KR20250170639A - 기판 처리 장치 및 기판 처리 방법 - Google Patents
기판 처리 장치 및 기판 처리 방법Info
- Publication number
- KR20250170639A KR20250170639A KR1020257036295A KR20257036295A KR20250170639A KR 20250170639 A KR20250170639 A KR 20250170639A KR 1020257036295 A KR1020257036295 A KR 1020257036295A KR 20257036295 A KR20257036295 A KR 20257036295A KR 20250170639 A KR20250170639 A KR 20250170639A
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- processing liquid
- treatment
- processing
- paragraph
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
- B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Weting (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023055445 | 2023-03-30 | ||
| JPJP-P-2023-055445 | 2023-03-30 | ||
| PCT/JP2024/010712 WO2024203602A1 (ja) | 2023-03-30 | 2024-03-19 | 基板処理装置及び基板処理方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20250170639A true KR20250170639A (ko) | 2025-12-05 |
Family
ID=92906148
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020257036295A Pending KR20250170639A (ko) | 2023-03-30 | 2024-03-19 | 기판 처리 장치 및 기판 처리 방법 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2024203602A1 (https=) |
| KR (1) | KR20250170639A (https=) |
| CN (1) | CN120917542A (https=) |
| TW (1) | TW202443643A (https=) |
| WO (1) | WO2024203602A1 (https=) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018121045A (ja) | 2017-01-26 | 2018-08-02 | 東京エレクトロン株式会社 | 塗布膜除去装置、塗布膜除去方法及び記憶媒体 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017098367A (ja) * | 2015-11-20 | 2017-06-01 | 東京エレクトロン株式会社 | 基板処理方法 |
| KR102791311B1 (ko) * | 2016-08-12 | 2025-04-04 | 인프리아 코포레이션 | 금속 함유 레지스트로부터의 에지 비드 영역의 금속 잔류물 저감방법 |
| JP2020013823A (ja) * | 2018-07-13 | 2020-01-23 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
| JP6688860B2 (ja) * | 2018-10-24 | 2020-04-28 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法及び記憶媒体 |
-
2024
- 2024-03-18 TW TW113109940A patent/TW202443643A/zh unknown
- 2024-03-19 CN CN202480020816.2A patent/CN120917542A/zh active Pending
- 2024-03-19 WO PCT/JP2024/010712 patent/WO2024203602A1/ja not_active Ceased
- 2024-03-19 JP JP2025510575A patent/JPWO2024203602A1/ja active Pending
- 2024-03-19 KR KR1020257036295A patent/KR20250170639A/ko active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018121045A (ja) | 2017-01-26 | 2018-08-02 | 東京エレクトロン株式会社 | 塗布膜除去装置、塗布膜除去方法及び記憶媒体 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202443643A (zh) | 2024-11-01 |
| WO2024203602A1 (ja) | 2024-10-03 |
| JPWO2024203602A1 (https=) | 2024-10-03 |
| CN120917542A (zh) | 2025-11-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102358941B1 (ko) | 액 처리 방법, 기억 매체 및 액 처리 장치 | |
| US9805958B2 (en) | Substrate cleaning apparatus, substrate cleaning method and non-transitory storage medium | |
| JP6102807B2 (ja) | 基板洗浄装置、基板洗浄方法及び記憶媒体 | |
| TWI797159B (zh) | 基板處理方法、基板處理裝置及記錄媒體 | |
| KR101962542B1 (ko) | 기판 처리 장치 | |
| KR102714523B1 (ko) | 기판 처리 방법, 기억 매체 및 현상 장치 | |
| KR102903524B1 (ko) | 현상 처리 방법 및 현상 처리 장치 | |
| TW202213457A (zh) | 基板處理方法及基板處理裝置 | |
| TWI601187B (zh) | 基板洗淨乾燥方法及基板顯影方法 | |
| TW201629641A (zh) | 顯影方法 | |
| TWI849104B (zh) | 基板處理方法及基板處理裝置 | |
| KR20250170639A (ko) | 기판 처리 장치 및 기판 처리 방법 | |
| KR20210053222A (ko) | 기판 처리 방법 및 기판 처리 장치 | |
| JP7202960B2 (ja) | 塗布膜形成方法及び塗布膜形成装置 | |
| WO2017195549A1 (ja) | 塗布膜形成装置、塗布膜形成方法及び記憶媒体 | |
| TW201802875A (zh) | 顯影方法、顯影裝置及記錄媒體 | |
| KR20250113339A (ko) | 보호막 형성 방법, 보호막 형성 장치 및 기판 처리 시스템 | |
| WO2025079441A1 (ja) | 基板処理方法及び基板処理装置 | |
| WO2026038499A1 (ja) | 基板処理装置及び基板処理方法 | |
| JP7445021B2 (ja) | 塗布処理装置、塗布処理方法及びコンピュータ記憶媒体 | |
| JP2025112257A (ja) | 保護膜形成方法、保護膜形成装置及び基板処理システム |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
|
| E13 | Pre-grant limitation requested |
Free format text: ST27 STATUS EVENT CODE: A-2-3-E10-E13-LIM-X000 (AS PROVIDED BY THE NATIONAL OFFICE) |
|
| E13-X000 | Pre-grant limitation requested |
St.27 status event code: A-2-3-E10-E13-lim-X000 |
|
| P11 | Amendment of application requested |
Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P11-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE) |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13 | Application amended |
Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P13-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE) |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| Q12 | Application published |
Free format text: ST27 STATUS EVENT CODE: A-1-1-Q10-Q12-NAP-PG1501 (AS PROVIDED BY THE NATIONAL OFFICE) |