TW344089B - Loading and unloading station for semiconductor processing installations - Google Patents

Loading and unloading station for semiconductor processing installations

Info

Publication number
TW344089B
TW344089B TW085101887A TW85101887A TW344089B TW 344089 B TW344089 B TW 344089B TW 085101887 A TW085101887 A TW 085101887A TW 85101887 A TW85101887 A TW 85101887A TW 344089 B TW344089 B TW 344089B
Authority
TW
Taiwan
Prior art keywords
container
semiconductor processing
loading
transporting
unloading station
Prior art date
Application number
TW085101887A
Other languages
English (en)
Chinese (zh)
Inventor
Mages Andreas
Scheler Werner
Blaschitz Herbert
Schulz Alfred
Schneider Heinz
Original Assignee
Jenoptik Jena Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jenoptik Jena Gmbh filed Critical Jenoptik Jena Gmbh
Application granted granted Critical
Publication of TW344089B publication Critical patent/TW344089B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y10S414/138—Wafers positioned vertically within cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Warehouses Or Storage Devices (AREA)
  • Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
  • Packaging Frangible Articles (AREA)
TW085101887A 1995-03-28 1996-02-15 Loading and unloading station for semiconductor processing installations TW344089B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19511024 1995-03-28
DE19542646A DE19542646C2 (de) 1995-03-28 1995-11-15 Be- und Entladestation für Halbleiterbearbeitungsanlagen

Publications (1)

Publication Number Publication Date
TW344089B true TW344089B (en) 1998-11-01

Family

ID=7757757

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085101887A TW344089B (en) 1995-03-28 1996-02-15 Loading and unloading station for semiconductor processing installations

Country Status (4)

Country Link
JP (1) JP5020994B2 (de)
KR (1) KR100271586B1 (de)
DE (1) DE19542646C2 (de)
TW (1) TW344089B (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW344847B (en) * 1996-08-29 1998-11-11 Tokyo Electron Co Ltd Substrate treatment system, substrate transfer system, and substrate transfer method
DE19805624A1 (de) 1998-02-12 1999-09-23 Acr Automation In Cleanroom Schleuse zum Öffnen und Schließen von Reinraumtransport-Boxen
DE19806231C1 (de) * 1998-02-16 1999-07-22 Jenoptik Jena Gmbh Einrichtung zum Greifen eines Objektes
US6368040B1 (en) 1998-02-18 2002-04-09 Tokyo Electron Limited Apparatus for and method of transporting substrates to be processed
US6106213A (en) * 1998-02-27 2000-08-22 Pri Automation, Inc. Automated door assembly for use in semiconductor wafer manufacturing
DE19813684C2 (de) 1998-03-27 2001-08-16 Brooks Automation Gmbh Einrichtung zur Aufnahme von Transportbehältern an einer Be- und Entladestation
DE19826949A1 (de) * 1998-06-17 1999-12-23 Georg Kunkel Vorrichtung zum Transport von plattenartigen Substraten, beispielsweise von Glasplatten für Flachbildschirme
JP3917371B2 (ja) * 1998-12-02 2007-05-23 大日商事株式会社 コンテナ
DE19951200C2 (de) * 1999-10-22 2003-01-30 Ortner Cls Gmbh Cleanroom Logi Transportvorrichtung
DE10119702A1 (de) * 2001-04-20 2002-10-24 Brooks Automation Gmbh Einrichtung zur Prüfung der Verschlußkräfte an der Verriegelung von Reinraumtransportboxen
JP4821756B2 (ja) * 2007-10-19 2011-11-24 東京エレクトロン株式会社 被処理体の移載機構、被処理体の移載方法及び被処理体の処理システム
DE102018206618B3 (de) * 2018-04-27 2019-05-23 Fabmatics Gmbh Vorrichtung und Verfahren zum Öffnen und Schließen einer Transportbox
CN115057081A (zh) * 2022-06-23 2022-09-16 上海大族富创得科技有限公司 一种光罩存储盒开合器

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4758127A (en) * 1983-06-24 1988-07-19 Canon Kabushiki Kaisha Original feeding apparatus and a cassette for containing the original
JPS62264637A (ja) * 1986-05-12 1987-11-17 Nec Corp 集積回路処理用インタ−フエ−ス
JPS6328046A (ja) * 1986-07-22 1988-02-05 Toshiba Mach Co Ltd カセツト搬送ボツクス
US5186594A (en) * 1990-04-19 1993-02-16 Applied Materials, Inc. Dual cassette load lock
DE4024973C2 (de) * 1990-08-07 1994-11-03 Ibm Anordnung zum Lagern, Transportieren und Einschleusen von Substraten
JPH04360545A (ja) * 1991-06-07 1992-12-14 Sharp Corp 部品供給装置
JPH081923B2 (ja) * 1991-06-24 1996-01-10 ティーディーケイ株式会社 クリーン搬送方法及び装置
JP3084828B2 (ja) * 1991-09-20 2000-09-04 神鋼電機株式会社 機械式インターフェース装置
JPH05109863A (ja) * 1991-10-17 1993-04-30 Shinko Electric Co Ltd 機械式インターフエース装置
JPH05338728A (ja) * 1992-06-05 1993-12-21 Fujitsu Ltd ウエーハ搬送方法及び装置
JP3162852B2 (ja) * 1993-01-19 2001-05-08 日置電機株式会社 回路基板検査機のマガジンラック供給装置
JPH0714906A (ja) * 1993-06-21 1995-01-17 Shinko Electric Co Ltd 可搬式密閉コンテナの蓋開閉機構
DE4326309C1 (de) * 1993-08-05 1994-09-15 Jenoptik Jena Gmbh Vorrichtung zum Transport von Wafermagazinen

Also Published As

Publication number Publication date
JP2009170945A (ja) 2009-07-30
KR100271586B1 (ko) 2000-11-15
DE19542646C2 (de) 2003-04-30
JP5020994B2 (ja) 2012-09-05
KR960035954A (ko) 1996-10-28
DE19542646A1 (de) 1996-10-02

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Legal Events

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