GB9321900D0 - Method and apparatus for the treatment of semiconductor substrates - Google Patents
Method and apparatus for the treatment of semiconductor substratesInfo
- Publication number
- GB9321900D0 GB9321900D0 GB939321900A GB9321900A GB9321900D0 GB 9321900 D0 GB9321900 D0 GB 9321900D0 GB 939321900 A GB939321900 A GB 939321900A GB 9321900 A GB9321900 A GB 9321900A GB 9321900 D0 GB9321900 D0 GB 9321900D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- treatment
- semiconductor substrates
- substrates
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/31051—Planarisation of the insulating layers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02118—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB939321900A GB9321900D0 (en) | 1993-10-23 | 1993-10-23 | Method and apparatus for the treatment of semiconductor substrates |
PCT/GB1994/002326 WO1995011521A1 (en) | 1993-10-23 | 1994-10-21 | Method and apparatus for the planarization of layers on semiconductor substrates |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB939321900A GB9321900D0 (en) | 1993-10-23 | 1993-10-23 | Method and apparatus for the treatment of semiconductor substrates |
Publications (1)
Publication Number | Publication Date |
---|---|
GB9321900D0 true GB9321900D0 (en) | 1993-12-15 |
Family
ID=10744021
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB939321900A Pending GB9321900D0 (en) | 1993-10-23 | 1993-10-23 | Method and apparatus for the treatment of semiconductor substrates |
Country Status (2)
Country | Link |
---|---|
GB (1) | GB9321900D0 (en) |
WO (1) | WO1995011521A1 (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5434107A (en) * | 1994-01-28 | 1995-07-18 | Texas Instruments Incorporated | Method for planarization |
DE69515140T2 (en) * | 1994-05-18 | 2000-08-31 | At & T Corp., New York | Planarization in the creation of arrangements |
US5932045A (en) * | 1997-06-02 | 1999-08-03 | Lucent Technologies Inc. | Method for fabricating a multilayer optical article |
US6589889B2 (en) | 1999-09-09 | 2003-07-08 | Alliedsignal Inc. | Contact planarization using nanoporous silica materials |
CN1387676A (en) * | 1999-09-09 | 2002-12-25 | 联合讯号公司 | Improved apparatus and method for integrated circuit planarization |
TW513736B (en) * | 2001-05-04 | 2002-12-11 | Chartered Semiconductor Mfg | Thermal mechanical planarization in integrated circuits |
US6721076B2 (en) | 2001-08-03 | 2004-04-13 | Inphase Technologies, Inc. | System and method for reflective holographic storage with associated multiplexing techniques |
US7112359B2 (en) | 2001-08-22 | 2006-09-26 | Inphase Technologies, Inc. | Method and apparatus for multilayer optical articles |
US7001541B2 (en) | 2001-09-14 | 2006-02-21 | Inphase Technologies, Inc. | Method for forming multiply patterned optical articles |
US6825960B2 (en) | 2002-01-15 | 2004-11-30 | Inphase Technologies, Inc. | System and method for bitwise readout holographic ROM |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54134407A (en) * | 1978-04-10 | 1979-10-18 | Tdk Corp | Smoothening device for magnetic recording medium |
JPS6245045A (en) * | 1985-08-22 | 1987-02-27 | Nec Corp | Manufacture of semiconductor device |
JPH02125436A (en) * | 1988-11-04 | 1990-05-14 | Nec Kagoshima Ltd | Die bonding device |
JPH05337438A (en) * | 1992-06-03 | 1993-12-21 | Sekisui Chem Co Ltd | Formation of coating film on porous body |
JPH0691223A (en) * | 1992-09-09 | 1994-04-05 | Toshiba Corp | Method for smoothing resin film |
-
1993
- 1993-10-23 GB GB939321900A patent/GB9321900D0/en active Pending
-
1994
- 1994-10-21 WO PCT/GB1994/002326 patent/WO1995011521A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO1995011521A1 (en) | 1995-04-27 |
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