectric gate insulating film
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C29/00Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/04Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
    • G11C29/08Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
    • G11C29/12Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details
    • G11C2029/1208Error catch memory
TW086115734A 1996-10-25 1997-10-24 Ferroelectric transistors of thin film semiconductor gate electrodes TW356584B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US2916896P 1996-10-25 1996-10-25

Publications (1)

Publication Number Publication Date
TW356584B true TW356584B (en) 1999-04-21

Family

ID=21847603

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086115734A TW356584B (en) 1996-10-25 1997-10-24 Ferroelectric transistors of thin film semiconductor gate electrodes

Country Status (4)

Country Link
US (2) US6225655B1 (zh)
JP (1) JPH10135362A (zh)
KR (1) KR19980033143A (zh)
TW (1) TW356584B (zh)

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DE19947117B4 (de) * 1999-09-30 2007-03-08 Infineon Technologies Ag Ferroelektrischer Transistor und dessen Verwendung in einer Speicherzellenanordnung
KR100379941B1 (ko) * 2001-03-06 2003-04-11 주승기 거대 단결정립 강유전체 박막의 제조방법 및 이를 이용한강유전체 기억소자의 제조방법
US7168026B2 (en) * 2001-06-22 2007-01-23 Intel Corporation Method and apparatus for preservation of failure state in a read destructive memory
DE10212926A1 (de) * 2002-03-22 2003-10-16 Infineon Technologies Ag Halbleiterspeicherzelle und Halbleiterspeichereinrichtung
US6812509B2 (en) 2002-06-28 2004-11-02 Palo Alto Research Center Inc. Organic ferroelectric memory cells
CN100573910C (zh) * 2003-06-05 2009-12-23 三菱电机株式会社 半导体器件及其制造方法
US7262463B2 (en) * 2003-07-25 2007-08-28 Hewlett-Packard Development Company, L.P. Transistor including a deposited channel region having a doped portion
US20050017244A1 (en) * 2003-07-25 2005-01-27 Randy Hoffman Semiconductor device
US7297602B2 (en) * 2003-09-09 2007-11-20 Sharp Laboratories Of America, Inc. Conductive metal oxide gate ferroelectric memory transistor
US7008833B2 (en) * 2004-01-12 2006-03-07 Sharp Laboratories Of America, Inc. In2O3thin film resistivity control by doping metal oxide insulator for MFMox device applications
US7297977B2 (en) * 2004-03-12 2007-11-20 Hewlett-Packard Development Company, L.P. Semiconductor device
US7282782B2 (en) * 2004-03-12 2007-10-16 Hewlett-Packard Development Company, L.P. Combined binary oxide semiconductor device
US7378286B2 (en) * 2004-08-20 2008-05-27 Sharp Laboratories Of America, Inc. Semiconductive metal oxide thin film ferroelectric memory transistor
JP4375560B2 (ja) * 2004-12-07 2009-12-02 セイコーエプソン株式会社 トランジスタ型強誘電体メモリの製造方法
US7833904B2 (en) * 2005-06-16 2010-11-16 The Trustees Of Columbia University In The City Of New York Methods for fabricating nanoscale electrodes and uses thereof
KR101213871B1 (ko) * 2005-12-15 2012-12-18 엘지디스플레이 주식회사 박막 트랜지스터 어레이 기판 및 그 제조 방법
KR100718155B1 (ko) 2006-02-27 2007-05-14 삼성전자주식회사 두 개의 산화층을 이용한 비휘발성 메모리 소자
JPWO2010097862A1 (ja) * 2009-02-24 2012-08-30 パナソニック株式会社 半導体メモリセル及びその製造方法並びに半導体記憶装置
KR20100132856A (ko) * 2009-06-10 2010-12-20 고려대학교 산학협력단 멀티 펑션 비휘발성 퓨전 메모리 소자 및 그의 제조 방법
CN105990522A (zh) * 2015-01-28 2016-10-05 泓准达科技(上海)有限公司 一种柔性铁电存储器及其制备方法
US9876090B1 (en) * 2016-06-30 2018-01-23 International Business Machines Corporation Lattice matched and strain compensated single-crystal compound for gate dielectric
KR20180134124A (ko) * 2017-06-08 2018-12-18 에스케이하이닉스 주식회사 강유전성 메모리 소자
KR20190008048A (ko) * 2017-07-14 2019-01-23 에스케이하이닉스 주식회사 강유전성 메모리 소자

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US4888630A (en) * 1988-03-21 1989-12-19 Texas Instruments Incorporated Floating-gate transistor with a non-linear intergate dielectric
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JP3264506B2 (ja) * 1991-11-18 2002-03-11 ローム株式会社 強誘電体不揮発性記憶装置
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US6002150A (en) * 1998-06-17 1999-12-14 Advanced Micro Devices, Inc. Compound material T gate structure for devices with gate dielectrics having a high dielectric constant

Also Published As

Publication number Publication date
US6362499B1 (en) 2002-03-26
JPH10135362A (ja) 1998-05-22
US6225655B1 (en) 2001-05-01
KR19980033143A (ko) 1998-07-25

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees