TW272311B - - Google Patents

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Publication number
TW272311B
TW272311B TW083109384A TW83109384A TW272311B TW 272311 B TW272311 B TW 272311B TW 083109384 A TW083109384 A TW 083109384A TW 83109384 A TW83109384 A TW 83109384A TW 272311 B TW272311 B TW 272311B
Authority
TW
Taiwan
Prior art keywords
plastic
metal
substrate
sheet
cavity
Prior art date
Application number
TW083109384A
Other languages
English (en)
Chinese (zh)
Original Assignee
At & T Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by At & T Corp filed Critical At & T Corp
Application granted granted Critical
Publication of TW272311B publication Critical patent/TW272311B/zh

Links

Classifications

    • H10W74/117—
    • H10W76/47—
    • H10W70/682—
    • H10W70/685—
    • H10W72/5522—
    • H10W72/884—
    • H10W74/00—
    • H10W90/734—
    • H10W90/754—

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
TW083109384A 1994-01-12 1994-10-11 TW272311B (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US18024894A 1994-01-12 1994-01-12

Publications (1)

Publication Number Publication Date
TW272311B true TW272311B (enExample) 1996-03-11

Family

ID=22659765

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083109384A TW272311B (enExample) 1994-01-12 1994-10-11

Country Status (7)

Country Link
US (1) US5926696A (enExample)
EP (1) EP0664562A1 (enExample)
JP (1) JP2981141B2 (enExample)
KR (1) KR950034711A (enExample)
CA (1) CA2134257C (enExample)
SG (1) SG52230A1 (enExample)
TW (1) TW272311B (enExample)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6465743B1 (en) * 1994-12-05 2002-10-15 Motorola, Inc. Multi-strand substrate for ball-grid array assemblies and method
JPH09213829A (ja) * 1995-06-06 1997-08-15 Circuit Components Inc Ｂｇａ型ｉ／ｏフォーマットを使用した高性能デジタルｉｃパッケージ及びバイメタル充填バイア技術による単層セラミックス基板
KR100386061B1 (ko) 1995-10-24 2003-08-21 오끼 덴끼 고오교 가부시끼가이샤 크랙을방지하기위한개량된구조를가지는반도체장치및리이드프레임
US5852870A (en) * 1996-04-24 1998-12-29 Amkor Technology, Inc. Method of making grid array assembly
US5859475A (en) * 1996-04-24 1999-01-12 Amkor Technology, Inc. Carrier strip and molded flex circuit ball grid array
US5956601A (en) * 1996-04-25 1999-09-21 Kabushiki Kaisha Toshiba Method of mounting a plurality of semiconductor devices in corresponding supporters
US5776798A (en) * 1996-09-04 1998-07-07 Motorola, Inc. Semiconductor package and method thereof
KR100214544B1 (ko) * 1996-12-28 1999-08-02 구본준 볼 그리드 어레이 반도체 패키지
EP0860876A3 (de) * 1997-02-21 1999-09-22 DaimlerChrysler AG Anordnung und Verfahren zur Herstellung von CSP-Gehäusen für elektrische Bauteile
US6172413B1 (en) * 1997-10-09 2001-01-09 Micron Technology, Inc. Chip leads constrained in dielectric media
US5919329A (en) * 1997-10-14 1999-07-06 Gore Enterprise Holdings, Inc. Method for assembling an integrated circuit chip package having at least one semiconductor device
US6380001B1 (en) * 1998-01-29 2002-04-30 Vlsi Technology, Inc. Flexible pin count package for semiconductor device
US6232666B1 (en) * 1998-12-04 2001-05-15 Mciron Technology, Inc. Interconnect for packaging semiconductor dice and fabricating BGA packages
US6034425A (en) * 1999-03-17 2000-03-07 Chipmos Technologies Inc. Flat multiple-chip module micro ball grid array packaging
US6288905B1 (en) * 1999-04-15 2001-09-11 Amerasia International Technology Inc. Contact module, as for a smart card, and method for making same
US6734535B1 (en) * 1999-05-14 2004-05-11 Seiko Epson Corporation Semiconductor device, method of manufacture thereof, circuit board, and electronic instrument
US6580159B1 (en) * 1999-11-05 2003-06-17 Amkor Technology, Inc. Integrated circuit device packages and substrates for making the packages
JP2001210755A (ja) * 2000-01-28 2001-08-03 Nec Corp 半導体装置用基板および半導体装置の製造方法
DE10014380A1 (de) * 2000-03-23 2001-10-04 Infineon Technologies Ag Vorrichtung zum Verpacken von elektronischen Bauteilen
KR20030021405A (ko) * 2001-09-06 2003-03-15 엘지이노텍 주식회사 에어 캐비티를 가지는 플라스틱 패키지
US7961989B2 (en) * 2001-10-23 2011-06-14 Tessera North America, Inc. Optical chassis, camera having an optical chassis, and associated methods
US7224856B2 (en) 2001-10-23 2007-05-29 Digital Optics Corporation Wafer based optical chassis and associated methods
EP1611468B1 (en) * 2003-03-26 2008-05-21 Digital Optics Corporation Package for optoelectronic device on wafer level
US6940724B2 (en) * 2003-04-24 2005-09-06 Power-One Limited DC-DC converter implemented in a land grid array package
US7575955B2 (en) * 2004-01-06 2009-08-18 Ismat Corporation Method for making electronic packages
CN100377327C (zh) * 2004-01-09 2008-03-26 威宇科技测试封装有限公司 对球栅阵列封装的集成电路的重新植球方法
US6888360B1 (en) * 2004-02-20 2005-05-03 Research In Motion Limited Surface mount technology evaluation board having varied board pad characteristics
US7172926B2 (en) * 2004-04-21 2007-02-06 Advanced Semiconductor Engineering, Inc. Method for manufacturing an adhesive substrate with a die-cavity sidewall
WO2006006048A1 (en) * 2004-07-08 2006-01-19 Costruzioni Strumenti Oftalmici C.S.O. S.R.L. Reflection microscope for examination of the corneal endothelium and method of operating same
US7344915B2 (en) * 2005-03-14 2008-03-18 Advanced Semiconductor Engineering, Inc. Method for manufacturing a semiconductor package with a laminated chip cavity
US20070164428A1 (en) * 2006-01-18 2007-07-19 Alan Elbanhawy High power module with open frame package
KR100677184B1 (ko) * 2006-02-10 2007-02-02 삼성전기주식회사 캐비티가 형성된 기판 제조 방법
KR101409048B1 (ko) * 2007-02-16 2014-06-18 스미토모 베이클리트 컴퍼니 리미티드 회로 기판의 제조 방법, 반도체 제조 장치, 회로 기판 및 반도체 장치
KR20090061996A (ko) * 2007-12-12 2009-06-17 삼성전자주식회사 칩 뒷면 보호 필름, 그 제조 방법 및 이를 이용한 반도체패키지의 제조 방법
KR100982795B1 (ko) * 2008-07-10 2010-09-16 삼성전기주식회사 전자소자 내장형 인쇄회로기판 제조방법
EP2461275A1 (en) * 2010-12-02 2012-06-06 Gemalto SA Security Document and method of manufacturing security document
US9299630B2 (en) * 2012-07-30 2016-03-29 General Electric Company Diffusion barrier for surface mount modules
US10269688B2 (en) 2013-03-14 2019-04-23 General Electric Company Power overlay structure and method of making same

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51130866A (en) * 1975-05-08 1976-11-13 Seiko Instr & Electronics Method of mounting electronic timekeeper circuits
US4143456A (en) * 1976-06-28 1979-03-13 Citizen Watch Commpany Ltd. Semiconductor device insulation method
FR2439478A1 (fr) * 1978-10-19 1980-05-16 Cii Honeywell Bull Boitier plat pour dispositifs a circuits integres
DE3248385A1 (de) * 1982-12-28 1984-06-28 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit integriertem schaltkreis
JPS59138339A (ja) * 1983-01-28 1984-08-08 Toshiba Corp 半導体装置
US4819041A (en) * 1983-12-30 1989-04-04 Amp Incorporated Surface mounted integrated circuit chip package and method for making same
US4916522A (en) * 1988-04-21 1990-04-10 American Telephone And Telegraph Company , At & T Bell Laboratories Integrated circuit package using plastic encapsulant
US5258647A (en) * 1989-07-03 1993-11-02 General Electric Company Electronic systems disposed in a high force environment
FR2651923B1 (fr) * 1989-09-14 1994-06-17 Peugeot Circuit integre de puissance.
JPH03211757A (ja) * 1989-12-21 1991-09-17 General Electric Co <Ge> 気密封じの物体
US5241133A (en) * 1990-12-21 1993-08-31 Motorola, Inc. Leadless pad array chip carrier
US5557142A (en) * 1991-02-04 1996-09-17 Motorola, Inc. Shielded semiconductor device package
US5102829A (en) * 1991-07-22 1992-04-07 At&T Bell Laboratories Plastic pin grid array package
JPH05109922A (ja) * 1991-10-21 1993-04-30 Nec Corp 半導体装置
US5285352A (en) * 1992-07-15 1994-02-08 Motorola, Inc. Pad array semiconductor device with thermal conductor and process for making the same
US5371404A (en) * 1993-02-04 1994-12-06 Motorola, Inc. Thermally conductive integrated circuit package with radio frequency shielding
US5420460A (en) * 1993-08-05 1995-05-30 Vlsi Technology, Inc. Thin cavity down ball grid array package based on wirebond technology
US5455456A (en) * 1993-09-15 1995-10-03 Lsi Logic Corporation Integrated circuit package lid

Also Published As

Publication number Publication date
US5926696A (en) 1999-07-20
CA2134257C (en) 1998-12-15
JP2981141B2 (ja) 1999-11-22
JPH07212002A (ja) 1995-08-11
SG52230A1 (en) 1998-09-28
EP0664562A1 (en) 1995-07-26
CA2134257A1 (en) 1995-07-13
KR950034711A (ko) 1995-12-28

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