TW243581B - - Google Patents

Info

Publication number
TW243581B
TW243581B TW082103104A TW82103104A TW243581B TW 243581 B TW243581 B TW 243581B TW 082103104 A TW082103104 A TW 082103104A TW 82103104 A TW82103104 A TW 82103104A TW 243581 B TW243581 B TW 243581B
Authority
TW
Taiwan
Prior art keywords
area
fluid
substrates
impinged
new
Prior art date
Application number
TW082103104A
Other languages
English (en)
Chinese (zh)
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Application granted granted Critical
Publication of TW243581B publication Critical patent/TW243581B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/36—Successively applying liquids or other fluent materials, e.g. without intermediate treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B08B3/022—Cleaning travelling work
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B21/00—Arrangements for supplying or controlling air or other gases for drying solid materials or objects
    • F26B21/50—Ducting arrangements from the source of air or other gases to the materials or objects being dried
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/227—Drying of printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Treatment Of Fiber Materials (AREA)
  • Weting (AREA)
TW082103104A 1992-07-10 1993-04-22 TW243581B (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/911,610 US5289639A (en) 1992-07-10 1992-07-10 Fluid treatment apparatus and method

Publications (1)

Publication Number Publication Date
TW243581B true TW243581B (https=) 1995-03-21

Family

ID=25430560

Family Applications (1)

Application Number Title Priority Date Filing Date
TW082103104A TW243581B (https=) 1992-07-10 1993-04-22

Country Status (12)

Country Link
US (2) US5289639A (https=)
EP (1) EP0578040B1 (https=)
JP (1) JP2677752B2 (https=)
KR (1) KR0124515B1 (https=)
AT (1) ATE164722T1 (https=)
BR (1) BR9302803A (https=)
CA (1) CA2091909C (https=)
DE (1) DE69317703T2 (https=)
ES (1) ES2114973T3 (https=)
MY (1) MY108835A (https=)
SG (1) SG44399A1 (https=)
TW (1) TW243581B (https=)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
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US5483984A (en) * 1992-07-10 1996-01-16 Donlan, Jr.; Fraser P. Fluid treatment apparatus and method
TW406138B (en) * 1994-03-04 2000-09-21 Ibm Apparatus, and corresponding method, for chemically etching substrates
US5669158A (en) * 1994-03-22 1997-09-23 Heidelberger Druckmaschinen Ag Method for cooling a web
US5512335A (en) 1994-06-27 1996-04-30 International Business Machines Corporation Fluid treatment device with vibrational energy means
US5746234A (en) * 1994-11-18 1998-05-05 Advanced Chemill Systems Method and apparatus for cleaning thin substrates
US5720813A (en) * 1995-06-07 1998-02-24 Eamon P. McDonald Thin sheet handling system
US5741361A (en) * 1995-07-06 1998-04-21 Allan H. McKinnon Method for fluid transport
US5614264A (en) * 1995-08-11 1997-03-25 Atotech Usa, Inc. Fluid delivery apparatus and method
US5904773A (en) * 1995-08-11 1999-05-18 Atotech Usa, Inc. Fluid delivery apparatus
US5824157A (en) * 1995-09-06 1998-10-20 International Business Machines Corporation Fluid jet impregnation
JPH09103732A (ja) * 1995-09-06 1997-04-22 Internatl Business Mach Corp <Ibm> 流体供給装置
US5725668A (en) * 1995-09-06 1998-03-10 International Business Machines Corporation Expandable fluid treatment device for tublar surface treatments
CN1104967C (zh) * 1998-05-15 2003-04-09 阿托技术美国公司 液体处理设备和方法
AU746118B2 (en) * 1998-07-10 2002-04-18 Atotech Usa, Inc. Fluid treatment apparatus and method
US6344106B1 (en) * 2000-06-12 2002-02-05 International Business Machines Corporation Apparatus, and corresponding method, for chemically etching substrates
US6991717B2 (en) * 2002-04-05 2006-01-31 3M Innovative Properties Company Web processing method and apparatus
DE10348351B4 (de) * 2003-10-17 2013-05-23 Atotech Deutschland Gmbh Vorrichtung und Verfahren zum Trocknen von Behandlungsgut
US7307022B2 (en) * 2004-11-19 2007-12-11 Endicott Interconnect Technologies, Inc. Method of treating conductive layer for use in a circuitized substrate and method of making said substrate having said conductive layer as part thereof
US7383629B2 (en) * 2004-11-19 2008-06-10 Endicott Interconnect Technologies, Inc. Method of making circuitized substrates utilizing smooth-sided conductive layers as part thereof
US6964884B1 (en) 2004-11-19 2005-11-15 Endicott Interconnect Technologies, Inc. Circuitized substrates utilizing three smooth-sided conductive layers as part thereof, method of making same, and electrical assemblies and information handling systems utilizing same
DE102005017152B4 (de) * 2005-04-13 2007-02-08 Lindauer Dornier Gmbh Verfahren zum Trocknen von vorzugsweise plattenförmigen Produkten und Durchlauftrockner in Mehretagenbauweise
US7169313B2 (en) * 2005-05-13 2007-01-30 Endicott Interconnect Technologies, Inc. Plating method for circuitized substrates
US9206514B2 (en) 2007-01-11 2015-12-08 Peter Philip Andrew Lymn Liquid treatment apparatus
JP4724156B2 (ja) * 2007-06-20 2011-07-13 三井金属鉱業株式会社 電子部品実装用フィルムキャリアテープの搬送装置および電子部品実装用フィルムキャリアテープの搬送方法
KR101341013B1 (ko) * 2008-09-04 2013-12-13 엘지디스플레이 주식회사 세정 장치
KR101296659B1 (ko) * 2008-11-14 2013-08-14 엘지디스플레이 주식회사 세정 장치
JP5474855B2 (ja) * 2011-03-15 2014-04-16 東京エレクトロン株式会社 液処理装置、液処理方法及びその液処理方法を実行させるためのプログラムを記録した記録媒体
US9221081B1 (en) 2011-08-01 2015-12-29 Novellus Systems, Inc. Automated cleaning of wafer plating assembly
US9988734B2 (en) 2011-08-15 2018-06-05 Lam Research Corporation Lipseals and contact elements for semiconductor electroplating apparatuses
US10066311B2 (en) 2011-08-15 2018-09-04 Lam Research Corporation Multi-contact lipseals and associated electroplating methods
US9228270B2 (en) 2011-08-15 2016-01-05 Novellus Systems, Inc. Lipseals and contact elements for semiconductor electroplating apparatuses
JP2013118209A (ja) * 2011-12-01 2013-06-13 Tokyo Ohka Kogyo Co Ltd 基板洗浄装置
KR102112881B1 (ko) * 2012-03-28 2020-05-19 노벨러스 시스템즈, 인코포레이티드 전자도금 기판 홀더들을 세정하기 위한 방법들 및 장치들
TWI609100B (zh) 2012-03-30 2017-12-21 諾發系統有限公司 使用反向電流除鍍以清洗電鍍基板夾持具
US9746427B2 (en) 2013-02-15 2017-08-29 Novellus Systems, Inc. Detection of plating on wafer holding apparatus
US10416092B2 (en) 2013-02-15 2019-09-17 Lam Research Corporation Remote detection of plating on wafer holding apparatus
US10053793B2 (en) 2015-07-09 2018-08-21 Lam Research Corporation Integrated elastomeric lipseal and cup bottom for reducing wafer sticking
CN106369985B (zh) * 2016-10-18 2019-02-22 东莞宇宙电路板设备有限公司 一种风刀组件及干燥装置
CN108413757A (zh) * 2018-03-14 2018-08-17 权锐无损检测工程装备制造（上海）有限公司 一种新型盲孔零件清洗后去残留水装置
JP7500778B2 (ja) * 2020-12-24 2024-06-17 株式会社東芝 絶縁性回路基板およびそれを用いた半導体装置

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Publication number Priority date Publication date Assignee Title
US3734109A (en) * 1971-03-08 1973-05-22 P Hebner Spray cleaning system
DE2611132A1 (de) * 1976-03-17 1977-09-29 Buckbee Mears Co Spruehvorrichtung
FR2355697A1 (fr) * 1976-06-25 1978-01-20 Bertin & Cie Procede pour etancher l'intervalle entre une paroi et une surface en regard, dispositifs de mise en oeuvre du procede et applications
US4174261A (en) * 1976-07-16 1979-11-13 Pellegrino Peter P Apparatus for electroplating, deplating or etching
US4202073A (en) * 1978-07-25 1980-05-13 Research Technology Inc. Moisture stripping device for film cleaning apparatus
US4270317A (en) * 1978-10-10 1981-06-02 Midland-Ross Corporation Apparatus used in the treatment of a continuous strip of metal and method of use thereof
JPS57130580A (en) * 1981-02-06 1982-08-13 Hitachi Ltd Precise washing drying device
JPS5943750U (ja) * 1982-09-14 1984-03-22 大同特殊鋼株式会社 中空カムシヤフト
JPS609129A (ja) * 1983-06-29 1985-01-18 Fujitsu Ltd ウエツト処理装置
DE3528575A1 (de) * 1985-08-06 1987-02-19 Schering Ag Verfahren und einrichtung zur reinigung, aktivierung und/oder metallisierung von bohrloechern in horizontal gefuehrten leiterplatten
JPS62119651A (ja) * 1985-11-20 1987-05-30 Fujitsu Ltd Ｒａｓ回路診断方式
US4938257A (en) * 1986-11-21 1990-07-03 Teledyne Industries, Inc. Printed circuit cleaning apparatus
US4854004A (en) * 1987-12-28 1989-08-08 Orc Manufacturing Co., Ltd. Device for clearing the hole blockage of a liquid resist substrate
JPH0237234A (ja) * 1988-07-26 1990-02-07 Matsushita Electric Ind Co Ltd 一体形空気調和機の本体固定兼アース装置
US5063951A (en) * 1990-07-19 1991-11-12 International Business Machines Corporation Fluid treatment device
US5201132A (en) * 1991-04-26 1993-04-13 Busch Co. Strip cooling, heating or drying apparatus and associated method

Also Published As

Publication number Publication date
MY108835A (en) 1996-11-30
EP0578040A2 (en) 1994-01-12
CA2091909C (en) 1996-02-06
KR940003437A (ko) 1994-02-21
JP2677752B2 (ja) 1997-11-17
EP0578040A3 (en) 1994-06-01
ES2114973T3 (es) 1998-06-16
US5444925A (en) 1995-08-29
CA2091909A1 (en) 1994-01-11
EP0578040B1 (en) 1998-04-01
SG44399A1 (en) 1997-12-19
DE69317703D1 (de) 1998-05-07
DE69317703T2 (de) 1998-10-29
US5289639A (en) 1994-03-01
KR0124515B1 (en) 1997-12-04
JPH0671232A (ja) 1994-03-15
ATE164722T1 (de) 1998-04-15
BR9302803A (pt) 1994-02-16

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Legal Events

Date Code Title Description
MK4A Expiration of patent term of an invention patent