DE69317703D1 - Vorrichtung und Verfahren zur Behandlung mit Flüssigkeit - Google Patents
Vorrichtung und Verfahren zur Behandlung mit FlüssigkeitInfo
- Publication number
- DE69317703D1 DE69317703D1 DE69317703T DE69317703T DE69317703D1 DE 69317703 D1 DE69317703 D1 DE 69317703D1 DE 69317703 T DE69317703 T DE 69317703T DE 69317703 T DE69317703 T DE 69317703T DE 69317703 D1 DE69317703 D1 DE 69317703D1
- Authority
- DE
- Germany
- Prior art keywords
- area
- fluid
- substrates
- impinged
- new
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/36—Successively applying liquids or other fluent materials, e.g. without intermediate treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/022—Cleaning travelling work
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
- F26B21/004—Nozzle assemblies; Air knives; Air distributors; Blow boxes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/227—Drying of printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Treatment Of Fiber Materials (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Weting (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/911,610 US5289639A (en) | 1992-07-10 | 1992-07-10 | Fluid treatment apparatus and method |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69317703D1 true DE69317703D1 (de) | 1998-05-07 |
DE69317703T2 DE69317703T2 (de) | 1998-10-29 |
Family
ID=25430560
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69317703T Expired - Lifetime DE69317703T2 (de) | 1992-07-10 | 1993-06-21 | Vorrichtung und Verfahren zur Behandlung mit Flüssigkeit |
Country Status (12)
Country | Link |
---|---|
US (2) | US5289639A (de) |
EP (1) | EP0578040B1 (de) |
JP (1) | JP2677752B2 (de) |
KR (1) | KR0124515B1 (de) |
AT (1) | ATE164722T1 (de) |
BR (1) | BR9302803A (de) |
CA (1) | CA2091909C (de) |
DE (1) | DE69317703T2 (de) |
ES (1) | ES2114973T3 (de) |
MY (1) | MY108835A (de) |
SG (1) | SG44399A1 (de) |
TW (1) | TW243581B (de) |
Families Citing this family (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5483984A (en) * | 1992-07-10 | 1996-01-16 | Donlan, Jr.; Fraser P. | Fluid treatment apparatus and method |
TW406138B (en) * | 1994-03-04 | 2000-09-21 | Ibm | Apparatus, and corresponding method, for chemically etching substrates |
US5669158A (en) * | 1994-03-22 | 1997-09-23 | Heidelberger Druckmaschinen Ag | Method for cooling a web |
US5512335A (en) | 1994-06-27 | 1996-04-30 | International Business Machines Corporation | Fluid treatment device with vibrational energy means |
US5746234A (en) | 1994-11-18 | 1998-05-05 | Advanced Chemill Systems | Method and apparatus for cleaning thin substrates |
US5720813A (en) | 1995-06-07 | 1998-02-24 | Eamon P. McDonald | Thin sheet handling system |
US5741361A (en) * | 1995-07-06 | 1998-04-21 | Allan H. McKinnon | Method for fluid transport |
US5614264A (en) * | 1995-08-11 | 1997-03-25 | Atotech Usa, Inc. | Fluid delivery apparatus and method |
US5904773A (en) * | 1995-08-11 | 1999-05-18 | Atotech Usa, Inc. | Fluid delivery apparatus |
US5824157A (en) * | 1995-09-06 | 1998-10-20 | International Business Machines Corporation | Fluid jet impregnation |
US5725668A (en) * | 1995-09-06 | 1998-03-10 | International Business Machines Corporation | Expandable fluid treatment device for tublar surface treatments |
JPH09103732A (ja) * | 1995-09-06 | 1997-04-22 | Internatl Business Mach Corp <Ibm> | 流体供給装置 |
CN1104967C (zh) * | 1998-05-15 | 2003-04-09 | 阿托技术美国公司 | 液体处理设备和方法 |
AU746118B2 (en) * | 1998-07-10 | 2002-04-18 | Atotech Usa, Inc. | Fluid treatment apparatus and method |
US6344106B1 (en) * | 2000-06-12 | 2002-02-05 | International Business Machines Corporation | Apparatus, and corresponding method, for chemically etching substrates |
US6991717B2 (en) * | 2002-04-05 | 2006-01-31 | 3M Innovative Properties Company | Web processing method and apparatus |
DE10348351B4 (de) * | 2003-10-17 | 2013-05-23 | Atotech Deutschland Gmbh | Vorrichtung und Verfahren zum Trocknen von Behandlungsgut |
US7383629B2 (en) * | 2004-11-19 | 2008-06-10 | Endicott Interconnect Technologies, Inc. | Method of making circuitized substrates utilizing smooth-sided conductive layers as part thereof |
US7307022B2 (en) * | 2004-11-19 | 2007-12-11 | Endicott Interconnect Technologies, Inc. | Method of treating conductive layer for use in a circuitized substrate and method of making said substrate having said conductive layer as part thereof |
US6964884B1 (en) | 2004-11-19 | 2005-11-15 | Endicott Interconnect Technologies, Inc. | Circuitized substrates utilizing three smooth-sided conductive layers as part thereof, method of making same, and electrical assemblies and information handling systems utilizing same |
DE102005017152B4 (de) * | 2005-04-13 | 2007-02-08 | Lindauer Dornier Gmbh | Verfahren zum Trocknen von vorzugsweise plattenförmigen Produkten und Durchlauftrockner in Mehretagenbauweise |
US7169313B2 (en) * | 2005-05-13 | 2007-01-30 | Endicott Interconnect Technologies, Inc. | Plating method for circuitized substrates |
GB2459055B (en) * | 2007-01-11 | 2012-05-23 | Peter Philip Andrew Lymn | Liquid treatment apparatus |
JP4724156B2 (ja) * | 2007-06-20 | 2011-07-13 | 三井金属鉱業株式会社 | 電子部品実装用フィルムキャリアテープの搬送装置および電子部品実装用フィルムキャリアテープの搬送方法 |
KR101341013B1 (ko) * | 2008-09-04 | 2013-12-13 | 엘지디스플레이 주식회사 | 세정 장치 |
KR101296659B1 (ko) * | 2008-11-14 | 2013-08-14 | 엘지디스플레이 주식회사 | 세정 장치 |
JP5474855B2 (ja) * | 2011-03-15 | 2014-04-16 | 東京エレクトロン株式会社 | 液処理装置、液処理方法及びその液処理方法を実行させるためのプログラムを記録した記録媒体 |
US9221081B1 (en) | 2011-08-01 | 2015-12-29 | Novellus Systems, Inc. | Automated cleaning of wafer plating assembly |
US10066311B2 (en) | 2011-08-15 | 2018-09-04 | Lam Research Corporation | Multi-contact lipseals and associated electroplating methods |
US9228270B2 (en) | 2011-08-15 | 2016-01-05 | Novellus Systems, Inc. | Lipseals and contact elements for semiconductor electroplating apparatuses |
US9988734B2 (en) | 2011-08-15 | 2018-06-05 | Lam Research Corporation | Lipseals and contact elements for semiconductor electroplating apparatuses |
JP2013118209A (ja) * | 2011-12-01 | 2013-06-13 | Tokyo Ohka Kogyo Co Ltd | 基板洗浄装置 |
KR102112881B1 (ko) * | 2012-03-28 | 2020-05-19 | 노벨러스 시스템즈, 인코포레이티드 | 전자도금 기판 홀더들을 세정하기 위한 방법들 및 장치들 |
TWI609100B (zh) | 2012-03-30 | 2017-12-21 | 諾發系統有限公司 | 使用反向電流除鍍以清洗電鍍基板夾持具 |
US9746427B2 (en) | 2013-02-15 | 2017-08-29 | Novellus Systems, Inc. | Detection of plating on wafer holding apparatus |
US10416092B2 (en) | 2013-02-15 | 2019-09-17 | Lam Research Corporation | Remote detection of plating on wafer holding apparatus |
US10053793B2 (en) | 2015-07-09 | 2018-08-21 | Lam Research Corporation | Integrated elastomeric lipseal and cup bottom for reducing wafer sticking |
CN106369985B (zh) * | 2016-10-18 | 2019-02-22 | 东莞宇宙电路板设备有限公司 | 一种风刀组件及干燥装置 |
CN108413757A (zh) * | 2018-03-14 | 2018-08-17 | 权锐无损检测工程装备制造(上海)有限公司 | 一种新型盲孔零件清洗后去残留水装置 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3734109A (en) * | 1971-03-08 | 1973-05-22 | P Hebner | Spray cleaning system |
DE2611132A1 (de) * | 1976-03-17 | 1977-09-29 | Buckbee Mears Co | Spruehvorrichtung |
FR2355697A1 (fr) * | 1976-06-25 | 1978-01-20 | Bertin & Cie | Procede pour etancher l'intervalle entre une paroi et une surface en regard, dispositifs de mise en oeuvre du procede et applications |
US4174261A (en) * | 1976-07-16 | 1979-11-13 | Pellegrino Peter P | Apparatus for electroplating, deplating or etching |
US4202073A (en) * | 1978-07-25 | 1980-05-13 | Research Technology Inc. | Moisture stripping device for film cleaning apparatus |
US4270317A (en) * | 1978-10-10 | 1981-06-02 | Midland-Ross Corporation | Apparatus used in the treatment of a continuous strip of metal and method of use thereof |
JPS57130580A (en) * | 1981-02-06 | 1982-08-13 | Hitachi Ltd | Precise washing drying device |
JPS5943750U (ja) * | 1982-09-14 | 1984-03-22 | 大同特殊鋼株式会社 | 中空カムシヤフト |
JPS609129A (ja) * | 1983-06-29 | 1985-01-18 | Fujitsu Ltd | ウエツト処理装置 |
DE3528575A1 (de) * | 1985-08-06 | 1987-02-19 | Schering Ag | Verfahren und einrichtung zur reinigung, aktivierung und/oder metallisierung von bohrloechern in horizontal gefuehrten leiterplatten |
JPS62119651A (ja) * | 1985-11-20 | 1987-05-30 | Fujitsu Ltd | Ras回路診断方式 |
US4938257A (en) * | 1986-11-21 | 1990-07-03 | Teledyne Industries, Inc. | Printed circuit cleaning apparatus |
US4854004A (en) * | 1987-12-28 | 1989-08-08 | Orc Manufacturing Co., Ltd. | Device for clearing the hole blockage of a liquid resist substrate |
JPH0237234A (ja) * | 1988-07-26 | 1990-02-07 | Matsushita Electric Ind Co Ltd | 一体形空気調和機の本体固定兼アース装置 |
US5063951A (en) * | 1990-07-19 | 1991-11-12 | International Business Machines Corporation | Fluid treatment device |
US5201132A (en) * | 1991-04-26 | 1993-04-13 | Busch Co. | Strip cooling, heating or drying apparatus and associated method |
-
1992
- 1992-07-10 US US07/911,610 patent/US5289639A/en not_active Expired - Lifetime
-
1993
- 1993-03-18 CA CA002091909A patent/CA2091909C/en not_active Expired - Fee Related
- 1993-04-22 TW TW082103104A patent/TW243581B/zh not_active IP Right Cessation
- 1993-05-31 JP JP5128828A patent/JP2677752B2/ja not_active Expired - Fee Related
- 1993-06-10 MY MYPI93001141A patent/MY108835A/en unknown
- 1993-06-21 ES ES93109877T patent/ES2114973T3/es not_active Expired - Lifetime
- 1993-06-21 EP EP93109877A patent/EP0578040B1/de not_active Expired - Lifetime
- 1993-06-21 DE DE69317703T patent/DE69317703T2/de not_active Expired - Lifetime
- 1993-06-21 SG SG1996000148A patent/SG44399A1/en unknown
- 1993-06-21 AT AT93109877T patent/ATE164722T1/de not_active IP Right Cessation
- 1993-06-29 KR KR93011956A patent/KR0124515B1/ko not_active IP Right Cessation
- 1993-07-08 BR BR9302803A patent/BR9302803A/pt not_active Application Discontinuation
- 1993-12-09 US US08/164,502 patent/US5444925A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
CA2091909A1 (en) | 1994-01-11 |
BR9302803A (pt) | 1994-02-16 |
EP0578040B1 (de) | 1998-04-01 |
EP0578040A3 (en) | 1994-06-01 |
CA2091909C (en) | 1996-02-06 |
DE69317703T2 (de) | 1998-10-29 |
EP0578040A2 (de) | 1994-01-12 |
KR940003437A (ko) | 1994-02-21 |
ATE164722T1 (de) | 1998-04-15 |
JPH0671232A (ja) | 1994-03-15 |
SG44399A1 (en) | 1997-12-19 |
TW243581B (de) | 1995-03-21 |
JP2677752B2 (ja) | 1997-11-17 |
US5289639A (en) | 1994-03-01 |
US5444925A (en) | 1995-08-29 |
MY108835A (en) | 1996-11-30 |
ES2114973T3 (es) | 1998-06-16 |
KR0124515B1 (en) | 1997-12-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8320 | Willingness to grant licences declared (paragraph 23) | ||
8328 | Change in the person/name/address of the agent |
Representative=s name: DUSCHER, R., DIPL.-PHYS. DR.RER.NAT., PAT.-ANW., 7 |