TW340961B - Method of forming coated film and the device - Google Patents

Method of forming coated film and the device

Info

Publication number
TW340961B
TW340961B TW086106992A TW86106992A TW340961B TW 340961 B TW340961 B TW 340961B TW 086106992 A TW086106992 A TW 086106992A TW 86106992 A TW86106992 A TW 86106992A TW 340961 B TW340961 B TW 340961B
Authority
TW
Taiwan
Prior art keywords
substrate
photoresist
film
self
turns
Prior art date
Application number
TW086106992A
Other languages
English (en)
Inventor
Masatoshi Shiraishi
Sachio Kiba
Kunie Ogata
Original Assignee
Tokyo Electron Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Co Ltd filed Critical Tokyo Electron Co Ltd
Application granted granted Critical
Publication of TW340961B publication Critical patent/TW340961B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
TW086106992A 1996-05-28 1997-05-23 Method of forming coated film and the device TW340961B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP15617696 1996-05-28
JP26239196A JP3516195B2 (ja) 1996-05-28 1996-09-11 塗布膜形成方法及びその装置

Publications (1)

Publication Number Publication Date
TW340961B true TW340961B (en) 1998-09-21

Family

ID=26483988

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086106992A TW340961B (en) 1996-05-28 1997-05-23 Method of forming coated film and the device

Country Status (6)

Country Link
US (1) US5939130A (zh)
EP (1) EP0810633B1 (zh)
JP (1) JP3516195B2 (zh)
KR (1) KR970077123A (zh)
DE (1) DE69725648T2 (zh)
TW (1) TW340961B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI720488B (zh) * 2018-05-24 2021-03-01 日商Ｔｏｗａ股份有限公司 樹脂成形裝置及樹脂成形品的製造方法

