TW300318B - - Google Patents
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- Publication number
- TW300318B TW300318B TW85103834A TW85103834A TW300318B TW 300318 B TW300318 B TW 300318B TW 85103834 A TW85103834 A TW 85103834A TW 85103834 A TW85103834 A TW 85103834A TW 300318 B TW300318 B TW 300318B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- active
- grinding
- active substrate
- substrates
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims description 101
- 235000012431 wafers Nutrition 0.000 claims description 35
- 238000000227 grinding Methods 0.000 claims description 21
- 239000004065 semiconductor Substances 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 17
- 238000005530 etching Methods 0.000 claims description 15
- 238000004519 manufacturing process Methods 0.000 claims description 14
- 238000012545 processing Methods 0.000 claims description 14
- 238000005498 polishing Methods 0.000 claims description 10
- 230000002093 peripheral effect Effects 0.000 claims description 5
- 238000003475 lamination Methods 0.000 claims 4
- 238000007517 polishing process Methods 0.000 claims 1
- 239000010408 film Substances 0.000 description 16
- 230000000694 effects Effects 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 231100000989 no adverse effect Toxicity 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Landscapes
- Mechanical Treatment Of Semiconductor (AREA)
- Weting (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10990895A JP3553196B2 (ja) | 1995-03-29 | 1995-03-29 | Ｓｏｉ基板の製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW300318B true TW300318B (enrdf_load_stackoverflow) | 1997-03-11 |
Family
ID=14522207
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW85103834A TW300318B (enrdf_load_stackoverflow) | 1995-03-29 | 1996-04-02 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP3553196B2 (enrdf_load_stackoverflow) |
| TW (1) | TW300318B (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8035962B2 (en) | 2010-03-03 | 2011-10-11 | Antec, Inc. | Computer hot-plug structure |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0964321A (ja) * | 1995-08-24 | 1997-03-07 | Komatsu Electron Metals Co Ltd | Ｓｏｉ基板の製造方法 |
| US6090688A (en) * | 1996-11-15 | 2000-07-18 | Komatsu Electronic Metals Co., Ltd. | Method for fabricating an SOI substrate |
| JP3672436B2 (ja) | 1998-05-19 | 2005-07-20 | シャープ株式会社 | 太陽電池セルの製造方法 |
| JP3944087B2 (ja) | 2003-01-21 | 2007-07-11 | 株式会社東芝 | 素子形成用基板の製造方法 |
| WO2010059556A1 (en) * | 2008-11-19 | 2010-05-27 | Memc Electronic Materials, Inc. | Method and system for stripping the edge of a semiconductor wafer |
| JP7187115B2 (ja) * | 2018-12-04 | 2022-12-12 | 株式会社ディスコ | ウェーハの加工方法 |
-
1995
- 1995-03-29 JP JP10990895A patent/JP3553196B2/ja not_active Expired - Lifetime
-
1996
- 1996-04-02 TW TW85103834A patent/TW300318B/zh active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8035962B2 (en) | 2010-03-03 | 2011-10-11 | Antec, Inc. | Computer hot-plug structure |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3553196B2 (ja) | 2004-08-11 |
| JPH08274286A (ja) | 1996-10-18 |
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