TW202444827A - 硬化性組成物、密封劑、框密封劑、顯示面板及其製造方法 - Google Patents

硬化性組成物、密封劑、框密封劑、顯示面板及其製造方法 Download PDF

Info

Publication number
TW202444827A
TW202444827A TW113111520A TW113111520A TW202444827A TW 202444827 A TW202444827 A TW 202444827A TW 113111520 A TW113111520 A TW 113111520A TW 113111520 A TW113111520 A TW 113111520A TW 202444827 A TW202444827 A TW 202444827A
Authority
TW
Taiwan
Prior art keywords
sealant
mass
curable composition
meth
compound
Prior art date
Application number
TW113111520A
Other languages
English (en)
Chinese (zh)
Inventor
永田桂
大塚健祐
Original Assignee
日商三井化學股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商三井化學股份有限公司 filed Critical 日商三井化學股份有限公司
Publication of TW202444827A publication Critical patent/TW202444827A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3432—Six-membered rings
    • C08K5/3435—Piperidines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Epoxy Resins (AREA)
  • Sealing Material Composition (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW113111520A 2023-03-29 2024-03-27 硬化性組成物、密封劑、框密封劑、顯示面板及其製造方法 TW202444827A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023054123 2023-03-29
JP2023-054123 2023-03-29

Publications (1)

Publication Number Publication Date
TW202444827A true TW202444827A (zh) 2024-11-16

Family

ID=92905524

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113111520A TW202444827A (zh) 2023-03-29 2024-03-27 硬化性組成物、密封劑、框密封劑、顯示面板及其製造方法

Country Status (4)

Country Link
JP (1) JPWO2024204252A1 (https=)
CN (1) CN120858127A (https=)
TW (1) TW202444827A (https=)
WO (1) WO2024204252A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004099775A (ja) * 2002-09-10 2004-04-02 Fuji Photo Film Co Ltd セルロースアシレートフィルム、並びに該フィルムを用いた光学フィルム、液晶表示装置及びハロゲン化銀写真感光材料
JP2006160802A (ja) * 2004-12-03 2006-06-22 Mitsubishi Chemicals Corp 耐汚染性付与剤、硬化物および物品
CN114008163A (zh) * 2019-07-05 2022-02-01 三井化学株式会社 有机el显示元件用密封剂及有机el显示装置
CN110885619A (zh) * 2019-12-12 2020-03-17 上海华谊精细化工有限公司 一种辐照固化抗污卷材涂料及其制备方法
TW202323357A (zh) * 2021-09-14 2023-06-16 德商漢高智慧財產控股公司 光學透明的uv與熱固化環氧樹脂組合物
JPWO2023153387A1 (https=) * 2022-02-08 2023-08-17
JP2024052308A (ja) * 2022-09-30 2024-04-11 住友ベークライト株式会社 光学シート

Also Published As

Publication number Publication date
JPWO2024204252A1 (https=) 2024-10-03
WO2024204252A1 (ja) 2024-10-03
CN120858127A (zh) 2025-10-28

Similar Documents

Publication Publication Date Title
JP5639476B2 (ja) 有機ｅｌ素子の面封止剤、表示装置の製造方法および表示装置
JP5986987B2 (ja) 液晶シール剤、それを用いた液晶表示パネルの製造方法、および液晶表示パネル
CN105026493B (zh) 热固性组合物、有机el元件用面密封剂及其固化物
TWI609915B (zh) 組成物、硬化物、顯示裝置及其製造方法
KR101920581B1 (ko) 유기 el 소자용 면 밀봉재 및 그 경화물
CN113454182B (zh) 有机el显示元件用密封剂
JP2008059945A (ja) 電子デバイスの製造方法
JP2018095679A (ja) シート状シール材、表示素子シール材、有機ｅｌ素子用面封止材、有機ｅｌデバイス、および有機ｅｌデバイスの製造方法
TWI717470B (zh) 液晶密封劑及其硬化物以及液晶顯示面板及其製造方法
JP2013157205A (ja) 有機エレクトロルミネッセンス表示素子用封止剤
KR20230133373A (ko) 광경화성 수지 조성물, 액정 실링제, 및 이것을 이용한 액정 표시 패널 및 그 제조 방법
JP2013018810A (ja) 硬化性樹脂組成物
KR102019660B1 (ko) 광경화성 수지 조성물, 표시 소자 실링제, 액정 표시 소자 실링제, 및 액정 표시 패널과 그의 제조 방법
TW202444827A (zh) 硬化性組成物、密封劑、框密封劑、顯示面板及其製造方法
CN113166371B (zh) 有机el显示元件用密封剂
TW202438600A (zh) 硬化性組成物、密封劑、框密封劑、顯示面板及其製造方法
TW202428666A (zh) 樹脂組成物、液晶密封劑、以及液晶顯示面板及其製造方法
TW202330765A (zh) 硬化性樹脂組成物、塗覆層、及膜
TW202502874A (zh) 硬化性樹脂組成物及led元件用接著劑
WO2024005071A1 (ja) エネルギー線硬化型フィルム状透明接着剤、これを含むデバイス及び該デバイスの製造方法
CN117242112A (zh) 固化性树脂组合物、显示元件用密封剂、有机el显示元件用密封剂、光学粘接剂以及光学构件
TW202348767A (zh) 有機ｅｌ用顯示元件用密封材、有機ｅｌ顯示裝置及有機ｅｌ顯示裝置之製造方法
JP2024139180A (ja) 封止用樹脂組成物及び有機ｅｌ表示素子用封止剤
CN120677433A (zh) 液晶密封剂以及使用其的液晶显示面板及其制造方法
CN118901039A (zh) 液晶密封剂、液晶显示面板的制造方法及液晶显示面板