GB9321900D0 - Method and apparatus for the treatment of semiconductor substrates - Google Patents

Method and apparatus for the treatment of semiconductor substrates

Info

Publication number
GB9321900D0
GB9321900D0 GB939321900A GB9321900A GB9321900D0 GB 9321900 D0 GB9321900 D0 GB 9321900D0 GB 939321900 A GB939321900 A GB 939321900A GB 9321900 A GB9321900 A GB 9321900A GB 9321900 D0 GB9321900 D0 GB 9321900D0
Authority
GB
United Kingdom
Prior art keywords
treatment
semiconductor substrates
substrates
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
GB939321900A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DOBSON CHRISTOPHER D
Original Assignee
DOBSON CHRISTOPHER D
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DOBSON CHRISTOPHER D filed Critical DOBSON CHRISTOPHER D
Priority to GB939321900A priority Critical patent/GB9321900D0/en
Publication of GB9321900D0 publication Critical patent/GB9321900D0/en
Priority to PCT/GB1994/002326 priority patent/WO1995011521A1/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105After-treatment
    • H01L21/31051Planarisation of the insulating layers
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16Coating processes; Apparatus therefor
    • G03F7/168Finishing the coated layer, e.g. drying, baking, soaking
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02107Forming insulating materials on a substrate
    • H01L21/02109Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02118Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
GB939321900A 1993-10-23 1993-10-23 Method and apparatus for the treatment of semiconductor substrates Pending GB9321900D0 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB939321900A GB9321900D0 (en) 1993-10-23 1993-10-23 Method and apparatus for the treatment of semiconductor substrates
PCT/GB1994/002326 WO1995011521A1 (en) 1993-10-23 1994-10-21 Method and apparatus for the planarization of layers on semiconductor substrates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB939321900A GB9321900D0 (en) 1993-10-23 1993-10-23 Method and apparatus for the treatment of semiconductor substrates

Publications (1)

Publication Number Publication Date
GB9321900D0 true GB9321900D0 (en) 1993-12-15

Family

ID=10744021

Family Applications (1)

Application Number Title Priority Date Filing Date
GB939321900A Pending GB9321900D0 (en) 1993-10-23 1993-10-23 Method and apparatus for the treatment of semiconductor substrates

Country Status (2)

Country Link
GB (1) GB9321900D0 (en)
WO (1) WO1995011521A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5434107A (en) * 1994-01-28 1995-07-18 Texas Instruments Incorporated Method for planarization
DE69515140T2 (en) * 1994-05-18 2000-08-31 At & T Corp., New York Planarization in the creation of arrangements
US5932045A (en) * 1997-06-02 1999-08-03 Lucent Technologies Inc. Method for fabricating a multilayer optical article
US6589889B2 (en) 1999-09-09 2003-07-08 Alliedsignal Inc. Contact planarization using nanoporous silica materials
CN1387676A (en) * 1999-09-09 2002-12-25 联合讯号公司 Improved apparatus and method for integrated circuit planarization
TW513736B (en) * 2001-05-04 2002-12-11 Chartered Semiconductor Mfg Thermal mechanical planarization in integrated circuits
US6721076B2 (en) 2001-08-03 2004-04-13 Inphase Technologies, Inc. System and method for reflective holographic storage with associated multiplexing techniques
US7112359B2 (en) 2001-08-22 2006-09-26 Inphase Technologies, Inc. Method and apparatus for multilayer optical articles
US7001541B2 (en) 2001-09-14 2006-02-21 Inphase Technologies, Inc. Method for forming multiply patterned optical articles
US6825960B2 (en) 2002-01-15 2004-11-30 Inphase Technologies, Inc. System and method for bitwise readout holographic ROM

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54134407A (en) * 1978-04-10 1979-10-18 Tdk Corp Smoothening device for magnetic recording medium
JPS6245045A (en) * 1985-08-22 1987-02-27 Nec Corp Manufacture of semiconductor device
JPH02125436A (en) * 1988-11-04 1990-05-14 Nec Kagoshima Ltd Die bonding device
JPH05337438A (en) * 1992-06-03 1993-12-21 Sekisui Chem Co Ltd Formation of coating film on porous body
JPH0691223A (en) * 1992-09-09 1994-04-05 Toshiba Corp Method for smoothing resin film

Also Published As

Publication number Publication date
WO1995011521A1 (en) 1995-04-27

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