TW291597B - - Google Patents

Info

Publication number
TW291597B
TW291597B TW084103943A TW84103943A TW291597B TW 291597 B TW291597 B TW 291597B TW 084103943 A TW084103943 A TW 084103943A TW 84103943 A TW84103943 A TW 84103943A TW 291597 B TW291597 B TW 291597B
Authority
TW
Taiwan
Application number
TW084103943A
Other languages
Chinese (zh)
Original Assignee
Nippon Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co filed Critical Nippon Electric Co
Application granted granted Critical
Publication of TW291597B publication Critical patent/TW291597B/zh

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/01Manufacture or treatment
    • H10D30/021Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/031Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
    • H10D30/0312Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes
    • H10D30/0316Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes of lateral bottom-gate TFTs comprising only a single gate
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/01Manufacture or treatment
    • H10D30/021Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/031Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
    • H10D30/0321Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] comprising silicon, e.g. amorphous silicon or polysilicon
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thin Film Transistor (AREA)
TW084103943A 1994-04-22 1995-04-21 TW291597B (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8422994 1994-04-22

Publications (1)

Publication Number Publication Date
TW291597B true TW291597B (enExample) 1996-11-21

Family

ID=13824652

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084103943A TW291597B (enExample) 1994-04-22 1995-04-21

Country Status (5)

Country Link
US (1) US5561074A (enExample)
EP (1) EP0678907B1 (enExample)
KR (1) KR0180323B1 (enExample)
DE (1) DE69525558T2 (enExample)
TW (1) TW291597B (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2833545B2 (ja) * 1995-03-06 1998-12-09 日本電気株式会社 半導体装置の製造方法
JP3082679B2 (ja) * 1996-08-29 2000-08-28 日本電気株式会社 薄膜トランジスタおよびその製造方法
WO1998057506A1 (en) * 1997-06-12 1998-12-17 Northern Telecom Limited Directory service based on geographic location of a mobile telecommunications unit
JP2001308339A (ja) 2000-02-18 2001-11-02 Sharp Corp 薄膜トランジスタ
JP4118484B2 (ja) 2000-03-06 2008-07-16 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP2001257350A (ja) 2000-03-08 2001-09-21 Semiconductor Energy Lab Co Ltd 半導体装置およびその作製方法
JP4118485B2 (ja) 2000-03-13 2008-07-16 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP4700160B2 (ja) 2000-03-13 2011-06-15 株式会社半導体エネルギー研究所 半導体装置
JP4683688B2 (ja) 2000-03-16 2011-05-18 株式会社半導体エネルギー研究所 液晶表示装置の作製方法
JP4393662B2 (ja) 2000-03-17 2010-01-06 株式会社半導体エネルギー研究所 液晶表示装置の作製方法
JP4785229B2 (ja) 2000-05-09 2011-10-05 株式会社半導体エネルギー研究所 半導体装置の作製方法
US7071037B2 (en) 2001-03-06 2006-07-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
CN100477129C (zh) * 2006-02-08 2009-04-08 财团法人工业技术研究院 薄膜晶体管、有机电致发光显示元件及其制造方法
KR101576813B1 (ko) * 2007-08-17 2015-12-11 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치
WO2009060922A1 (en) * 2007-11-05 2009-05-14 Semiconductor Energy Laboratory Co., Ltd. Thin film transistor and display device having the thin film transistor
TWI535037B (zh) 2008-11-07 2016-05-21 半導體能源研究所股份有限公司 半導體裝置和其製造方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61237420A (ja) * 1985-04-13 1986-10-22 Oki Electric Ind Co Ltd P型アモルフアスシリコン薄膜の製造方法
US4882295A (en) * 1985-07-26 1989-11-21 Energy Conversion Devices, Inc. Method of making a double injection field effect transistor
US5270224A (en) * 1988-03-11 1993-12-14 Fujitsu Limited Method of manufacturing a semiconductor device having a region doped to a level exceeding the solubility limit
JPH01241175A (ja) * 1988-03-23 1989-09-26 Seikosha Co Ltd 非晶質シリコン薄膜トランジスタの製造方法
US5053354A (en) * 1988-05-30 1991-10-01 Seikosha Co., Ltd. Method of fabricating a reverse staggered type silicon thin film transistor
JPH01302769A (ja) * 1988-05-30 1989-12-06 Seikosha Co Ltd 逆スタガー型シリコン薄膜トランジスタの製造方法
JPH07114285B2 (ja) * 1988-12-16 1995-12-06 日本電気株式会社 薄膜トランジスタの製造方法
US5109260A (en) * 1989-07-10 1992-04-28 Seikosha Co., Ltd. Silicon thin film transistor and method for producing the same
EP0417457A3 (en) * 1989-08-11 1991-07-03 Seiko Instruments Inc. Method of producing field effect transistor
JPH04505833A (ja) * 1990-10-05 1992-10-08 ゼネラル・エレクトリック・カンパニイ 基準構造の地形の伝搬地形による装置の自己アライメント
JPH04321275A (ja) * 1991-04-19 1992-11-11 Nec Corp 薄膜トランジスタ
JPH04367277A (ja) * 1991-06-14 1992-12-18 Nec Corp 薄膜トランジスタおよびその製造方法
JPH04367276A (ja) * 1991-06-14 1992-12-18 Nec Corp 薄膜トランジスタおよびその製造方法
JPH0583197A (ja) * 1991-09-21 1993-04-02 Alpine Electron Inc デイジタルオーデイオ装置

Also Published As

Publication number Publication date
EP0678907A3 (en) 1997-08-20
KR0180323B1 (ko) 1999-04-15
DE69525558T2 (de) 2002-08-22
DE69525558D1 (de) 2002-04-04
EP0678907A2 (en) 1995-10-25
KR950030282A (ko) 1995-11-24
US5561074A (en) 1996-10-01
EP0678907B1 (en) 2002-02-27

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees