CN120917542A - 基片处理装置和基片处理方法 - Google Patents
基片处理装置和基片处理方法Info
- Publication number
- CN120917542A CN120917542A CN202480020816.2A CN202480020816A CN120917542A CN 120917542 A CN120917542 A CN 120917542A CN 202480020816 A CN202480020816 A CN 202480020816A CN 120917542 A CN120917542 A CN 120917542A
- Authority
- CN
- China
- Prior art keywords
- substrate
- treatment liquid
- processing
- liquid
- liquid supply
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
- B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Weting (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023055445 | 2023-03-30 | ||
| JP2023-055445 | 2023-03-30 | ||
| PCT/JP2024/010712 WO2024203602A1 (ja) | 2023-03-30 | 2024-03-19 | 基板処理装置及び基板処理方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN120917542A true CN120917542A (zh) | 2025-11-07 |
Family
ID=92906148
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202480020816.2A Pending CN120917542A (zh) | 2023-03-30 | 2024-03-19 | 基片处理装置和基片处理方法 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2024203602A1 (https=) |
| KR (1) | KR20250170639A (https=) |
| CN (1) | CN120917542A (https=) |
| TW (1) | TW202443643A (https=) |
| WO (1) | WO2024203602A1 (https=) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017098367A (ja) * | 2015-11-20 | 2017-06-01 | 東京エレクトロン株式会社 | 基板処理方法 |
| KR102791311B1 (ko) * | 2016-08-12 | 2025-04-04 | 인프리아 코포레이션 | 금속 함유 레지스트로부터의 에지 비드 영역의 금속 잔류물 저감방법 |
| JP7024307B2 (ja) | 2017-01-26 | 2022-02-24 | 東京エレクトロン株式会社 | 塗布膜除去装置、塗布膜除去方法及び記憶媒体 |
| JP2020013823A (ja) * | 2018-07-13 | 2020-01-23 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
| JP6688860B2 (ja) * | 2018-10-24 | 2020-04-28 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法及び記憶媒体 |
-
2024
- 2024-03-18 TW TW113109940A patent/TW202443643A/zh unknown
- 2024-03-19 CN CN202480020816.2A patent/CN120917542A/zh active Pending
- 2024-03-19 WO PCT/JP2024/010712 patent/WO2024203602A1/ja not_active Ceased
- 2024-03-19 JP JP2025510575A patent/JPWO2024203602A1/ja active Pending
- 2024-03-19 KR KR1020257036295A patent/KR20250170639A/ko active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| TW202443643A (zh) | 2024-11-01 |
| WO2024203602A1 (ja) | 2024-10-03 |
| KR20250170639A (ko) | 2025-12-05 |
| JPWO2024203602A1 (https=) | 2024-10-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102358941B1 (ko) | 액 처리 방법, 기억 매체 및 액 처리 장치 | |
| JP7073658B2 (ja) | 基板処理方法、基板処理装置、及び記憶媒体 | |
| US11806743B2 (en) | Spin dispenser module substrate surface protection system | |
| KR101962542B1 (ko) | 기판 처리 장치 | |
| TW201921480A (zh) | 基板處理裝置、基板處理方法及記憶媒體 | |
| KR20140139969A (ko) | 기판 세정 장치, 기판 세정 방법 및 비일시적인 기억 매체 | |
| TWI584366B (zh) | A substrate processing apparatus and a substrate processing method and a computer-readable recording medium for recording a substrate processing program | |
| CN114100967B (zh) | 基板处理方法和基板处理装置 | |
| KR102714523B1 (ko) | 기판 처리 방법, 기억 매체 및 현상 장치 | |
| CN107230653A (zh) | 基板处理装置、基板处理方法以及存储介质 | |
| JP2022189496A (ja) | 基板処理方法および基板処理装置 | |
| CN112786484B (zh) | 基片处理方法和基片处理装置 | |
| CN117321738A (zh) | 半导体晶片的清洗装置、半导体晶片的清洗方法及硅晶片的制造方法 | |
| JP6481644B2 (ja) | 基板処理方法、基板処理装置及び記憶媒体 | |
| CN120917542A (zh) | 基片处理装置和基片处理方法 | |
| KR102881228B1 (ko) | 현상 처리 장치 및 현상 처리 방법 | |
| JP7202960B2 (ja) | 塗布膜形成方法及び塗布膜形成装置 | |
| JP7445021B2 (ja) | 塗布処理装置、塗布処理方法及びコンピュータ記憶媒体 | |
| TW202531358A (zh) | 基板處理方法及基板處理裝置 | |
| KR100840127B1 (ko) | 웨이퍼 백사이드 세정시스템 및 이를 이용한 웨이퍼백사이드 세정방법 | |
| US20250239469A1 (en) | Protective film forming method, protective film forming apparatus, and substrate treatment system | |
| JP2025112257A (ja) | 保護膜形成方法、保護膜形成装置及び基板処理システム | |
| WO2026038499A1 (ja) | 基板処理装置及び基板処理方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |