|
US6271482B1
(en)
*
|
1994-08-23 |
2001-08-07 |
Thomas & Betts International, Inc. |
Conductive elastomer interconnect
|
|
US5807767A
(en)
|
1996-01-02 |
1998-09-15 |
Micron Technology, Inc. |
Technique for attaching die to leads
|
|
JP3116273B2
(ja)
*
|
1996-04-26 |
2000-12-11 |
日本特殊陶業株式会社 |
中継基板、その製造方法、基板と中継基板と取付基板とからなる構造体、基板と中継基板の接続体
|
|
JP3145331B2
(ja)
*
|
1996-04-26 |
2001-03-12 |
日本特殊陶業株式会社 |
中継基板、その製造方法、基板と中継基板と取付基板とからなる構造体、基板と中継基板の接続体および中継基板と取付基板の接続体の製造方法
|
|
JP3284262B2
(ja)
*
|
1996-09-05 |
2002-05-20 |
セイコーエプソン株式会社 |
液晶表示装置及びそれを用いた電子機器
|
|
US5902438A
(en)
*
|
1997-08-13 |
1999-05-11 |
Fry's Metals, Inc. |
Process for the formation of anisotropic conducting material
|
|
US6172878B1
(en)
*
|
1997-12-27 |
2001-01-09 |
Canon Kabushiki Kaisha |
Multi-element module and production process thereof
|
|
US5975922A
(en)
*
|
1998-03-09 |
1999-11-02 |
Lucent Technologies Inc. |
Device containing directionally conductive composite medium
|
|
JP3876953B2
(ja)
*
|
1998-03-27 |
2007-02-07 |
セイコーエプソン株式会社 |
半導体装置及びその製造方法、回路基板並びに電子機器
|
|
US6194782B1
(en)
*
|
1998-06-24 |
2001-02-27 |
Nortel Networks Limited |
Mechanically-stabilized area-array device package
|
|
US6705876B2
(en)
*
|
1998-07-13 |
2004-03-16 |
Formfactor, Inc. |
Electrical interconnect assemblies and methods
|
|
US6188582B1
(en)
*
|
1998-12-18 |
2001-02-13 |
Geoffrey Peter |
Flexible interconnection between integrated circuit chip and substrate or printed circuit board
|
|
US6345989B1
(en)
*
|
1999-01-06 |
2002-02-12 |
Thomas & Betts International, Inc. |
Circuit board side interconnect
|
|
JP2000207943A
(ja)
*
|
1999-01-11 |
2000-07-28 |
Sony Corp |
異方性導電膜及び異方性導電膜を用いた電気的接続装置
|
|
US6174175B1
(en)
*
|
1999-04-29 |
2001-01-16 |
International Business Machines Corporation |
High density Z-axis connector
|
|
EP1204988A2
(en)
*
|
1999-08-02 |
2002-05-15 |
Gryphics, Inc. |
Controlled compliance fine pitch interconnect
|
|
US6360431B1
(en)
*
|
2000-09-29 |
2002-03-26 |
Intel Corporation |
Processor power delivery system
|
|
US6703566B1
(en)
|
2000-10-25 |
2004-03-09 |
Sae Magnetics (H.K.), Ltd. |
Bonding structure for a hard disk drive suspension using anisotropic conductive film
|
|
US6776859B1
(en)
|
2000-11-27 |
2004-08-17 |
Saturn Electronics & Engineering, Inc. |
Anisotropic bonding system and method using dynamic feedback
|
|
KR100365519B1
(ko)
*
|
2000-12-14 |
2002-12-18 |
삼성에스디아이 주식회사 |
유기 전계발광 디바이스 및 이의 제조 방법
|
|
US6532654B2
(en)
*
|
2001-01-12 |
2003-03-18 |
International Business Machines Corporation |
Method of forming an electrical connector
|
|
US6910897B2
(en)
|
2001-01-12 |
2005-06-28 |
Litton Systems, Inc. |
Interconnection system
|
|
US6979202B2
(en)
*
|
2001-01-12 |
2005-12-27 |
Litton Systems, Inc. |
High-speed electrical connector
|
|
US6843657B2
(en)
*
|
2001-01-12 |
2005-01-18 |
Litton Systems Inc. |
