CN120858127A - 固化性组合物、密封剂、框密封剂、显示面板及其制造方法 - Google Patents

固化性组合物、密封剂、框密封剂、显示面板及其制造方法

Info

Publication number
CN120858127A
CN120858127A CN202480021152.1A CN202480021152A CN120858127A CN 120858127 A CN120858127 A CN 120858127A CN 202480021152 A CN202480021152 A CN 202480021152A CN 120858127 A CN120858127 A CN 120858127A
Authority
CN
China
Prior art keywords
sealant
curable composition
mass
compound
meth
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202480021152.1A
Other languages
English (en)
Chinese (zh)
Inventor
永田桂
大塚健祐
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Chemicals Inc
Original Assignee
Mitsui Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Chemicals Inc filed Critical Mitsui Chemicals Inc
Publication of CN120858127A publication Critical patent/CN120858127A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3432—Six-membered rings
    • C08K5/3435—Piperidines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Epoxy Resins (AREA)
  • Sealing Material Composition (AREA)
  • Adhesives Or Adhesive Processes (AREA)
CN202480021152.1A 2023-03-29 2024-03-26 固化性组合物、密封剂、框密封剂、显示面板及其制造方法 Pending CN120858127A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023054123 2023-03-29
JP2023-054123 2023-03-29
PCT/JP2024/012051 WO2024204252A1 (ja) 2023-03-29 2024-03-26 硬化性組成物、封止剤、枠封止剤、表示パネル及びその製造方法

Publications (1)

Publication Number Publication Date
CN120858127A true CN120858127A (zh) 2025-10-28

Family

ID=92905524

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202480021152.1A Pending CN120858127A (zh) 2023-03-29 2024-03-26 固化性组合物、密封剂、框密封剂、显示面板及其制造方法

Country Status (4)

Country Link
JP (1) JPWO2024204252A1 (https=)
CN (1) CN120858127A (https=)
TW (1) TW202444827A (https=)
WO (1) WO2024204252A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004099775A (ja) * 2002-09-10 2004-04-02 Fuji Photo Film Co Ltd セルロースアシレートフィルム、並びに該フィルムを用いた光学フィルム、液晶表示装置及びハロゲン化銀写真感光材料
JP2006160802A (ja) * 2004-12-03 2006-06-22 Mitsubishi Chemicals Corp 耐汚染性付与剤、硬化物および物品
CN114008163A (zh) * 2019-07-05 2022-02-01 三井化学株式会社 有机el显示元件用密封剂及有机el显示装置
CN110885619A (zh) * 2019-12-12 2020-03-17 上海华谊精细化工有限公司 一种辐照固化抗污卷材涂料及其制备方法
TW202323357A (zh) * 2021-09-14 2023-06-16 德商漢高智慧財產控股公司 光學透明的uv與熱固化環氧樹脂組合物
JPWO2023153387A1 (https=) * 2022-02-08 2023-08-17
JP2024052308A (ja) * 2022-09-30 2024-04-11 住友ベークライト株式会社 光学シート

Also Published As

Publication number Publication date
JPWO2024204252A1 (https=) 2024-10-03
WO2024204252A1 (ja) 2024-10-03
TW202444827A (zh) 2024-11-16

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