TW202443643A - 基板處理裝置及基板處理方法 - Google Patents

基板處理裝置及基板處理方法 Download PDF

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Publication number
TW202443643A
TW202443643A TW113109940A TW113109940A TW202443643A TW 202443643 A TW202443643 A TW 202443643A TW 113109940 A TW113109940 A TW 113109940A TW 113109940 A TW113109940 A TW 113109940A TW 202443643 A TW202443643 A TW 202443643A
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TW
Taiwan
Prior art keywords
substrate
processing liquid
aforementioned
processing
liquid supply
Prior art date
Application number
TW113109940A
Other languages
English (en)
Chinese (zh)
Inventor
岩本康信
藤井寛之
Original Assignee
日商東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商東京威力科創股份有限公司 filed Critical 日商東京威力科創股份有限公司
Publication of TW202443643A publication Critical patent/TW202443643A/zh

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Weting (AREA)
TW113109940A 2023-03-30 2024-03-18 基板處理裝置及基板處理方法 TW202443643A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023055445 2023-03-30
JP2023-055445 2023-03-30

Publications (1)

Publication Number Publication Date
TW202443643A true TW202443643A (zh) 2024-11-01

Family

ID=92906148

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113109940A TW202443643A (zh) 2023-03-30 2024-03-18 基板處理裝置及基板處理方法

Country Status (5)

Country Link
JP (1) JPWO2024203602A1 (https=)
KR (1) KR20250170639A (https=)
CN (1) CN120917542A (https=)
TW (1) TW202443643A (https=)
WO (1) WO2024203602A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017098367A (ja) * 2015-11-20 2017-06-01 東京エレクトロン株式会社 基板処理方法
KR102791311B1 (ko) * 2016-08-12 2025-04-04 인프리아 코포레이션 금속 함유 레지스트로부터의 에지 비드 영역의 금속 잔류물 저감방법
JP7024307B2 (ja) 2017-01-26 2022-02-24 東京エレクトロン株式会社 塗布膜除去装置、塗布膜除去方法及び記憶媒体
JP2020013823A (ja) * 2018-07-13 2020-01-23 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6688860B2 (ja) * 2018-10-24 2020-04-28 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体

Also Published As

Publication number Publication date
WO2024203602A1 (ja) 2024-10-03
KR20250170639A (ko) 2025-12-05
JPWO2024203602A1 (https=) 2024-10-03
CN120917542A (zh) 2025-11-07

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