High speed, high density interconnect system for differential and single-ended transmission applications
|
|
US6465084B1
(en)
*
|
2001-04-12 |
2002-10-15 |
International Business Machines Corporation |
Method and structure for producing Z-axis interconnection assembly of printed wiring board elements
|
|
JP3616031B2
(ja)
|
2001-05-10 |
2005-02-02 |
富士通株式会社 |
異方導電性シート、その製造方法、電子装置及び動作試験用検査装置
|
|
US6545226B2
(en)
*
|
2001-05-31 |
2003-04-08 |
International Business Machines Corporation |
Printed wiring board interposer sub-assembly
|
|
KR100793725B1
(ko)
*
|
2001-07-31 |
2008-01-10 |
삼성전자주식회사 |
연성 필름 케이블
|
|
TW531868B
(en)
*
|
2001-08-21 |
2003-05-11 |
Au Optronics Corp |
Soldering type anisotropic conductive film
|
|
US6692264B2
(en)
*
|
2001-11-13 |
2004-02-17 |
General Motors Corporation |
Elastomeric connector for fuel cell stack cell voltage monitor
|
|
US7056129B2
(en)
*
|
2001-11-28 |
2006-06-06 |
Dow Corning Toray Silicone Co., Ltd. |
Anisotropically electroconductive adhesive film, method for the production thereof, and semiconductor devices
|
|
US6799977B2
(en)
*
|
2002-07-11 |
2004-10-05 |
Hewlett-Packard Development Company, L.P. |
Socket having foam metal contacts
|
|
JP2004051755A
(ja)
*
|
2002-07-18 |
2004-02-19 |
Ricoh Co Ltd |
弾性導電樹脂及び弾性導電接合構造
|
|
KR100844627B1
(ko)
*
|
2002-08-27 |
2008-07-07 |
제이에스알 가부시끼가이샤 |
이방 도전성 시트, 그의 제조 방법 및 그의 응용
|
|
ATE447248T1
(de)
*
|
2002-10-24 |
2009-11-15 |
Ibm |
Herstellung eines land grid array mittels elastomerkern und leitender metallhülle oder - gitter
|
|
US6790057B2
(en)
|
2002-12-10 |
2004-09-14 |
Tyco Electronics Corporation |
Conductive elastomeric contact system with anti-overstress columns
|
|
US6796810B2
(en)
|
2002-12-10 |
2004-09-28 |
Tyco Electronics Corporation |
Conductive elastomeric contact system
|
|
CA2522239C
(en)
*
|
2003-03-31 |
2011-01-04 |
Sumitomo Electric Industries, Ltd. |
Anisotropic conductive film and manufacturing method thereof
|
|
DE602004018720D1
(de)
*
|
2003-09-09 |
2009-02-12 |
Nitto Denko Corp |
Anisotrop-leitender Film , Herstellungs- und Gebrauchsverfahren
|
|
DE10343257B4
(de)
*
|
2003-09-17 |
2009-06-10 |
Qimonda Ag |
Verfahren zur Herstellung von Zwischenverbindungen bei Chip-Sandwich-Anordnungen
|
|
US20050082160A1
(en)
*
|
2003-10-15 |
2005-04-21 |
Sharper Image Corporation |
Electro-kinetic air transporter and conditioner devices with a mesh collector electrode
|
|
TW200602645A
(en)
*
|
2004-04-27 |
2006-01-16 |
Jsr Corp |
Method of manufacturing sheetlike probe and its application
|
|
ATE549770T1
(de)
*
|
2004-07-15 |
2012-03-15 |
Jsr Corp |
Untersuchungsgeräte für eine schaltungseinrichtung mit anisotropem leitfähigen verbinder
|
|
JP2006048939A
(ja)
*
|
2004-07-30 |
2006-02-16 |
Jst Mfg Co Ltd |
異方導電性シート
|
|
US7121841B2
(en)
*
|
2004-11-10 |
2006-10-17 |
Intel Corporation |
Electrical socket with compressible domed contacts
|
|
KR20060062824A
(ko)
*
|
