TW327643B - Epoxy resin composition the invention relates to an epoxy resin composition comprising an epoxy resin and a curing agent, which can be used to seal a semiconductor device with excellent moisture resistance. - Google Patents
Epoxy resin composition the invention relates to an epoxy resin composition comprising an epoxy resin and a curing agent, which can be used to seal a semiconductor device with excellent moisture resistance.Info
- Publication number
- TW327643B TW327643B TW085104950A TW85104950A TW327643B TW 327643 B TW327643 B TW 327643B TW 085104950 A TW085104950 A TW 085104950A TW 85104950 A TW85104950 A TW 85104950A TW 327643 B TW327643 B TW 327643B
- Authority
- TW
- Taiwan
- Prior art keywords
- epoxy resin
- resin composition
- curing agent
- silica
- inorganic filler
- Prior art date
Links
Landscapes
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16395 | 1995-01-05 | ||
JP34217195A JP3582745B2 (ja) | 1995-01-05 | 1995-12-28 | エポキシ樹脂組成物、精密部品および半導体装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW327643B true TW327643B (en) | 1998-03-01 |
Family
ID=33436357
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW085104950A TW327643B (en) | 1995-01-05 | 1996-04-25 | Epoxy resin composition the invention relates to an epoxy resin composition comprising an epoxy resin and a curing agent, which can be used to seal a semiconductor device with excellent moisture resistance. |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP3582745B2 (zh) |
TW (1) | TW327643B (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1089407A (ja) * | 1996-09-17 | 1998-04-07 | Sumitomo Rubber Ind Ltd | 免震構造体 |
JP5070692B2 (ja) * | 2005-10-28 | 2012-11-14 | 住友ベークライト株式会社 | 半導体封止用エポキシ樹脂組成物および半導体装置 |
JP5400267B2 (ja) * | 2005-12-13 | 2014-01-29 | 日立化成株式会社 | 封止用エポキシ樹脂組成物及び電子部品装置 |
JP6759575B2 (ja) * | 2015-12-17 | 2020-09-23 | 住友ベークライト株式会社 | 高電圧保護部材形成用樹脂組成物、半導体装置および電子部品 |
-
1995
- 1995-12-28 JP JP34217195A patent/JP3582745B2/ja not_active Expired - Fee Related
-
1996
- 1996-04-25 TW TW085104950A patent/TW327643B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP3582745B2 (ja) | 2004-10-27 |
JPH08239450A (ja) | 1996-09-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK4A | Expiration of patent term of an invention patent |