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JP4426024B2 (ja) * 1999-09-02 2010-03-03 東京エレクトロン株式会社 熱処理装置の温度校正方法
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US6270579B1 (en) * 1999-10-29 2001-08-07 Advanced Micro Devices, Inc. Nozzle arm movement for resist development
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US6549822B1 (en) * 2000-07-25 2003-04-15 Advanced Micro Devices, Inc. Method and apparatus for control of multi-cup semiconductor manufacturing tracks
JP3598054B2 (ja) * 2000-11-06 2004-12-08 東京エレクトロン株式会社 塗布膜形成装置
US6560506B2 (en) * 2000-12-04 2003-05-06 Advanced Micro Devices, Inc. Method and apparatus for control for semiconductor processing for reducing effects of environmental effects
US6500755B2 (en) 2000-12-06 2002-12-31 Advanced Micro Devices, Inc. Resist trim process to define small openings in dielectric layers
JP3943828B2 (ja) * 2000-12-08 2007-07-11 東京エレクトロン株式会社 塗布、現像装置及びパターン形成方法
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JP2002373843A (ja) * 2001-06-14 2002-12-26 Nec Corp 塗布装置及び塗布膜厚制御方法
US6680078B2 (en) * 2001-07-11 2004-01-20 Micron Technology, Inc. Method for dispensing flowable substances on microelectronic substrates
KR20030026862A (ko) 2001-09-25 2003-04-03 다이닛뽕스크린 세이조오 가부시키가이샤 기판 처리장치 제어 시스템 및 기판 처리장치
US6800569B2 (en) * 2002-01-30 2004-10-05 Kabushiki Kaisha Toshiba Film forming method, film forming apparatus, pattern forming method, and manufacturing method of semiconductor apparatus
JP3838964B2 (ja) * 2002-03-13 2006-10-25 株式会社リコー 機能性素子基板の製造装置
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JP2004321946A (ja) * 2003-04-24 2004-11-18 Oki Electric Ind Co Ltd 処理装置、及びそれを用いた被処理体の処理方法
KR100568032B1 (ko) * 2003-06-24 2006-04-05 동부아남반도체 주식회사 포토레지스트 코팅불량 감지방법 및 그 검출장치
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US7540922B2 (en) * 2003-11-14 2009-06-02 Sharp Kabushiki Kaisha Thin film forming apparatus
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US7255747B2 (en) 2004-12-22 2007-08-14 Sokudo Co., Ltd. Coat/develop module with independent stations
US7699021B2 (en) 2004-12-22 2010-04-20 Sokudo Co., Ltd. Cluster tool substrate throughput optimization
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US7798764B2 (en) 2005-12-22 2010-09-21 Applied Materials, Inc. Substrate processing sequence in a cartesian robot cluster tool
JP5058449B2 (ja) * 2005-03-31 2012-10-24 芝浦メカトロニクス株式会社 塗布膜の形成方法及び装置
JP2007012782A (ja) * 2005-06-29 2007-01-18 Matsushita Electric Ind Co Ltd 基板処理方法
US7632542B2 (en) * 2005-10-26 2009-12-15 University Of Maryland Method for controlling uniformity of thin films fabricated in processing systems
JP2008210980A (ja) * 2007-02-26 2008-09-11 Toshiba Corp パターン形成方法
EP2128701A1 (en) 2008-05-30 2009-12-02 ASML Netherlands BV Method of determining defects in a substrate and apparatus for exposing a substrate in a lithographic process
JP4748192B2 (ja) * 2008-08-07 2011-08-17 東京エレクトロン株式会社 塗布装置、塗布方法、塗布、現像装置及び記憶媒体
JP2010239013A (ja) * 2009-03-31 2010-10-21 Shibaura Mechatronics Corp 基板処理装置及び基板処理方法
JP5060517B2 (ja) * 2009-06-24 2012-10-31 東京エレクトロン株式会社 インプリントシステム
JP5478173B2 (ja) * 2009-09-18 2014-04-23 株式会社ディスコ レーザー加工装置
JP2011062740A (ja) * 2009-09-18 2011-03-31 Disco Abrasive Syst Ltd レーザー加工装置
JP2014217805A (ja) * 2013-05-08 2014-11-20 株式会社ディスコ 液状樹脂被覆装置
KR101621484B1 (ko) * 2014-04-11 2016-05-17 세메스 주식회사 기판처리장치
JP6299624B2 (ja) * 2015-02-13 2018-03-28 東京エレクトロン株式会社 塗布膜形成方法、塗布膜形成装置及び記憶媒体
TW202137839A (zh) * 2019-12-17 2021-10-01 日商東京威力科創股份有限公司 基板處理方法及基板處理裝置
US11168978B2 (en) * 2020-01-06 2021-11-09 Tokyo Electron Limited Hardware improvements and methods for the analysis of a spinning reflective substrates
CN112040571B (zh) * 2020-08-27 2022-10-21 上海华力集成电路制造有限公司 光刻热板动态温度控制光刻胶膜厚的方法
CN112830686A (zh) * 2021-01-21 2021-05-25 四川虹科创新科技有限公司 一种浮法玻璃表面硫膜控制装置及方法
JP2022124070A (ja) * 2021-02-15 2022-08-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、および、筒状ガードの加工方法
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CN114733663B (zh) * 2022-03-17 2023-04-28 中材锂膜有限公司 一种锂离子电池涂覆膜生产中涂层克重监测装置及方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI720488B (zh) * 2018-05-24 2021-03-01 日商Ｔｏｗａ股份有限公司 樹脂成形裝置及樹脂成形品的製造方法

Also Published As

Publication number Publication date
JP3516195B2 (ja) 2004-04-05
EP0810633B1 (en) 2003-10-22
DE69725648D1 (de) 2003-11-27
JPH1043666A (ja) 1998-02-17
EP0810633A2 (en) 1997-12-03
EP0810633A3 (en) 1998-09-02
DE69725648T2 (de) 2004-08-12
US5939130A (en) 1999-08-17
KR970077123A (ko) 1997-12-12

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