TW291597B - - Google Patents
Info
- Publication number
- TW291597B TW291597B TW084103943A TW84103943A TW291597B TW 291597 B TW291597 B TW 291597B TW 084103943 A TW084103943 A TW 084103943A TW 84103943 A TW84103943 A TW 84103943A TW 291597 B TW291597 B TW 291597B
- Authority
- TW
- Taiwan
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/031—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
- H10D30/0312—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes
- H10D30/0316—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes of lateral bottom-gate TFTs comprising only a single gate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/031—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
- H10D30/0321—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] comprising silicon, e.g. amorphous silicon or polysilicon
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Thin Film Transistor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8422994 | 1994-04-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW291597B true TW291597B (enExample) | 1996-11-21 |
Family
ID=13824652
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW084103943A TW291597B (enExample) | 1994-04-22 | 1995-04-21 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US5561074A (enExample) |
| EP (1) | EP0678907B1 (enExample) |
| KR (1) | KR0180323B1 (enExample) |
| DE (1) | DE69525558T2 (enExample) |
| TW (1) | TW291597B (enExample) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2833545B2 (ja) * | 1995-03-06 | 1998-12-09 | 日本電気株式会社 | 半導体装置の製造方法 |
| JP3082679B2 (ja) * | 1996-08-29 | 2000-08-28 | 日本電気株式会社 | 薄膜トランジスタおよびその製造方法 |
| WO1998057506A1 (en) * | 1997-06-12 | 1998-12-17 | Northern Telecom Limited | Directory service based on geographic location of a mobile telecommunications unit |
| JP2001308339A (ja) | 2000-02-18 | 2001-11-02 | Sharp Corp | 薄膜トランジスタ |
| JP4118484B2 (ja) | 2000-03-06 | 2008-07-16 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP2001257350A (ja) | 2000-03-08 | 2001-09-21 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
| JP4118485B2 (ja) | 2000-03-13 | 2008-07-16 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP4700160B2 (ja) | 2000-03-13 | 2011-06-15 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP4683688B2 (ja) | 2000-03-16 | 2011-05-18 | 株式会社半導体エネルギー研究所 | 液晶表示装置の作製方法 |
| JP4393662B2 (ja) | 2000-03-17 | 2010-01-06 | 株式会社半導体エネルギー研究所 | 液晶表示装置の作製方法 |
| JP4785229B2 (ja) | 2000-05-09 | 2011-10-05 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US7071037B2 (en) | 2001-03-06 | 2006-07-04 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| CN100477129C (zh) * | 2006-02-08 | 2009-04-08 | 财团法人工业技术研究院 | 薄膜晶体管、有机电致发光显示元件及其制造方法 |
| KR101576813B1 (ko) * | 2007-08-17 | 2015-12-11 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시 장치 |
| WO2009060922A1 (en) * | 2007-11-05 | 2009-05-14 | Semiconductor Energy Laboratory Co., Ltd. | Thin film transistor and display device having the thin film transistor |
| TWI535037B (zh) | 2008-11-07 | 2016-05-21 | 半導體能源研究所股份有限公司 | 半導體裝置和其製造方法 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61237420A (ja) * | 1985-04-13 | 1986-10-22 | Oki Electric Ind Co Ltd | P型アモルフアスシリコン薄膜の製造方法 |
| US4882295A (en) * | 1985-07-26 | 1989-11-21 | Energy Conversion Devices, Inc. | Method of making a double injection field effect transistor |
| US5270224A (en) * | 1988-03-11 | 1993-12-14 | Fujitsu Limited | Method of manufacturing a semiconductor device having a region doped to a level exceeding the solubility limit |
| JPH01241175A (ja) * | 1988-03-23 | 1989-09-26 | Seikosha Co Ltd | 非晶質シリコン薄膜トランジスタの製造方法 |
| US5053354A (en) * | 1988-05-30 | 1991-10-01 | Seikosha Co., Ltd. | Method of fabricating a reverse staggered type silicon thin film transistor |
| JPH01302769A (ja) * | 1988-05-30 | 1989-12-06 | Seikosha Co Ltd | 逆スタガー型シリコン薄膜トランジスタの製造方法 |
| JPH07114285B2 (ja) * | 1988-12-16 | 1995-12-06 | 日本電気株式会社 | 薄膜トランジスタの製造方法 |
| US5109260A (en) * | 1989-07-10 | 1992-04-28 | Seikosha Co., Ltd. | Silicon thin film transistor and method for producing the same |
| EP0417457A3 (en) * | 1989-08-11 | 1991-07-03 | Seiko Instruments Inc. | Method of producing field effect transistor |
| JPH04505833A (ja) * | 1990-10-05 | 1992-10-08 | ゼネラル・エレクトリック・カンパニイ | 基準構造の地形の伝搬地形による装置の自己アライメント |
| JPH04321275A (ja) * | 1991-04-19 | 1992-11-11 | Nec Corp | 薄膜トランジスタ |
| JPH04367277A (ja) * | 1991-06-14 | 1992-12-18 | Nec Corp | 薄膜トランジスタおよびその製造方法 |
| JPH04367276A (ja) * | 1991-06-14 | 1992-12-18 | Nec Corp | 薄膜トランジスタおよびその製造方法 |
| JPH0583197A (ja) * | 1991-09-21 | 1993-04-02 | Alpine Electron Inc | デイジタルオーデイオ装置 |
-
1995
- 1995-04-20 DE DE69525558T patent/DE69525558T2/de not_active Expired - Lifetime
- 1995-04-20 US US08/425,806 patent/US5561074A/en not_active Expired - Lifetime
- 1995-04-20 EP EP95105936A patent/EP0678907B1/en not_active Expired - Lifetime
- 1995-04-21 KR KR1019950009475A patent/KR0180323B1/ko not_active Expired - Fee Related
- 1995-04-21 TW TW084103943A patent/TW291597B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| EP0678907A3 (en) | 1997-08-20 |
| KR0180323B1 (ko) | 1999-04-15 |
| DE69525558T2 (de) | 2002-08-22 |
| DE69525558D1 (de) | 2002-04-04 |
| EP0678907A2 (en) | 1995-10-25 |
| KR950030282A (ko) | 1995-11-24 |
| US5561074A (en) | 1996-10-01 |
| EP0678907B1 (en) | 2002-02-27 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |