TW332962B - The manufacture and package of semiconductor device - Google Patents

The manufacture and package of semiconductor device

Info

Publication number
TW332962B
TW332962B TW085113595A TW85113595A TW332962B TW 332962 B TW332962 B TW 332962B TW 085113595 A TW085113595 A TW 085113595A TW 85113595 A TW85113595 A TW 85113595A TW 332962 B TW332962 B TW 332962B
Authority
TW
Taiwan
Prior art keywords
package
manufacture
semiconductor device
layer
witing
Prior art date
Application number
TW085113595A
Other languages
English (en)
Inventor
Jun Shibata
Masatoshi Yasunaga
Katsunori Asai
Tomoaki Hashimoto
Hiroshi Seki
Masaki Watanabe
Original Assignee
Mitsubishi Electric Corp
Reiden Semiconductor System Negineering Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp, Reiden Semiconductor System Negineering Kk filed Critical Mitsubishi Electric Corp
Application granted granted Critical
Publication of TW332962B publication Critical patent/TW332962B/zh

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Classifications

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    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
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    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
TW085113595A 1996-03-28 1996-11-07 The manufacture and package of semiconductor device TW332962B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8074571A JPH09266268A (ja) 1996-03-28 1996-03-28 半導体装置の製造方法および半導体装置のパッケージ

Publications (1)

Publication Number Publication Date
TW332962B true TW332962B (en) 1998-06-01

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TW085113595A TW332962B (en) 1996-03-28 1996-11-07 The manufacture and package of semiconductor device

Country Status (6)

Country Link
US (2) US6005289A (zh)
JP (1) JPH09266268A (zh)
KR (1) KR100213857B1 (zh)
CN (1) CN1138302C (zh)
DE (1) DE19650296A1 (zh)
TW (1) TW332962B (zh)

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TWI785489B (zh) * 2021-01-25 2022-12-01 大陸商碁鼎科技秦皇島有限公司 封裝電路結構及其製作方法

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JP6296687B2 (ja) 2012-04-27 2018-03-20 キヤノン株式会社 電子部品、電子モジュールおよびこれらの製造方法。
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TWI608770B (zh) * 2015-08-19 2017-12-11 鵬鼎科技股份有限公司 柔性電路板及其製作方法
TWI785489B (zh) * 2021-01-25 2022-12-01 大陸商碁鼎科技秦皇島有限公司 封裝電路結構及其製作方法
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Also Published As

Publication number Publication date
DE19650296A1 (de) 1997-10-02
US6256875B1 (en) 2001-07-10
KR100213857B1 (ko) 1999-08-02
US6005289A (en) 1999-12-21
CN1160984A (zh) 1997-10-01
CN1138302C (zh) 2004-02-11
KR970067822A (ko) 1997-10-13
JPH09266268A (ja) 1997-10-07

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