2004-12-06 |
2006-06-12 |
주식회사 아이에스시테크놀러지 |
반도체 패키지 테스트용 실리콘 커넥터
|
|
JP2006294527A
(ja)
*
|
2005-04-14 |
2006-10-26 |
Nec Corp |
コネクタ及びその製造方法
|
|
CN1747258A
(zh)
*
|
2005-08-24 |
2006-03-15 |
番禺得意精密电子工业有限公司 |
一种导电元件及使用这种导电元件的电连接器
|
|
EP1965422A4
(en)
*
|
2005-12-22 |
2012-03-07 |
Jsr Corp |
PCB PLATE DEVICE FOR WAFER CHECK, TEST CARD AND WAFER CHECKOUT
|
|
US7453139B2
(en)
*
|
2005-12-27 |
2008-11-18 |
Tessera, Inc. |
Compliant terminal mountings with vented spaces and methods
|
|
US7448883B2
(en)
*
|
2007-02-05 |
2008-11-11 |
Tyco Electronics Corporation |
Connector with metalized coated polymer contact
|
|
JP2008235556A
(ja)
*
|
2007-03-20 |
2008-10-02 |
Sumitomo Electric Ind Ltd |
配線板モジュール及び該配線板モジュールの製造方法
|
|
JP5043617B2
(ja)
*
|
2007-03-27 |
2012-10-10 |
富士フイルム株式会社 |
異方導電性部材およびその製造方法
|
|
US7726976B2
(en)
*
|
2007-11-09 |
2010-06-01 |
Tyco Electronics Corporation |
Shielded electrical interconnect
|
|
CN101726641B
(zh)
*
|
2008-11-03 |
2011-05-18 |
京元电子股份有限公司 |
导电弹性体的制造方法
|
|
KR100930287B1
(ko)
|
2009-02-25 |
2009-12-08 |
넥스디 주식회사 |
커넥터 모듈의 접점부 수리방법
|
|
CN102334239B
(zh)
*
|
2009-03-05 |
2014-06-18 |
保力马科技株式会社 |
弹性连接器以及弹性连接器的制造方法和导通连接器件
|
|
US8098079B2
(en)
|
2009-04-17 |
2012-01-17 |
Oracle America, Inc. |
Receive circuit for connectors with variable complex impedance
|
|
US8476749B2
(en)
|
2009-07-22 |
2013-07-02 |
Oracle America, Inc. |
High-bandwidth ramp-stack chip package
|
|
KR101043956B1
(ko)
*
|
2009-07-31 |
2011-06-24 |
전자부품연구원 |
비등방성 입자배열체 및 그 제조 방법
|
|
CN102208390B
(zh)
*
|
2011-05-19 |
2013-03-06 |
中国科学院微电子研究所 |
一种高密度凸点基板及其制造方法
|
|
CN102866438B
(zh)
*
|
2011-07-06 |
2015-06-03 |
奇景光电股份有限公司 |
湿蚀刻基板的方法
|
|
KR101339166B1
(ko)
*
|
2012-06-18 |
2013-12-09 |
주식회사 아이에스시 |
관통공이 형성된 도전성 입자를 가지는 검사용 소켓 및 그 제조방법
|
|
US9365749B2
(en)
|
2013-05-31 |
2016-06-14 |
Sunray Scientific, Llc |
Anisotropic conductive adhesive with reduced migration
|
|
US9777197B2
(en)
|
2013-10-23 |
2017-10-03 |
Sunray Scientific, Llc |
UV-curable anisotropic conductive adhesive
|
|
IT201700100522A1
(it)
*
|
2017-09-07 |
2019-03-07 |
Technoprobe Spa |
Elemento di interfaccia per un’apparecchiatura di test di dispositivi elettronici e relativo metodo di fabbricazione
|
|
US11482801B2
(en)
*
|
2017-10-19 |
2022-10-25 |
Shin-Etsu Polymer Co., Ltd. |
Electric connector and method for manufacturing the same
|
|
KR102110150B1
(ko)
*
|
2019-01-08 |
2020-06-08 |
(주)티에스이 |
신호 전송 커넥터용 도전부 보호부재 및 그 제조방법과, 이를 갖는 신호 전송 커넥터 및 그 제조방법
|
|
US11191170B2
(en)
*
|
2019-07-23 |
2021-11-30 |
Michael Casey |
Silicone contact element
|
|
JP7226415B2
(ja)
*
|
2020-03-18 |
2023-02-21 |
カシオ計算機株式会社 |
表示装置及び時計
|
|
EP3882721B1
(en)
|
2020-03-18 |
2024-06-05 |
Casio Computer Co., Ltd. |
Display device and timepiece
|
|
CN113035829B
(zh)
*
|
2021-03-04 |
2022-11-25 |
复旦大学 |
Tsv无源转接板及其制造方法
|
|
CN118645867B
(zh)
*
|
2024-07-23 |
2025-09-23 |
广东工业大学 |
一种高压电缆软接头导体的连接方法及高压电缆
|