JP5020994B2 - 半導体加工装置のためのローディング及びアンローディング用ステーション - Google Patents

半導体加工装置のためのローディング及びアンローディング用ステーション Download PDF

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Publication number
JP5020994B2
JP5020994B2 JP2009113005A JP2009113005A JP5020994B2 JP 5020994 B2 JP5020994 B2 JP 5020994B2 JP 2009113005 A JP2009113005 A JP 2009113005A JP 2009113005 A JP2009113005 A JP 2009113005A JP 5020994 B2 JP5020994 B2 JP 5020994B2
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Japan
Prior art keywords
loading
container
closure
cover
transport container
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Expired - Lifetime
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JP2009113005A
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English (en)
Japanese (ja)
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JP2009170945A (ja
Inventor
マゲス アンドレアス
シュレル ヴェルナー
ブラシッツ ヘルベルト
シュルツ アルフレッド
シュナイダー ハインツ
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Brooks Automation Germany GmbH
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Brooks Automation Germany GmbH
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Publication of JP2009170945A publication Critical patent/JP2009170945A/ja
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Publication of JP5020994B2 publication Critical patent/JP5020994B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y10S414/138—Wafers positioned vertically within cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
  • Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
  • Warehouses Or Storage Devices (AREA)
JP2009113005A 1995-03-28 2009-05-07 半導体加工装置のためのローディング及びアンローディング用ステーション Expired - Lifetime JP5020994B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE19511024 1995-03-28
DE19542646-0 1995-11-15
DE19511024-2 1995-11-15
DE19542646A DE19542646C2 (de) 1995-03-28 1995-11-15 Be- und Entladestation für Halbleiterbearbeitungsanlagen

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2000373483A Division JP2001203252A (ja) 1995-03-28 2000-12-07 半導体加工装置のためのローディング及びアンローディング用ステーション

Publications (2)

Publication Number Publication Date
JP2009170945A JP2009170945A (ja) 2009-07-30
JP5020994B2 true JP5020994B2 (ja) 2012-09-05

Family

ID=7757757

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009113005A Expired - Lifetime JP5020994B2 (ja) 1995-03-28 2009-05-07 半導体加工装置のためのローディング及びアンローディング用ステーション

Country Status (4)

Country Link
JP (1) JP5020994B2 (de)
KR (1) KR100271586B1 (de)
DE (1) DE19542646C2 (de)
TW (1) TW344089B (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW344847B (en) * 1996-08-29 1998-11-11 Tokyo Electron Co Ltd Substrate treatment system, substrate transfer system, and substrate transfer method
DE19805624A1 (de) 1998-02-12 1999-09-23 Acr Automation In Cleanroom Schleuse zum Öffnen und Schließen von Reinraumtransport-Boxen
DE19806231C1 (de) * 1998-02-16 1999-07-22 Jenoptik Jena Gmbh Einrichtung zum Greifen eines Objektes
US6368040B1 (en) 1998-02-18 2002-04-09 Tokyo Electron Limited Apparatus for and method of transporting substrates to be processed
US6106213A (en) * 1998-02-27 2000-08-22 Pri Automation, Inc. Automated door assembly for use in semiconductor wafer manufacturing
DE19813684C2 (de) 1998-03-27 2001-08-16 Brooks Automation Gmbh Einrichtung zur Aufnahme von Transportbehältern an einer Be- und Entladestation
DE19826949A1 (de) * 1998-06-17 1999-12-23 Georg Kunkel Vorrichtung zum Transport von plattenartigen Substraten, beispielsweise von Glasplatten für Flachbildschirme
JP3917371B2 (ja) * 1998-12-02 2007-05-23 大日商事株式会社 コンテナ
DE19951200C2 (de) * 1999-10-22 2003-01-30 Ortner Cls Gmbh Cleanroom Logi Transportvorrichtung
DE10119702A1 (de) * 2001-04-20 2002-10-24 Brooks Automation Gmbh Einrichtung zur Prüfung der Verschlußkräfte an der Verriegelung von Reinraumtransportboxen
JP4821756B2 (ja) * 2007-10-19 2011-11-24 東京エレクトロン株式会社 被処理体の移載機構、被処理体の移載方法及び被処理体の処理システム
DE102018206618B3 (de) * 2018-04-27 2019-05-23 Fabmatics Gmbh Vorrichtung und Verfahren zum Öffnen und Schließen einer Transportbox
CN115057081A (zh) * 2022-06-23 2022-09-16 上海大族富创得科技有限公司 一种光罩存储盒开合器

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4758127A (en) * 1983-06-24 1988-07-19 Canon Kabushiki Kaisha Original feeding apparatus and a cassette for containing the original
JPS62264637A (ja) * 1986-05-12 1987-11-17 Nec Corp 集積回路処理用インタ−フエ−ス
JPS6328046A (ja) * 1986-07-22 1988-02-05 Toshiba Mach Co Ltd カセツト搬送ボツクス
US5186594A (en) * 1990-04-19 1993-02-16 Applied Materials, Inc. Dual cassette load lock
DE4024973C2 (de) * 1990-08-07 1994-11-03 Ibm Anordnung zum Lagern, Transportieren und Einschleusen von Substraten
JPH04360545A (ja) * 1991-06-07 1992-12-14 Sharp Corp 部品供給装置
JPH081923B2 (ja) * 1991-06-24 1996-01-10 ティーディーケイ株式会社 クリーン搬送方法及び装置
JP3084828B2 (ja) * 1991-09-20 2000-09-04 神鋼電機株式会社 機械式インターフェース装置
JPH05109863A (ja) * 1991-10-17 1993-04-30 Shinko Electric Co Ltd 機械式インターフエース装置
JPH05338728A (ja) * 1992-06-05 1993-12-21 Fujitsu Ltd ウエーハ搬送方法及び装置
JP3162852B2 (ja) * 1993-01-19 2001-05-08 日置電機株式会社 回路基板検査機のマガジンラック供給装置
JPH0714906A (ja) * 1993-06-21 1995-01-17 Shinko Electric Co Ltd 可搬式密閉コンテナの蓋開閉機構
DE4326309C1 (de) * 1993-08-05 1994-09-15 Jenoptik Jena Gmbh Vorrichtung zum Transport von Wafermagazinen

Also Published As

Publication number Publication date
JP2009170945A (ja) 2009-07-30
TW344089B (en) 1998-11-01
KR100271586B1 (ko) 2000-11-15
DE19542646C2 (de) 2003-04-30
KR960035954A (ko) 1996-10-28
DE19542646A1 (de) 1996-10-02

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