TW327643B - Epoxy resin composition the invention relates to an epoxy resin composition comprising an epoxy resin and a curing agent, which can be used to seal a semiconductor device with excellent moisture resistance. - Google Patents

Epoxy resin composition the invention relates to an epoxy resin composition comprising an epoxy resin and a curing agent, which can be used to seal a semiconductor device with excellent moisture resistance.

Info

Publication number
TW327643B
TW327643B TW085104950A TW85104950A TW327643B TW 327643 B TW327643 B TW 327643B TW 085104950 A TW085104950 A TW 085104950A TW 85104950 A TW85104950 A TW 85104950A TW 327643 B TW327643 B TW 327643B
Authority
TW
Taiwan
Prior art keywords
epoxy resin
resin composition
curing agent
silica
inorganic filler
Prior art date
Application number
TW085104950A
Other languages
English (en)
Inventor
Jundo Tokunaga
Taishi Sawamura
Masayuki Tanaka
Original Assignee
Toray Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries filed Critical Toray Industries
Application granted granted Critical
Publication of TW327643B publication Critical patent/TW327643B/zh

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW085104950A 1995-01-05 1996-04-25 Epoxy resin composition the invention relates to an epoxy resin composition comprising an epoxy resin and a curing agent, which can be used to seal a semiconductor device with excellent moisture resistance. TW327643B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP16395 1995-01-05
JP34217195A JP3582745B2 (ja) 1995-01-05 1995-12-28 エポキシ樹脂組成物、精密部品および半導体装置

Publications (1)

Publication Number Publication Date
TW327643B true TW327643B (en) 1998-03-01

Family

ID=33436357

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085104950A TW327643B (en) 1995-01-05 1996-04-25 Epoxy resin composition the invention relates to an epoxy resin composition comprising an epoxy resin and a curing agent, which can be used to seal a semiconductor device with excellent moisture resistance.

Country Status (2)

Country Link
JP (1) JP3582745B2 (zh)
TW (1) TW327643B (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1089407A (ja) * 1996-09-17 1998-04-07 Sumitomo Rubber Ind Ltd 免震構造体
JP5070692B2 (ja) * 2005-10-28 2012-11-14 住友ベークライト株式会社 半導体封止用エポキシ樹脂組成物および半導体装置
JP5400267B2 (ja) * 2005-12-13 2014-01-29 日立化成株式会社 封止用エポキシ樹脂組成物及び電子部品装置
JP6759575B2 (ja) * 2015-12-17 2020-09-23 住友ベークライト株式会社 高電圧保護部材形成用樹脂組成物、半導体装置および電子部品

Also Published As

Publication number Publication date
JPH08239450A (ja) 1996-09-17
JP3582745B2 (ja) 2004-10-27

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