TW334359B - Apparatus and method for treating substrates - Google Patents

Apparatus and method for treating substrates

Info

Publication number
TW334359B
TW334359B TW085114557A TW85114557A TW334359B TW 334359 B TW334359 B TW 334359B TW 085114557 A TW085114557 A TW 085114557A TW 85114557 A TW85114557 A TW 85114557A TW 334359 B TW334359 B TW 334359B
Authority
TW
Taiwan
Prior art keywords
substrate
carrying
posture
treating
forwarded
Prior art date
Application number
TW085114557A
Other languages
English (en)
Inventor
Mitsuaki Yoshitani
Eiichi Wada
Seiichi Mori
Tsuyoshi Tanaka
Yoshihiko Matsushita
Original Assignee
Dai Nippon Scolin Seizo Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP31567595A external-priority patent/JP3384666B2/ja
Priority claimed from JP34461095A external-priority patent/JPH09155307A/ja
Priority claimed from JP3974296A external-priority patent/JP3597627B2/ja
Application filed by Dai Nippon Scolin Seizo Kk filed Critical Dai Nippon Scolin Seizo Kk
Application granted granted Critical
Publication of TW334359B publication Critical patent/TW334359B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/20—Cleaning of moving articles, e.g. of moving webs or of objects on a conveyor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B08B3/022—Cleaning travelling work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/067—Sheet handling, means, e.g. manipulators, devices for turning or tilting sheet glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/02—Controlled or contamination-free environments or clean space conditions

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW085114557A 1995-12-04 1996-11-23 Apparatus and method for treating substrates TW334359B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP31567595A JP3384666B2 (ja) 1995-12-04 1995-12-04 基板処理装置
JP34461095A JPH09155307A (ja) 1995-12-04 1995-12-04 基板処理装置
JP3974296A JP3597627B2 (ja) 1996-02-27 1996-02-27 基板姿勢変更装置および基板姿勢変更方法

Publications (1)

Publication Number Publication Date
TW334359B true TW334359B (en) 1998-06-21

Family

ID=27290256

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085114557A TW334359B (en) 1995-12-04 1996-11-23 Apparatus and method for treating substrates

Country Status (3)

Country Link
US (1) US6021790A (zh)
KR (1) KR100286470B1 (zh)
TW (1) TW334359B (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI419219B (zh) * 2002-11-15 2013-12-11 Ebara Corp 基板處理裝置及基板處理方法
CN110076169A (zh) * 2019-04-08 2019-08-02 深圳市华星光电技术有限公司 一种玻璃基板清洁装置及其清洁方法
TWI686312B (zh) * 2014-09-02 2020-03-01 美商凱特伊夫公司 製造電子產品的薄膜疊層的方法

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DE29915410U1 (de) * 1999-09-02 1999-12-09 Wesero Maschinenbau GmbH, 45549 Sprockhövel Vorrichtung zum Abtragen von Harzrückständen an einem metallischen Pressblech
US7536940B2 (en) * 2001-12-20 2009-05-26 Fujifilm Corporation Clean booth and sheet conveyor device
US6814089B1 (en) * 2003-06-03 2004-11-09 The Material Works, Ltd. Conditioning liquid cleaning and recycling system for sheet metal conditioning apparatus
US7048828B2 (en) * 2003-11-26 2006-05-23 Metso Paper, Inc. Crimper with crimping wheels mounted on linear bearings
KR101149455B1 (ko) * 2004-11-19 2012-05-25 시바우라 메카트로닉스 가부시키가이샤 기판의 처리 장치, 반송 장치 및 처리 방법
US7651306B2 (en) * 2004-12-22 2010-01-26 Applied Materials, Inc. Cartesian robot cluster tool architecture
US7798764B2 (en) * 2005-12-22 2010-09-21 Applied Materials, Inc. Substrate processing sequence in a cartesian robot cluster tool
US7396412B2 (en) * 2004-12-22 2008-07-08 Sokudo Co., Ltd. Coat/develop module with shared dispense
US20060182535A1 (en) * 2004-12-22 2006-08-17 Mike Rice Cartesian robot design
US7699021B2 (en) * 2004-12-22 2010-04-20 Sokudo Co., Ltd. Cluster tool substrate throughput optimization
US7819079B2 (en) * 2004-12-22 2010-10-26 Applied Materials, Inc. Cartesian cluster tool configuration for lithography type processes
US20060241813A1 (en) * 2005-04-22 2006-10-26 Applied Materials, Inc. Optimized cluster tool transfer process and collision avoidance design
KR100743031B1 (ko) * 2005-09-09 2007-07-27 주식회사 탑 엔지니어링 유체 디스펜싱 시스템
ITUD20050193A1 (it) * 2005-11-16 2007-05-17 Internat Steel Co Spa Apparato di movimentazione di piani per camere di lavaggio
KR100660780B1 (ko) * 2005-12-26 2006-12-26 주식회사 디엠에스 평판 디스플레이용 기판 전달 장치
JP4472630B2 (ja) 2005-12-28 2010-06-02 大日本スクリーン製造株式会社 基板処理装置
JP2008091364A (ja) * 2006-09-29 2008-04-17 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
US7694688B2 (en) 2007-01-05 2010-04-13 Applied Materials, Inc. Wet clean system design
GB2459055B (en) * 2007-01-11 2012-05-23 Peter Philip Andrew Lymn Liquid treatment apparatus
US7950407B2 (en) * 2007-02-07 2011-05-31 Applied Materials, Inc. Apparatus for rapid filling of a processing volume
DK176660B1 (da) * 2007-06-15 2009-02-02 Troels Jakobsen Vaskeanlæg for retur- og genbrugsemballager
JP2010538476A (ja) 2007-08-31 2010-12-09 アプライド マテリアルズ インコーポレイテッド 光電池製造ライン
US20100047954A1 (en) * 2007-08-31 2010-02-25 Su Tzay-Fa Jeff Photovoltaic production line
US20090188603A1 (en) * 2008-01-25 2009-07-30 Applied Materials, Inc. Method and apparatus for controlling laminator temperature on a solar cell
DE102008061917B4 (de) * 2008-12-15 2010-11-04 Astrium Gmbh Heißgaskammer
KR20120053319A (ko) * 2010-11-17 2012-05-25 삼성모바일디스플레이주식회사 기판 세정 시스템 및 세정 방법
KR101768655B1 (ko) * 2011-06-20 2017-08-17 주식회사 엘지화학 플로트 유리 세정 시스템용 건조 장치
US20140047735A1 (en) * 2012-08-14 2014-02-20 Shenzhen China Star Optoelectronics Technology Co. Ltd. Cleaning Apparatus for Glass Substrate
KR101705303B1 (ko) * 2012-09-05 2017-02-09 주식회사 엘지화학 유리 기판 이송용 캐리어를 세척하는 장치 및 방법
DE102013202138A1 (de) * 2013-02-08 2014-08-14 Gebr. Schmid Gmbh Vorrichtung zur Substratnassbehandlung und Verwendung
CN104003135A (zh) * 2013-02-21 2014-08-27 上海嘉峥机械有限公司 用于物流自动化输送线的滚筒输送机挡边机构
KR102043848B1 (ko) * 2013-07-29 2019-11-12 엘지디스플레이 주식회사 패널 건조 장치
US9839942B1 (en) 2014-01-16 2017-12-12 Texas Nameplate Company, Inc. System for and method of by-product removal from a metal substrate
CN103776477A (zh) * 2014-01-24 2014-05-07 深圳市华星光电技术有限公司 一种摇摆式传感器组件
DE102014203735B4 (de) 2014-02-28 2023-06-15 Ossberger Gmbh + Co Kg Reinigungssystem zum Reinigen von Werkstücken sowie ein Baukasten eines Reinigungssystems und ein Reinigungsverfahren
KR102338076B1 (ko) * 2014-10-06 2021-12-13 삼성디스플레이 주식회사 기판 처리 장치 및 이를 이용한 기판 처리 방법
DE102016116259A1 (de) 2015-09-11 2017-03-16 Schott Ag Vorrichtung und Verfahren zur Stabilisierung von Scheiben eines sprödharten Materials
US10613036B2 (en) * 2015-10-09 2020-04-07 United Sortation Solutions, Llc Conveying and cleaning system and methods for cleaning and stacking trays and/or layer pads
CN107144120B (zh) * 2017-05-19 2019-06-28 惠科股份有限公司 一种显示面板干燥装置
CN107934547A (zh) * 2017-12-21 2018-04-20 东莞科耀机电设备有限公司 一种pcb板材输送机
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CN108380577A (zh) * 2018-05-11 2018-08-10 王丽 一种平面玻璃板加工用双面清洗装置
CN109530296B (zh) * 2018-09-10 2022-03-22 惠科股份有限公司 一种清洗方法和清洗装置
IT201900002653A1 (it) * 2019-02-25 2020-08-25 Cefla Soc Cooperativa Apparato e metodo per l’essiccazione/polimerizzazione di prodotti chimici
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CN110479662B (zh) * 2019-09-24 2020-12-29 龙南新晶钛业有限公司 一种高效钛锭清洗装置
CN110813818B (zh) * 2019-10-16 2022-03-11 南阳师范学院 一种活塞杆表面缺陷检测系统
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI419219B (zh) * 2002-11-15 2013-12-11 Ebara Corp 基板處理裝置及基板處理方法
TWI686312B (zh) * 2014-09-02 2020-03-01 美商凱特伊夫公司 製造電子產品的薄膜疊層的方法
CN110076169A (zh) * 2019-04-08 2019-08-02 深圳市华星光电技术有限公司 一种玻璃基板清洁装置及其清洁方法

Also Published As

Publication number Publication date
KR970058408A (ko) 1997-07-31
KR100286470B1 (ko) 2001-04-16
US6021790A (en) 2000-02-08

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MM4A Annulment or lapse of patent due to non-payment of fees