TW330177B - Apparatus for resin molding electronic parts - Google Patents

Apparatus for resin molding electronic parts

Info

Publication number
TW330177B
TW330177B TW085108199A TW85108199A TW330177B TW 330177 B TW330177 B TW 330177B TW 085108199 A TW085108199 A TW 085108199A TW 85108199 A TW85108199 A TW 85108199A TW 330177 B TW330177 B TW 330177B
Authority
TW
Taiwan
Prior art keywords
mold
stationary
movable
space
resin
Prior art date
Application number
TW085108199A
Other languages
English (en)
Inventor
Keishi Maeda
Yoshihisa Kawamoto
Original Assignee
Towa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Kk filed Critical Towa Kk
Application granted granted Critical
Publication of TW330177B publication Critical patent/TW330177B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/1753—Cleaning or purging, e.g. of the injection unit
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/34—Moulds having venting means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S425/00—Plastic article or earthenware shaping or treating: apparatus
    • Y10S425/047—Seal ring
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S425/00—Plastic article or earthenware shaping or treating: apparatus
    • Y10S425/06—Vacuum
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S425/00—Plastic article or earthenware shaping or treating: apparatus
    • Y10S425/228—Injection plunger or ram: transfer molding type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S425/00—Plastic article or earthenware shaping or treating: apparatus
    • Y10S425/812—Venting

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
TW085108199A 1995-10-30 1996-07-06 Apparatus for resin molding electronic parts TW330177B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30691095A JP3566426B2 (ja) 1995-10-30 1995-10-30 電子部品の樹脂成形装置

Publications (1)

Publication Number Publication Date
TW330177B true TW330177B (en) 1998-04-21

Family

ID=17962750

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085108199A TW330177B (en) 1995-10-30 1996-07-06 Apparatus for resin molding electronic parts

Country Status (8)

Country Link
US (1) US5750154A (zh)
EP (2) EP0771636B1 (zh)
JP (1) JP3566426B2 (zh)
KR (1) KR100187536B1 (zh)
DE (1) DE69626736T2 (zh)
MY (1) MY111944A (zh)
SG (1) SG90015A1 (zh)
TW (1) TW330177B (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100219577B1 (ko) * 1997-06-27 1999-09-01 한효용 반도체칩 패키지 성형장치
JP2001129833A (ja) * 1999-11-05 2001-05-15 Miyagi Oki Electric Co Ltd 成形金型及び半導体装置の製造方法
US6527538B1 (en) * 2000-04-26 2003-03-04 Wea Manufacturing Inc. Apparatus for vacuum assisted venting
JP2002043343A (ja) * 2000-07-25 2002-02-08 Mitsubishi Electric Corp 半導体装置の樹脂封止金型及び半導体装置の樹脂封止方法、並びに樹脂封止半導体装置の離型方法
JP4817818B2 (ja) * 2005-11-29 2011-11-16 Ｔｏｗａ株式会社 樹脂封止装置及びチェイスユニットの取り出し方法
JP2007251094A (ja) * 2006-03-20 2007-09-27 Towa Corp 半導体チップの樹脂封止成形装置
JP5086595B2 (ja) * 2006-10-03 2012-11-28 住友重機械工業株式会社 成形用金型
JP5052214B2 (ja) * 2007-06-06 2012-10-17 住友重機械工業株式会社 樹脂封止金型
JP5053946B2 (ja) * 2008-07-11 2012-10-24 株式会社デンソー 金型清掃補助装置
JP5562289B2 (ja) * 2011-05-27 2014-07-30 Ｔｏｗａ株式会社 樹脂成形用型の交換方法と交換機構及び樹脂成形装置
CN113787670B (zh) * 2021-11-18 2022-03-22 佛山市顺德区致能精密模具有限公司 一种勺子通用型自动注塑成型生产线

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1052889A (zh) * 1900-01-01
GB1603845A (en) * 1977-08-24 1981-12-02 British Industrial Plastics Compression moulding machines
JPS5868940A (ja) * 1981-10-20 1983-04-25 Oki Electric Ind Co Ltd 樹脂封止型半導体のトランスフア成形装置
CH658810A5 (de) * 1982-08-25 1986-12-15 Bucher Guyer Ag Masch Spritzgiessmaschine.
JPS60251633A (ja) * 1984-05-28 1985-12-12 Michio Osada トランスフア−モ−ルド成形方法及びその樹脂タブレツトの加圧装置
JPS63149121A (ja) * 1986-12-15 1988-06-21 Yamaha Motor Co Ltd 熱硬化性樹脂の圧縮成形用金型
JPH0687470B2 (ja) * 1987-08-25 1994-11-02 三菱電機株式会社 半導体装置の樹脂封止装置
JP2622773B2 (ja) * 1990-07-25 1997-06-18 トーワ 株式会社 電子部品の樹脂封止成形方法
US5236636A (en) * 1991-10-07 1993-08-17 Ford Motor Company In-mold plasma treatment
US5196206A (en) * 1991-11-26 1993-03-23 Scantland Industries Inc. Vacuum heat shield
JP2936929B2 (ja) * 1992-12-22 1999-08-23 豊田合成株式会社 真空箱付き成形装置
JP2524955B2 (ja) * 1993-04-22 1996-08-14 トーワ株式会社 電子部品の樹脂封止成形方法及び装置
JP3423766B2 (ja) * 1994-03-11 2003-07-07 Ｔｏｗａ株式会社 電子部品の樹脂封止成形方法及び金型装置
JPH0811152A (ja) * 1994-06-29 1996-01-16 Towa Kk 電子部品の樹脂封止成形用金型装置
US5518385A (en) * 1994-11-09 1996-05-21 United Technologies Corporation Apparatus for resin transfer molding

Also Published As

Publication number Publication date
EP0771636A2 (en) 1997-05-07
EP1134064A3 (en) 2004-03-03
SG90015A1 (en) 2002-07-23
KR100187536B1 (ko) 1999-06-01
EP0771636B1 (en) 2003-03-19
DE69626736T2 (de) 2003-11-20
JP3566426B2 (ja) 2004-09-15
EP0771636A3 (en) 1999-08-18
DE69626736D1 (de) 2003-04-24
MY111944A (en) 2001-02-28
EP1134064A2 (en) 2001-09-19
US5750154A (en) 1998-05-12
JPH09123205A (ja) 1997-05-13

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees